Patents for H05K 1 - Printed circuits (98,583)
08/2006
08/09/2006CN1814912A Fanglun paper and its preparing method
08/09/2006CN1269389C Method and apparatus for providing substrate with viscous medium and use of jetting means for correction of application errors
08/09/2006CN1269388C Flexible distributing board
08/09/2006CN1269384C Ceramic heater
08/09/2006CN1269262C Installation socket connector of printing circuit board
08/09/2006CN1269200C 集成电路器件和布线板 IC devices and wiring board
08/09/2006CN1269089C Mark for visual detection and electronic instrument
08/09/2006CN1268957C Photoelectric assembling line module, production and assemblies thereof
08/09/2006CN1268664C Resin composition, composition for solder resist, and cured article obtained therefrom
08/09/2006CA2535757A1 Package or pre-applied foamable underfill for lead-free process
08/08/2006US7089160 Model for modifying drill data to predict hole locations in a panel structure
08/08/2006US7089032 Radio transmitting/receiving device
08/08/2006US7088926 Electro-optical connector module
08/08/2006US7088711 High-speed router backplane
08/08/2006US7088592 ESD protection structure and device utilizing the same
08/08/2006US7088591 Printed circuit board and method for installing printed circuit board onto electro-conductive housing
08/08/2006US7088568 Method for manufacture of multilayer ceramic substrate and multilayer ceramic substrate
08/08/2006US7088211 Space saving surface-mounted inductors
08/08/2006US7088199 Method and stiffener-embedded waveguide structure for implementing enhanced data transfer
08/08/2006US7088008 Electronic package with optimized circuitization pattern
08/08/2006US7088003 Structures and methods for integration of ultralow-k dielectrics with improved reliability
08/08/2006US7088002 Interconnect
08/08/2006US7087987 Tape circuit substrate and semiconductor chip package using the same
08/08/2006US7087982 Nitrogen-containing polymers as porogens in the preparation of highly porous, low dielectric constant materials
08/08/2006US7087846 Pinned electronic package with strengthened conductive pad
08/08/2006US7087845 Metal core multilayer printed wiring board
08/08/2006US7087844 Wiring circuit board
08/08/2006US7087664 Resin film and multilayer printed wiring board using thereof
08/08/2006US7087467 Lead frame and production process thereof and production process of thermally conductive substrate
08/08/2006US7087460 Methods for assembly and packaging of flip chip configured dice with interposer
08/08/2006US7087357 Photoreactive resin composition, method for making circuit substrate using same, and method for making ceramic multilayer substrate using same
08/08/2006US7087341 Metal-air battery components and methods for making same
08/08/2006US7087296 Energy absorbent laminate
08/08/2006US7087293 Thick film dielectric compositions for use on aluminum nitride substrates
08/08/2006US7087126 Mounting apparatus and mounting method
08/08/2006US7086913 Surface mount header assembly having a planar alignment surface
08/08/2006US7086872 Two piece surface mount header assembly having a contact alignment member
08/08/2006US7086871 Bent wafer and PCB assembly for refrigerator provided with the same
08/08/2006US7086868 Board-to-board connector
08/08/2006US7086788 Optical sub-assembly for opto-electronic modules
08/08/2006US7086786 Ceramic optical sub-assembly for opto-electronic module utilizing LTCC (low-temperature co-fired ceramic) technology
08/08/2006US7086754 Light reflector and barrier for light emitting diodes
08/08/2006US7086291 Overstress indication
08/08/2006US7086149 Method of making a contact structure with a distinctly formed tip structure
08/08/2006US7086147 Method of accommodating in volume expansion during solder reflow
08/08/2006CA2220246C Composite materials
08/03/2006WO2006080301A1 Three-dimensional wiring body for mounting electronic component and electronic component mounting structure
08/03/2006WO2006080298A1 Three-dimensional wiring body for mounting electronic component and electronic component mounting structure
08/03/2006WO2006080247A1 Conductive paste
08/03/2006WO2006080119A1 Polyimide compound and flexible wiring board
08/03/2006WO2006017998A3 Wiring substrate of a semiconductor component comprising external contact pads for external contacts and method for producing the same
08/03/2006WO2005101493A3 Improved bonding arrangement and method for ltcc circuitry
08/03/2006US20060172878 Low temperature sintering ceramic composition for high frequency, method of fabriacting the same and electronic component
08/03/2006US20060172588 Flexible flat cable assembly and electronic device utilizing the same
08/03/2006US20060172573 Electronic component pin connectors
08/03/2006US20060172570 Surface-mount connector
08/03/2006US20060172569 Automatically marking and reading/distinguishing apparatus and method of use
08/03/2006US20060172567 Semiconductor device
08/03/2006US20060172566 Circuit board
08/03/2006US20060172562 Electrical connector with contact shielding module
08/03/2006US20060172460 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
08/03/2006US20060171130 Semiconductor module
08/03/2006US20060170668 Monitor circuit board
08/03/2006US20060169488 Circuit board mounted with surface mount type circuit component and method for producing the same
08/03/2006US20060169486 Wired circuit board assembly
08/03/2006US20060169485 Rigid-flex wiring board
08/03/2006US20060169484 Printed wiring board
08/03/2006US20060169248 Electric parts attaching structure and attaching method for throttle body, and throttle body
08/03/2006US20060168803 Layered board and manufacturing method of the same, electronic apparatus having the layered board
08/03/2006DE19951754B4 Strahlungsrauschen-Unterdrückungs-Komponentenstruktur Radiation noise suppression component structure
08/03/2006DE102005006856B3 Behind-the-ear mounted removable hearing aid, has signal processing unit adjustable via operator element
08/03/2006DE102005003448A1 System component for e.g. drive control unit, of motor vehicle, has low temperature co-fired ceramic cover arranged above low temperature co-fired ceramic and bond wires such that ceramic is enclosed by base, cover and printed circuit board
08/03/2006DE10103084B4 Halbleitermodul und Verfahren zu seiner Herstellung Semiconductor module and method for its preparation
08/02/2006EP1686679A1 Overcurrent protection for solid state switching system
08/02/2006EP1686647A1 Mobile communication terminal
08/02/2006EP1685411A1 Non-rigid conductor link measurement sensor and method for the production thereof
08/02/2006EP1685178A1 Curable polyester having an oxetanyl group at end and process for preparing the same, resist composition, jet printing ink composition, curing methods and uses thereof
08/02/2006EP1597945B1 Method for electrically contacting a component to a flat cable
08/02/2006EP1434750B1 Thick film conductor compositions for use on aluminum nitride substrates
08/02/2006EP1053580B1 An improved connector scheme for a power pod power delivery system
08/02/2006EP0807368B1 Upgradeable voltage regulator modules
08/02/2006CN2802912Y Device with vibration and incoming induction function
08/02/2006CN2802902Y Obverse and reverse arrangement structure of flexible circuit board
08/02/2006CN1813502A Integrated electromechanical arrangement and method of production
08/02/2006CN1813501A Method for transmission of signals in a circuit board and a circuit board
08/02/2006CN1813343A Organic polymers, electronic devices, and methods
08/02/2006CN1813307A Improved method for adding flexiable circuit assembly of magnetic head stack assembly to actuator arm
08/02/2006CN1812883A Multilayer body and method for producing same
08/02/2006CN1812693A Dual bus interface circuit board components and assemble method thereof
08/02/2006CN1812692A Print substrate with tab terminal, electronic equipment and method of manufacture the same
08/02/2006CN1812691A Multi-component ltcc substrate with a core of high dielectric constant ceramic material and processes for the development thereof
08/02/2006CN1812690A Antielectrostatic discharging one-layer or multilayer printed circuit board and circuit selecting method thereof
08/02/2006CN1812689A Multilayer circuit board and manufacturing method thereof
08/02/2006CN1812039A Green sheet and method of manufacturing the same, and a method of manufacturing a plasma display panel
08/02/2006CN1811565A Back light module and light source structure thereof
08/02/2006CN1811564A Liquid crystal display device
08/02/2006CN1268191C Portable apparatus
08/02/2006CN1268185C Metal foil laminate and method for making same
08/02/2006CN1268180C Circuit substrate and manufacture thereof
08/02/2006CN1268179C Test seat interface circuit board