| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 07/25/2012 | CN101940078B Thermal countermeasure structure of circuit board |
| 07/25/2012 | CN101932194B Rolled copper foil |
| 07/25/2012 | CN101894823B Composite material structure, circuit board structure comprising same and forming method thereof |
| 07/25/2012 | CN101888738B Embedded substrate provided with side-inclined plane line layer assembly and manufacturing method thereof |
| 07/25/2012 | CN101873761B Circuit board having optical readable mark code and manufacturing method thereof |
| 07/25/2012 | CN101777249B Anti-electromagnetic interference isolation terminal |
| 07/25/2012 | CN101730388B 电路板及其制作方法 Circuit board and its manufacturing method |
| 07/25/2012 | CN101673886B Improved matched-impedance surface-mount technology footprints |
| 07/25/2012 | CN101668381B Electronic device |
| 07/25/2012 | CN101654005B Method for manufacturing halogen-free FR-4 copper-clad laminate |
| 07/25/2012 | CN101621888B Method and system for realizing wiring of sensitive signal wire in printed circuit board |
| 07/25/2012 | CN101567204B Main shaft motor module for CD driver |
| 07/25/2012 | CN101528001B Flexible printed circuit board and manufacturing method for the same |
| 07/25/2012 | CN101410344B Dielectric porcelain composition and electronic component |
| 07/25/2012 | CN101365291B Printed circuit board, design method thereof and terminal product main board |
| 07/25/2012 | CN101358050B Conductive pattern formation ink, conductive pattern and wiring substrate |
| 07/25/2012 | CN101329017B Lighting arrangement with semiconductor light sources on flexible printed circuits |
| 07/25/2012 | CN101176389B Impedance controlled via structure |
| 07/24/2012 | US8230374 Method of partitioning an algorithm between hardware and software |
| 07/24/2012 | US8229533 Low-noise optical probes for reducing ambient noise |
| 07/24/2012 | US8228684 Multi chip electronic system |
| 07/24/2012 | US8228683 Framework of wireless network access device |
| 07/24/2012 | US8228680 Embedding thin film resistors in substrates in power delivery networks |
| 07/24/2012 | US8228679 Connections for electronic devices on double-sided circuit board |
| 07/24/2012 | US8228677 Tape wiring substrate and semiconductor chip package |
| 07/24/2012 | US8228676 Small form factor USB bluetooth dongle |
| 07/24/2012 | US8227711 Coreless packaging substrate and method for fabricating the same |
| 07/24/2012 | US8227710 Wiring structure of printed wiring board and method for manufacturing the same |
| 07/24/2012 | US8227709 Printed wiring board, and design method for printed wiring board |
| 07/24/2012 | US8227708 Via structure integrated in electronic substrate |
| 07/24/2012 | US8227707 Coaxial connector mounted circuit board |
| 07/24/2012 | US8227706 Coaxial plated through holes (PTH) for robust electrical performance |
| 07/24/2012 | US8227705 Wired circuit board and producing method thereof |
| 07/24/2012 | US8227703 Multilayered circuit board and semiconductor device |
| 07/24/2012 | US8227702 Multilayer ceramic substrate, electronic component, and method of manufacturing multilayer ceramic substrate |
| 07/24/2012 | US8227701 Reconfigurable electric circuitry and method of making same |
| 07/24/2012 | US8227700 Chip having side protection terminal and package using the chip |
| 07/24/2012 | US8227699 Printed circuit board |
| 07/24/2012 | US8227084 Thermosetting resin composition for high performance laminates |
| 07/24/2012 | US8225499 Method for manufacturing a circuit board structure, and a circuit board structure |
| 07/23/2012 | DE202012003976U1 Betriebsgerät für Leuchtmittel Operating device for lamps |
| 07/19/2012 | WO2012097094A1 Modular surface mount package for a system on a chip |
| 07/19/2012 | WO2012096774A1 Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices |
| 07/19/2012 | WO2012096764A1 Electronic device having liquid crystal polymer solder mask and outer sealing layers, and associated methods |
| 07/19/2012 | WO2012096763A1 Method of making an electronic device having a liquid crystal polymer solder mask and related devices |
| 07/19/2012 | WO2012096414A1 Board connecting terminal and holding structure of circuit board |
| 07/19/2012 | WO2012096152A1 Mounting structure for circuit component and method for mounting circuit component |
| 07/19/2012 | WO2012095333A1 Direct electric contacting arrangement for lands on a printed circuit board |
| 07/19/2012 | WO2012094722A1 Printed circuit board with an acoustic channel for a microphone |
| 07/19/2012 | WO2012062981A3 Display screen |
| 07/19/2012 | US20120184326 Electronic Circuit |
| 07/19/2012 | US20120184115 Plug connector and multi-layer circuit board |
| 07/19/2012 | US20120184071 Surface coating method, semiconductor device, and circuit board package |
| 07/19/2012 | US20120182706 Stacked shield compartments for electronic components |
| 07/19/2012 | US20120182703 Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices |
| 07/19/2012 | US20120182702 Method of making an electronic device having a liquid crystal polymer solder mask and related devices |
| 07/19/2012 | US20120182701 Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices |
| 07/19/2012 | US20120182700 Display apparatus |
| 07/19/2012 | US20120182699 Modular surface mount package for a system on a chip |
| 07/19/2012 | US20120182066 Method of manufacturing a package for embedding one or more electronic components |
| 07/19/2012 | US20120181708 Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor device |
| 07/19/2012 | US20120181687 Materials, structures and methods for microelectronic packaging |
| 07/19/2012 | US20120181560 Led wiring board, light emitting module, method for manufacturing led wiring board and method for manufacturing light emitting module |
| 07/19/2012 | US20120181341 One and Two-Part Printable EM Tags |
| 07/19/2012 | US20120181078 Multilayer printed wiring board |
| 07/19/2012 | US20120181077 Printed circuit board unit |
| 07/19/2012 | US20120181076 Double-sided circuit board and manufacturing method thereof |
| 07/19/2012 | US20120181075 Flexible flat cable assembly and method of manufacturing the same |
| 07/19/2012 | US20120181074 Wiring board and method for manufacturing the same |
| 07/19/2012 | US20120181073 Electronic device having liquid crystal polymer solder mask and outer sealing layers, and associated methods |
| 07/19/2012 | US20120181072 Printed wiring board and method for manufacturing same |
| 07/19/2012 | US20120181071 Multilayer pillar for reduced stress interconnect and method of making same |
| 07/19/2012 | US20120181070 Interconnection structure and method of forming the same |
| 07/19/2012 | US20120181069 Printed wiring board, method of soldering quad flat package ic, and air conditioner |
| 07/19/2012 | US20120181068 Circuit substrate and method of manufacturing same |
| 07/19/2012 | US20120181067 Circuit board |
| 07/19/2012 | US20120181065 Multi-Layered Circuit Board Device |
| 07/19/2012 | US20120181064 Capacitive touch panel having dual resistive layer |
| 07/19/2012 | DE102011002864A1 Leiterplatine und Verfahren zur Herstellung einer Leiterplatine Printed circuit board and method of manufacturing a printed circuit board |
| 07/19/2012 | DE102005033109B4 Spülmaschine mit einer Leiterplattenanordnung Machine with a printed circuit board assembly |
| 07/19/2012 | CA2823965A1 Printed circuit board with an acoustic channel for a microphone |
| 07/19/2012 | CA2764659A1 Wireless communications using multi-bandpass transmission line with slot ring resonators on the ground plane |
| 07/18/2012 | EP2477466A2 Method of manufacturing a package for embedding one ore more electronic components |
| 07/18/2012 | EP2476723A1 Method for selective metallisation of a substrate and switch holder produced according to this method |
| 07/18/2012 | EP2476298A1 Circuit configuration having a prescribed capacitance, and method and device for the production thereof |
| 07/18/2012 | CN1951161B Shared via decoupling for area arrays components |
| 07/18/2012 | CN1871671B Embedded toroidal inductors |
| 07/18/2012 | CN102598895A Dielectric material with non-halogenated curing agent |
| 07/18/2012 | CN102598886A Wiring board and method for producing same |
| 07/18/2012 | CN102598885A Wiring board and method for producing same |
| 07/18/2012 | CN102598882A Wiring circuit board and method for manufacturing same |
| 07/18/2012 | CN102598880A Wiring board unit |
| 07/18/2012 | CN102598879A Device mounting structure and device mounting method |
| 07/18/2012 | CN102598878A Spd films and light valve laminates with improved bus-bar connections |
| 07/18/2012 | CN102598877A Multi-piece substrate and production method for same |
| 07/18/2012 | CN102598419A Circuit connecting material and connection structure for circuit member using same |
| 07/18/2012 | CN102597827A Optical waveguide substrate and method for manufacturing same |
| 07/18/2012 | CN102597323A Method for preventing or reducing silver migration in the crossover areas of a membrane touch switch |
| 07/18/2012 | CN102597162A Etching solution composition |
| 07/18/2012 | CN102597061A Polyimide precursor and photosensitive resin composition containing the polyimide precursor |