Patents for H05K 1 - Printed circuits (98,583)
01/2013
01/02/2013CN102858089A Printed circuit board, power supply apparatus, image forming apparatus, and printed circuit board manufacturing method
01/02/2013CN102858088A Circuit board, manufacturing method thereof and electronic product adopting circuit board
01/02/2013CN102858087A Blind-hole-conduction double-sided circuit board and processing method thereof
01/02/2013CN102858086A Printed wiring board with improved corrosion resistance and yield
01/02/2013CN102858085A Thick-and-thin half-etching printed circuit board (PCB) and method for manufacturing same
01/02/2013CN102858084A Flexible base material and preparation method thereof
01/02/2013CN102858083A Ceramic double-faced circuit board and manufacturing method thereof
01/02/2013CN102858082A Protective structure for safe area of core module
01/02/2013CN102858081A PCB (Printed Circuit Board) capable of preventing metalized blind groove bottom plating layer from being separated from substrate and manufacturing method thereof
01/02/2013CN102858080A Flexible printed circuit (FPC) board for setting touch sensor
01/02/2013CN102857720A Electronic apparatus
01/02/2013CN102853389A Light strip elastic welding pad structure
01/02/2013CN102850726A Composite material, high frequency circuit substrate produced by using composite material, and production method of high frequency circuit substrate
01/02/2013CN102850720A Fusion packing and its preparation method and application
01/02/2013CN102848764A Forme, circuit board printing method using same and manufactured printed circuit board
01/02/2013CN102295742B Epoxy resin composition and prepreg material as well as printed circuit board prepared by same
01/02/2013CN102079875B High-heat-resistance halogen-free phosphorus-free thermosetting resin composition, and bonding sheet and copper foil-coated laminated board made of same
01/02/2013CN102017817B Electric circuit connection member
01/02/2013CN102009515B Two-layer-method double-sided flexible CCL (Copper-Clad Laminate) and manufacture method thereof
01/02/2013CN101989717B Socket and circuit board provided with socket
01/02/2013CN101964468B Tensile narrow surface installation elastic sheet
01/02/2013CN101911846B Method for forming circuit
01/02/2013CN101835866B Circuit member connecting adhesive and semiconductor device
01/02/2013CN101795545B Device for assembling large plate and power amplifier and base station
01/02/2013CN101658082B Method for producing a flexi-rigid printed circuit board and flexi-rigid printed circuit board
01/02/2013CN101636070B Fixing and matching structure
01/02/2013CN101626144B Discharge gap device and power supply device
01/02/2013CN101613530B 树脂组合物及其应用 The resin composition and its application
01/02/2013CN101511153B Electronics casing with a circuit board and method for producing an electronics casing
01/02/2013CN101204124B Warpage preventing substrates and method of making the same
01/01/2013US8345444 Structure with electronic component mounted therein and method for manufacturing such structure
01/01/2013US8345442 Latching structure of electronic device
01/01/2013US8345440 Industrial module assembling apparatus
01/01/2013US8345439 Modular chassis arrangement with redundant logic power delivery system
01/01/2013US8345435 Terminal structure and manufacturing method thereof, and electronic device and manufacturing method thereof
01/01/2013US8345434 High frequency circuit having multi-chip module structure
01/01/2013US8345433 Heterogeneous organic laminate stack ups for high frequency applications
01/01/2013US8345431 Thin multi-chip flex module
01/01/2013US8345430 IC card
01/01/2013US8345203 Display device and manufacturing method thereof
01/01/2013US8344518 Apparatus for stacking integrated circuits
01/01/2013US8344270 Combination of a main carrier and a printed circuit board with components
01/01/2013US8344268 Electronic component packaging structure having two-layer moisture-proof coating and method for manufacturing the same
01/01/2013US8344267 LED luminous module with crossover connecting element
01/01/2013US8344266 Optimizing ASIC pinouts for HDI
01/01/2013US8344265 Electronic component
01/01/2013US8344264 Semiconductor device and manufacturing process thereof
01/01/2013US8344262 Epoxy resin composition for printed wiring board, resin composition varnish, prepreg, metal clad laminate, printed wiring board and multilayer printed wiring board
01/01/2013US8344261 Carrier substrate, fabrication method thereof, printed circuit board using the same, and fabrication method thereof
01/01/2013US8344260 Multilayer wiring board
01/01/2013US8344259 Connection terminal, package using the same, and electronic apparatus
01/01/2013US8344258 Electric device
01/01/2013US8344257 Flexible printed circuit and fabrication method thereof
01/01/2013US8342384 Method for the production of a metal-ceramic substrate, preferably a copper ceramic substrate
12/2012
12/27/2012WO2012177826A1 Bus apparatus for use with circuit interrupters or other devices
12/27/2012WO2012177351A1 Flexible circuit routing
12/27/2012WO2012176840A1 Transparent insulating laminate and printed circuit board using same
12/27/2012WO2012176491A1 Mounting board and light-emitting module
12/27/2012WO2012176453A1 Wiring board
12/27/2012WO2012176404A1 Projector with flexible printed circuit board for the light source
12/27/2012WO2012175184A1 Plug and method for manufacturing same
12/27/2012WO2012128526A3 Noble polyamic acid, photosensitive resin composition, dry film, and circuit board
12/27/2012WO2012120032A3 Assembly having a substrate, an smd component, and a lead frame part
12/27/2012US20120329326 Methods and Apparatus for Reducing Crosstalk in Electrical Connectors
12/27/2012US20120329295 High Performance Compliant Wafer Test Probe
12/27/2012US20120328904 Printed circuit boards and related articles including electrodeposited coatings
12/27/2012US20120328856 Photosensitive resin composition and circuit formation substrate using the same
12/27/2012US20120327626 Wiring substrate, its manufacturing method, and semiconductor device
12/27/2012US20120327622 Pre-distortion based impedence discontinuity remediation for via stubs and connectors in printed circuit board design
12/27/2012US20120327613 Conductive substrate and method for manufacturing the same
12/27/2012US20120327583 Robust power plane configuration in printed circuit boards
12/27/2012US20120327350 Display device
12/27/2012US20120327327 Mobile terminal
12/27/2012US20120327048 Mobile computing devices
12/27/2012US20120326990 Flexible circuit routing
12/27/2012US20120326562 Laminated ceramic electronic component
12/27/2012US20120326559 Laminated ceramic electronic component
12/27/2012US20120326558 Laminated ceramic electronic component
12/27/2012US20120326334 Interposer, its manufacturing method, and semiconductor device
12/27/2012US20120326287 Dc/dc convertor power module package incorporating a stacked controller and construction methodology
12/27/2012US20120325545 Conductive film and method for its production
12/27/2012US20120325544 Structure, circuit board, and circuit board manufacturing method
12/27/2012US20120325543 Printed wiring board (pwb) with lands
12/27/2012US20120325542 Circuit Board
12/27/2012US20120325541 Axiocentric scrubbing land grid array contacts and methods for fabrication
12/27/2012US20120325540 Footprint on pcb for leadframe-based packages
12/27/2012US20120325539 Bonding area design for transient liquid phase bonding process
12/27/2012US20120325538 Printed circuit board assembly
12/27/2012US20120325537 Circuit board, electronic apparatus, and noise blocking method
12/27/2012US20120325536 Display device and method for fabricating same
12/27/2012US20120325535 Printed wiring board encapsulated by adhesive laminate comprising a di-isoimide, and process for preparing same
12/27/2012US20120325534 Method for producing liquid crystal polyester-impregnated base material
12/27/2012US20120325533 Method of manufacturing multilayer circuit board and multilayer circuit board
12/27/2012US20120325532 Interconnect structure including a modified photoresist as a permanent interconnect dielectric and method of fabricating same
12/27/2012US20120325531 Printed wiring board with improved corrosion resistance and yield
12/27/2012US20120325530 Circuit board with even current distribution
12/27/2012US20120325529 Wiring board and method of manufacturing the same
12/27/2012US20120325528 Bundled flexible flat circuit cable
12/27/2012US20120325527 Bundled flexible flat circuit cable
12/27/2012US20120325526 Bundled flexible flat circuit cable