Patents for H05K 1 - Printed circuits (98,583)
07/2012
07/26/2012US20120188730 Insulating sheet, circuit board, and process for production of insulating sheet
07/26/2012US20120188729 Printed circuit board and manufacturing method thereof
07/26/2012US20120188728 Compliant insert for electronics assemblies
07/26/2012US20120187950 Printed circuit board with integrated shielding
07/26/2012US20120187825 Lighting Device and Attachment Board of Lighting Device
07/26/2012US20120187821 Electrical conductor and a production method therefor
07/26/2012US20120187581 Semiconductor device and wiring board
07/26/2012US20120187554 Power semiconductor device, printed wiring board, and mechanism for connecting the power semiconductor device and the printed wiring board
07/26/2012US20120187399 Substrate for flexible device, thin film transistor substrate for flexible device, flexible device, substrate for thin film element, thin film element, thin film transistor, method for manufacturing substrate for thin film element, method for manufacturing thin film element, and method for manufacturing thin film transistor
07/26/2012US20120186868 Printed wiring board and method for manufacturing the same
07/26/2012US20120186867 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
07/26/2012US20120186866 Wiring board and method for manufacturing the same
07/26/2012US20120186865 Paste composition and printed circuit board
07/26/2012US20120186864 Wiring board and method for manufacturing the same
07/26/2012US20120186863 Multilayer wiring board
07/26/2012US20120186862 Carrier tape for tab-package and manufacturing method thereof
07/26/2012US20120186861 Wiring board with built-in electronic component and method for manufacturing the same
07/26/2012US20120186860 Circuit board
07/26/2012US20120186859 Wiring board and method of manufacturing the wiring board
07/26/2012US20120186858 Flexible circuit board
07/26/2012US20120186857 Method for manufacturing wiring board for mounting electronic component, wiring board for mounting electronic component, and method for manufacturing wiring board having an electronic component
07/26/2012US20120186856 Multi-layer flexible printed circuit board for electronic device
07/26/2012US20120186855 Substrate of touch panel in manufacturing and the method for forming the same
07/26/2012DE102011100556A1 Method for applying digitally controlled applied conductive layer regions on elastic and/or deformable surfaces of bodies or components, involves forming chamber, where edge areas of chamber are in fixed connection with substrate
07/26/2012DE102011100555A1 Method for manufacturing bendable and/or resilient substrate, involves adjusting material properties of conductive layer in deformation minimized layer region so as to bend substrate
07/26/2012DE102011087414A1 Leistungshalbleitervorrichtung, gedruckte Leiterplatte und Mechanismus zum Verbinden der Leistungshalbleitervorrichtung und der gedruckten Leiterplatte Power semiconductor device, printed circuit board and mechanism for connecting the power semiconductor device and the printed circuit board
07/26/2012DE102011009440A1 Vorrichtung zur elektronischen und mechanischen Verbindung von zwei nebeneinander angeordneten Leiterplatten An apparatus for electronic and mechanical connection of two adjacent printed circuit boards
07/26/2012DE102011009439A1 Vorrichtung zur elektronischen und mechanischen Verbindung von zwei übereinander angeordneten Leiterplatten An apparatus for electronic and mechanical connection of two circuit boards arranged one above another
07/26/2012DE102011003007A1 Leiterplatte mit Überdruckventil, Insufflator Circuit board with pressure relief valve, insufflator
07/26/2012CA2823706A1 Z-directed capacitor components for printed circuit boards
07/25/2012EP2480057A2 Circuit board design
07/25/2012EP2480056A2 Circuit board design
07/25/2012EP2480055A2 Circuit board design
07/25/2012EP2480054A2 Circuit board design
07/25/2012EP2480053A2 Circuit board design
07/25/2012EP2480052A1 Ceramic circuit board and process for producing same
07/25/2012EP2479690A2 Method and Apparatus for Configurable Circuitry
07/25/2012EP2479611A2 Chemically amplified positive resist composition and patterning process
07/25/2012EP2479314A1 Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid composition
07/25/2012EP2479298A1 Copper alloy foil, flexible printed wiring board obtained using same, and process for producing copper alloy foil
07/25/2012EP2479227A1 Printing ink, metal nanoparticles used in the same, wiring, circuit board, and semiconductor package
07/25/2012EP2478753A1 Method for producing a ceramic component, ceramic component and component assembly
07/25/2012EP2478751A1 Embedded components in interposer board for improving power gain (distribution) and power loss (dissipation) in interconnect configuration
07/25/2012EP2478750A1 Light-source module and light-emitting device
07/25/2012CN202353940U PCB (Printed Circuit Board) of LED (Light Emitting Diode) street lamp
07/25/2012CN202353939U Printed circuit board of LED streetlamp
07/25/2012CN202353938U Printed circuit board for light emitting diode (LED) street lamp
07/25/2012CN202353937U 线路板总成 Circuit board assembly
07/25/2012CN202353936U Light emitting diode (LED) circuit board module
07/25/2012CN202353935U Small-bore flexible circuit board
07/25/2012CN202353934U Golden finger of FPC (Flexible Printed Circuit Board)
07/25/2012CN202353933U Electrostatic eliminating circuit board of medical electronic instrument
07/25/2012CN202353932U Element slot on circuit board
07/25/2012CN202353931U Electrochemical-migration-resistant circuit board structure
07/25/2012CN202353930U Circuit board resisting electrochemical migration
07/25/2012CN202353929U Flexible printed circuit
07/25/2012CN202353928U Single-layer impedance flexible printed circuit board
07/25/2012CN202353927U Flexible printed circuit board coated with metal film
07/25/2012CN202353926U Flexible printed circuit board of mobile phone touch screen
07/25/2012CN202353925U Line structure of electronic equipment
07/25/2012CN202353924U Protection cover for printed circuit board (PCB)
07/25/2012CN202353923U 复合式覆盖膜 Composite cover film
07/25/2012CN202353922U Soft and hard combined circuit board structure
07/25/2012CN202353921U Improved flexible printed circuit board structure
07/25/2012CN202353920U Rigid-flexible multi-layer circuit board
07/25/2012CN202353919U Rigid-flexible combined circuit board
07/25/2012CN202353918U Multilayer flexible circuit board
07/25/2012CN202353917U Multilayer flexible printed circuit board
07/25/2012CN202353916U Improved structure of multilayer flexible printed circuit board
07/25/2012CN202353915U 多层印刷线路板 Multilayer printed circuit boards
07/25/2012CN202352646U 电子装置 Electronic devices
07/25/2012CN202352251U High-density light emitting diode (LED) full-color lattice module
07/25/2012CN102612274A Wiring board and method for manufacturing the same
07/25/2012CN102612273A Method for manufacturing wiring board for mounting electronic component, wiring board for mounting electronic component, and method for manufacturing wiring board having an electronic component
07/25/2012CN102612271A Three-dimensional circuit on structure member and manufacturing method thereof
07/25/2012CN102612269A All-printed circuit board
07/25/2012CN102612265A Component built-in wiring board and manufacturing method of component built-in wiring board
07/25/2012CN102612264A Component built-in wiring board and manufacturing method of component built-in wiring board
07/25/2012CN102612263A Multilayer wiring board
07/25/2012CN102612262A Solder pad structure and manufacture method thereof
07/25/2012CN102612261A High-heat conduction metal core printed circuit board and preparation method for high-heat conduction metal core printed circuit board
07/25/2012CN102612260A Reinforced FPC (Flexible Printed Circuit) board and manufacturing method
07/25/2012CN102612259A Drilling short slot for printed circuit board
07/25/2012CN102612258A Forming processing hole for printed circuit board
07/25/2012CN102612257A Substrate with voltage changeable dielectric material
07/25/2012CN102612256A Wiring member and process for producing the same
07/25/2012CN102612255A Circuit board and electronic device
07/25/2012CN102612254A Heat radiation type LED (Light-Emitting Diode) flexible circuit board
07/25/2012CN102612253A Interconnection structure, apparatus therewith, circuit structure therewith
07/25/2012CN102612252A Printed wiring board
07/25/2012CN102610243A Printed circuit substrate
07/25/2012CN102605355A Copper film on surface of substrate as well preparation method and application thereof
07/25/2012CN102604512A Epoxy resin, epoxy resin composition, and utilizing the same, prepreg and laminated plate
07/25/2012CN102604133A Resin-impregnated sheet and resin-impregnated sheet with conductive layer
07/25/2012CN102602117A Method for preparing copper-clad plate
07/25/2012CN102031008B Production method of thin prepreg with high-content filler adhesive system
07/25/2012CN102014590B Production method of multi-layer printed circuit board and multi-layer printed circuit board
07/25/2012CN101998770B Method for manufacturing etched film resistance circuit board
07/25/2012CN101998758B Preparation method of amorphous diamond heat dissipation and insulation film layer of LED printed circuit board
07/25/2012CN101965097B Printed circuit board and its manufacture method