Patents for H05K 1 - Printed circuits (98,583)
10/2011
10/05/2011CN102206415A Resin composition, and prepreg, laminate and circuit board containing the composition
10/05/2011CN102206397A Resin composition as well as semi-solidified rubber sheet, laminating board and circuit board containing same
10/05/2011CN102206352A Method for producing liquid-crystalline polyster powder
10/05/2011CN101699938B Circuit board processing method and circuit board
10/05/2011CN101690423B Metal base circuit board
10/05/2011CN101657070B Method for forming the printed wiring board
10/05/2011CN101616535B Wiring board and wiring board manufacturing method
10/05/2011CN101496169B Electric power converter
10/05/2011CN101409239B Method for manufacturing wiring plate
10/05/2011CN101232996B Flexible metal-clad laminate plate
10/05/2011CN101155467B Producing method of wired circuit board
10/05/2011CN101145136B Processor memory array having memory macros and its protecting method
10/04/2011US8032801 High spread highly randomized generatable interleavers
10/04/2011US8031475 Integrated circuit package system with flexible substrate and mounded package
10/04/2011US8031474 Printed circuit board assembly and method of manufacturing the same
10/04/2011US8031150 Liquid crystal display panel with signal transmission patterns
10/04/2011US8030580 Printed wiring board and electronic apparatus including same
10/04/2011US8030579 Multilayer printed wiring board
10/04/2011US8030578 Electronic component and substrate unit
10/04/2011US8030577 Printed wiring board and method for producing the same
10/04/2011US8030576 Wired circuit board with interposed metal thin film and producing method thereof
10/04/2011US8030575 Mounting structure providing electrical surge protection
10/04/2011US8030574 Flexible printed circuit
10/04/2011US8029911 Adhesive for circuit connection, circuit connection method using the same, and circuit connected structure
10/04/2011US8029701 Mixed conductive powder and use thereof
10/04/2011US8028452 Enhanced patch panel indicia system
10/04/2011US8028407 Method of manufacturing substrates with feedthrough electrodes for inkjet heads and method of manufacturing inkjet heads
10/04/2011US8028404 Multi-function module
10/04/2011US8028403 Method for forming laminated multiple substrates
09/2011
09/29/2011WO2011118584A1 Epoxy resin composition for prepreg, prepreg, and multilayer printed circuit board
09/29/2011WO2011118539A1 Liquid composition and metal-based circuit board
09/29/2011WO2011118444A1 Electronic control device
09/29/2011WO2011118352A1 Mounting board heat dissipating laminate
09/29/2011WO2011118315A1 Electroconductive crosslinked product, process for producing same, and transducer, flexible wiring board and electromagnetic-wave shield made by using same
09/29/2011WO2011118307A1 Production method for substrate with built-in capacitor and production method for element sheets that can be used in aforementioned production method
09/29/2011WO2011118300A1 Electronic component, conductive paste, and method for manufacturing an electronic component
09/29/2011WO2011118128A1 Circuit board, semiconductor device, manufacturing method for circuit board, and manufacturing method for semiconductor device
09/29/2011WO2011118072A1 Circuit board
09/29/2011WO2011117515A1 Packaging for a cosmetic product comprising a hollow body having a localized coating-free pattern in a portion of a layer of a laser-removable coating
09/29/2011WO2011117053A1 Front end module and method of operation in different circuit environments
09/29/2011US20110237091 Circuit board for an electrical connector assembly
09/29/2011US20110235348 Structure for connecting connector, and head lamp light source lighting device using the structure
09/29/2011US20110235299 Stacked Electronic Components, Method and Apparatus for Aligning Electronic Components
09/29/2011US20110235298 Wiring substrate and method of manufacturing the wiring substrate
09/29/2011US20110235286 Display panel module and display apparatus
09/29/2011US20110235284 Circuit board
09/29/2011US20110232955 Circuit board having improved ground vias
09/29/2011US20110232954 Method of Patterning an Electronig of Photonic Material
09/29/2011US20110232953 Circuit board and structure using the same
09/29/2011US20110232952 Method of attaching die to circuit board with an intermediate interposer
09/29/2011US20110232951 Multilayer wiring substrate
09/29/2011US20110232950 Substrate and method for manufacturing the same
09/29/2011US20110232949 Printed Wiring Board Manufacturing Method and Printed Wiring Board
09/29/2011US20110232948 Printed wiring board and method for manufacturing printed wiring board
09/29/2011US20110232947 Structure of bridging electrode
09/29/2011US20110232946 Flexible Printed Board
09/29/2011US20110232945 Transparent conductive films, articles, and methods
09/29/2011US20110232944 Liquid crystalline thermoset oligomer or polymer and thermosetting composition and substrate including the same
09/29/2011US20110232943 Multilayer wiring board
09/29/2011US20110232942 Multi-layer wiring board and method of manufacturing multi-layer wiring board
09/29/2011US20110232941 Differential signal cable, and cable assembly and multi-pair differential signal cable using the same
09/28/2011EP2369904A1 Electronic module with lateral contacts, device comprising same and method for manufacturing such a module
09/28/2011EP2369903A1 Substrate for light-emitting element and light-emitting device
09/28/2011EP2369223A2 Light-emitting device and illumination device
09/28/2011EP2368414A1 Modular electrical card for power components
09/28/2011EP2368000A1 Exterior door handle, particularly for vehicles, and method for the production thereof
09/28/2011EP2059100B1 Flexible wiring board
09/28/2011EP2012258B1 Article provided with electromagnetically coupled module
09/28/2011DE202010014408U1 Baugruppe mit wenigstens einer UHF-Dipol-Antenne Assembly having at least one UHF-dipole antenna
09/28/2011CN201995212U 一种装有led灯的电路板 One kind of circuit board is equipped with led lights
09/28/2011CN201995211U 无线网卡 Wireless network cards
09/28/2011CN201995210U 一种用于线路板带氧化膜的铝基板 A circuit board with aluminum plate for the oxide film
09/28/2011CN201995209U 多层软性线路板分层区结构的改良 Improved multi-layer flexible circuit boards layered zone structure
09/28/2011CN201995208U 多层软性线路板结构的改良 Improved multi-layer flexible circuit board structure
09/28/2011CN201995207U 带撕手的柔性线路板 Hand with tear flexible circuit boards
09/28/2011CN201995206U 带定位线的插接式柔性线路板 Plug-in flexible circuit boards with locating lines
09/28/2011CN201995205U 一种加强性柔性线路板 A way of strengthening of the flexible circuit board
09/28/2011CN201995204U 圆弧角防撕裂柔性线路板 Arc angle ripstop flexible circuit boards
09/28/2011CN201995203U 带铆钉的柔性线路板 Flexible circuit boards with rivets
09/28/2011CN201995202U Pcb电路板 Pcb board
09/28/2011CN201995201U 印制板 PCB
09/28/2011CN201995200U Pcb板 Pcb board
09/28/2011CN201995199U 软性电路板弯折结构 Folding the flexible circuit board structure
09/28/2011CN201995198U 新型led电路板 The new led board
09/28/2011CN201995197U Printed plate component noise control device
09/28/2011CN201994278U Laminated substrate with inductance used for chip package
09/28/2011CN201993555U 一种液晶显示模组 A liquid crystal display module
09/28/2011CN102204421A Multilayer wiring substrate and method for producing same
09/28/2011CN102204418A Method for integrating an electronic component into a printed circuit board
09/28/2011CN102204417A 卡和连接装置 Card and connecting devices
09/28/2011CN102204025A Plug connector for circuit boards
09/28/2011CN102203504A Method for producing a flexible light strip
09/28/2011CN102202470A Multilayer circuit board and making method
09/28/2011CN102202463A Side edge packaged type PCB (printed circuit board)
09/28/2011CN102202462A Printing wiring board and method for manufacturing the same
09/28/2011CN102202461A Wiring substrate and method of manufacturing the same
09/28/2011CN102202460A Circuit board
09/28/2011CN102202459A PCB (printed circuit board) with metal micro radiator
09/28/2011CN102202458A Flexible printed circuit board with reinforced plate and manufacture method thereof
09/28/2011CN102201390A Chip on film (COF) packaging substrate for high-pixel camera module and manufacturing method thereof