Patents for H05K 1 - Printed circuits (98,583)
05/2008
05/15/2008WO2008057598A2 Alternating via fanout patterns
05/15/2008WO2008055751A2 Electronic housing using novel flexible printed circuit board technology
05/15/2008WO2008055746A2 Electrical connector element
05/15/2008WO2008055708A2 Microelectronic subassembly, and method for the production thereof
05/15/2008WO2007086961A3 Circuit board having a multi-signal via
05/15/2008US20080113530 Electronic unit and assembling method thereof
05/15/2008US20080113257 Membrane electrode assemblies for use in fuel cells
05/15/2008US20080113176 Curable polyvinyl benzyl compound and process for producing the same
05/15/2008US20080113168 Material for substrate mounting optical circuit-electrical circuit mixedly and substrate mounting optical circuit-electrical circuit mixedly
05/15/2008US20080112149 High density integrated circuit apparatus, test probe and methods of use thereof
05/15/2008US20080112148 High density integrated circuit apparatus, test probe and methods of use thereof
05/15/2008US20080112147 High density integrated circuit apparatus, test probe and methods of use thereof
05/15/2008US20080112146 High density integrated circuit apparatus, test probe and methods of use thereof
05/15/2008US20080112145 High density integrated circuit apparatus, test probe and methods of use thereof
05/15/2008US20080112144 High density integrated circuit apparatus, test probe and methods of use thereof
05/15/2008US20080112142 Memory module comprising memory devices
05/15/2008US20080112139 Power converter package and thermal management
05/15/2008US20080112136 Circuit board adapted to fan and fan structure
05/15/2008US20080112132 Electric Power Module
05/15/2008US20080112131 Current sensing temperature control circuit and methods for maintaining operating temperatures within information handling systems
05/15/2008US20080112110 Method of Making Thin-Film Capacitors on Metal Foil Using Thick Top Electrodes
05/15/2008US20080111942 Liquid crystal display module and an assembly method therefor
05/15/2008US20080111866 Nozzle arrangement with a top wall portion having etchant holes therein
05/15/2008US20080111254 Pattern film, method of manufacturing the pattern film, and printed circuit board and semiconductor package having the pattern film
05/15/2008US20080111230 Wiring film having wire, semiconductor package including the wiring film, and method of fabricating the semiconductor package
05/15/2008US20080111225 Semiconductor device package
05/15/2008US20080110669 Printed circuit board having embedded resistors and method of manufacturing the same
05/15/2008US20080110668 Telecommunication connector PCB layout
05/15/2008US20080110667 Printed circuit board with embedded capacitors therein and manufacturing process thereof
05/15/2008US20080110666 Flexible printed board
05/15/2008US20080110665 Method for Connecting Printed Circuit Board
05/15/2008US20080110021 Component-embedded board fabrication method and apparatus for high-precision and easy fabrication of component-embedded board with electronic components embedded in wiring board
05/15/2008US20080110017 Wiring substrate, method of manufacturing wiring substrate, and electronic apparatus
05/15/2008US20080110016 Method of making circuitized substrate with solder paste connections
05/15/2008DE202008001968U1 Anordnungssystem Assembly system
05/15/2008DE102007033718A1 Platine und Verfahren zu ihrer Herstellung Board and process for its preparation
05/15/2008DE102006053853A1 Cooling body arrangement for e.g. integrated switching circuit, has frame with integrated spring unit, which pre-stresses cooling body on printed circuit board in contact surface-normal, where spring unit is designed as leaf spring
05/15/2008DE102006053461A1 Mikroelektronische Baugruppe und Verfahren zum Herstellen einer mikroelektronischen Baugruppe A microelectronic assembly and method of making a microelectronic assembly
05/15/2008DE102006053151A1 Memory module i.e. very low profile memory module, for use in motherboard, has sets of passive components arranged between memory device and connecting surfaces, where device is arranged on main surface of printed circuit board
05/15/2008DE102006052872A1 Elektrisches Leistungsmodul Electrical power module
05/15/2008DE102006052706A1 Drahtbeschriebene Leiterplatte Described wire circuit board
05/15/2008DE10129760B4 Schaltungsträger mit Fiducial sowie Verfahren zu dessen Herstellung und Verfahren zur Qualitätsprüfung Circuit carrier with fiducial and to processes for its preparation and procedures for auditing
05/14/2008EP1921908A2 Circuit assembly with a power module that is combined with a circuit board
05/14/2008EP1921907A2 Plasma display device with partly rigid and partly flexible connection between the display panel and the circuit board
05/14/2008EP1921903A2 Electric power module
05/14/2008EP1921902A2 Printed wiring board and method for manufacturing the same
05/14/2008EP1921641A1 Method of making thin-film capacitors on metal foil using thick top electrodes
05/14/2008EP1921473A1 Optical waveguide film, method for manufacturing the film, optoelectrical hybrid film including the waveguide film, and electronic device
05/14/2008EP1919984A2 Fluoropolymer-glass fabric for circuit substrates
05/14/2008EP1714530B1 Method for increasing a routing density for a circuit board and such a circuit board
05/14/2008EP1475398B1 Indole resins, epoxy resins and resin compositions containing the same
05/14/2008EP1360171B1 Novolak cyanate-based prepolymer compositions
05/14/2008EP1011139B1 Printed wiring board and method for manufacturing the same
05/14/2008CN201060951Y Contact connecting structure between antenna and PCB board and equipment using the structure
05/14/2008CN201060950Y Contact connecting structure between antenna and PCB board and equipment using the structure
05/14/2008CN201060949Y Contact connecting structure between antenna and PCB board and equipment using the structure
05/14/2008CN201060348Y LCD luminophor
05/14/2008CN101180925A Printed wiring board
05/14/2008CN101180924A 电感器 Inductor
05/14/2008CN101179900A Circuit with a power module that is combined with a circuit board
05/14/2008CN101179899A Aluminum cooling substrates with electric insulation property and method for making the same
05/14/2008CN101179898A Complementary mirror-image type concealed plane resistor structure
05/14/2008CN101178864A 等离子体显示装置 The plasma display apparatus
05/14/2008CN101178523A Electro-optical device, method of manufacturing electro-optical device, and electronic apparatus
05/14/2008CN101178461A Photoelectric substrates
05/14/2008CN100388555C Microstrip line
05/14/2008CN100388512C Surface-mountable miniature light-emitting diode and/or photodiode and method for the production thereof
05/14/2008CN100388469C 电路装置及其制造方法 Circuit device and manufacturing method thereof
05/14/2008CN100388468C Holder and mask structure, interconnected circuit structure and its manufacturing method
05/14/2008CN100388467C Semiconductor package and producing method thereof and semiconductor device
05/14/2008CN100388449C Substrate having a plurality of bumps, method of forming the same, and method of bonding substrate to another
05/14/2008CN100387642C Impregnated glass fiber strands and products including same
05/14/2008CN100387547C Method for producing laminated dielectric
05/14/2008CN100387378C Electric contactor and alloy for electrode, preparing method thereof
05/13/2008US7373184 Portable radio communication apparatus and connection member
05/13/2008US7373083 Camera incorporating a releasable print roll unit
05/13/2008US7373068 Connecting a component with an embedded optical fiber
05/13/2008US7372942 Medical imaging system with dosimetry for estimating circuit board life
05/13/2008US7372555 Method of fabrication of semiconductor integrated circuit device
05/13/2008US7372292 Signal transmitting device suited to fast signal transmission
05/13/2008US7372261 Printed circuit board integrated with a two-axis fluxgate sensor and method for manufacturing the same
05/13/2008US7372176 Bulkhead flatwire integration units
05/13/2008US7372149 High frequency semiconductor apparatus, transmitting apparatus and receiving apparatus
05/13/2008US7372144 High speed electronics interconnect and method of manufacture
05/13/2008US7372143 Printed circuit board including via contributing to superior characteristic impedance
05/13/2008US7372141 Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides
05/13/2008US7372139 Semiconductor chip package
05/13/2008US7372138 Routing element for use in multi-chip modules, multi-chip modules including the routing element and methods
05/13/2008US7372132 Resin encapsulated semiconductor device and the production method
05/13/2008US7372131 Routing element for use in semiconductor device assemblies
05/13/2008US7372006 Low cost heating devices manufactured from conductive loaded resin-based materials
05/13/2008US7371976 Printed wiring board and method for manufacturing the same
05/13/2008US7371975 Electronic packages and components thereof formed by substrate-imprinting
05/13/2008US7371974 Multilayer printed wiring board
05/13/2008US7371973 Contact node
05/13/2008US7371971 Wired circuit board and producing method thereof
05/13/2008US7371970 Rigid-flex circuit board system
05/13/2008US7371609 Stacked module systems and methods
05/13/2008US7371471 Electromagnetic noise suppressing thin film
05/13/2008US7371452 use in transmitted display devices such as liquid crystal displays; polymer layer containing a plurality of integral polymer conduit channels that contain at least two layers with at least one comprising a conductive material and the other serving a function beyond protection, such as guide light waves