Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
03/2014
03/20/2014DE202012011948U1 LED-Modul mit Flächenverguß LED module with Flächenverguß
03/20/2014DE102013110087A1 Lichtemittierende-Vorrichtungs-Baugruppe und Scheinwerfer für Fahrzeug mit derselben Light Emitting Device assembly and headlight for car with the same
03/20/2014DE102012216738A1 Optoelektronisches bauelement Opto-electronic-device
03/20/2014DE102012216552A1 LED lighting device manufacturing method, involves covering LED chip with converter layer, filling matrix material in converter layer, roughening surface of LED chip, and applying adhesion promoter on surface of LED chip
03/20/2014DE102012108883A1 Optoelektronischer Halbleiterchip und Verfahren zur Herstellung von optoelektronischen Halbleiterchips The optoelectronic semiconductor chip and method for the production of optoelectronic semiconductor chips
03/20/2014DE102012108879A1 Optoelektronischer Halbleiterchip mit mehreren nebeneinander angeordneten aktiven Bereichen The optoelectronic semiconductor chip with a plurality of adjacently disposed active areas
03/20/2014DE102012108828A1 Optoelektronisches Bauelement, optisches Element und deren Herstellungsverfahren Optoelectronic device, optical element and its manufacturing method
03/20/2014DE102012108763A1 Optoelektronischer halbleiterchip und lichtquelle mit dem optoelektronischen halbleiterchip The optoelectronic semiconductor chip and optoelectronic light source with the semiconductor chip
03/20/2014DE102012108704A1 Verfahren zur Fixierung einer matrixfreien elektrophoretisch abgeschiedenen Schicht auf einem Halbleiterchip und strahlungsemittierendes Halbleiterbauelement A method for fixing a matrix-free electrophoretically deposited layer on a semiconductor chip and Radiation-emitting semiconductor component
03/20/2014DE102012107668A1 Bauelementanordnung Component arrangement
03/19/2014EP2709178A2 Light emitting device
03/19/2014EP2709177A2 Lead configuration for and in a light emitting device
03/19/2014EP2709176A2 Light emitting diode
03/19/2014EP2709175A1 Light emitting device
03/19/2014EP2709174A2 Light emitting device
03/19/2014EP2709173A1 Semiconductor substrate, semiconductor device, and manufacturing methods thereof
03/19/2014EP2709172A2 Light emitting device
03/19/2014EP2709171A2 LED array
03/19/2014EP2709170A2 P-Side Layers for Short Wavelength Light Emitters
03/19/2014EP2707910A2 Silicone coated light-emitting diode
03/19/2014EP2707909A1 Recipient luminophoric mediums having narrow-spectrum luminescent materials and related semiconductor light emitting devices and methods
03/19/2014CN203492237U Light emitting diode control circuit, package structure of light emitting diode control circuit and system of light emitting diode control circuit
03/19/2014CN203491305U Electronic component
03/19/2014CN203491304U Light emitting diode support structure
03/19/2014CN203491303U Cob packaging structure
03/19/2014CN203491302U LED packaging structure
03/19/2014CN203491301U COB packaging structure for light emitting diode
03/19/2014CN203491300U Diffusion soft light type LED lamp bead
03/19/2014CN203491299U Outdoor display screen and LED packaging devices thereof
03/19/2014CN203491298U Led packaging structure
03/19/2014CN203491297U Packaging device of LED area light source
03/19/2014CN203491296U Packaging structure for LED lamp failure prevention
03/19/2014CN203491295U Compulsive-cooling type LED packaging structure
03/19/2014CN203491294U LED support and LED packaging structure
03/19/2014CN203491293U LED support and LED packaging structure
03/19/2014CN203491292U Anti-leakage LED support
03/19/2014CN203491291U Mechanically packaged LED device
03/19/2014CN203491290U A soldering-free integrated LED light source electrode connector
03/19/2014CN203491289U LED chip numeric tube with integral packaging structure
03/19/2014CN203491288U GaN-based LED epitaxial wafer
03/19/2014CN203491287U LED (Light Emitting Diode) chip
03/19/2014CN203491286U Automatic image identification system used for wire bonder
03/19/2014CN203491259U Large-power white light device for integrated packaging of LED chips
03/19/2014CN203491258U Bridge LED COB packaging device
03/19/2014CN203491257U Novel COB (Chip On Board) light source with high color rendering index
03/19/2014CN203491240U LED electrode support adsorption and feeding device
03/19/2014CN203491230U Distance lengthening device for stripping of high power LED and patch
03/19/2014CN203489182U COB (chip on board) encapsulated high-power white light device
03/19/2014CN103650185A Circuit board for having semiconductor light emitting device mounted thereon, light emitting module, illuminating apparatus, and illuminating system
03/19/2014CN103650184A Illumination device
03/19/2014CN103650183A Light-emitting device
03/19/2014CN103650182A Resin coating device, and resin coating method
03/19/2014CN103650181A Light-emitting device
03/19/2014CN103650180A Substrate for optical device
03/19/2014CN103650179A Light emitting device and method for manufacturing same
03/19/2014CN103650178A Semiconductor light-emitting element
03/19/2014CN103650177A Gallium nitride compound semiconductor light emitting element and light source device using same
03/19/2014CN103650176A Light emitting element and method for manufacturing same
03/19/2014CN103650175A Semiconductor light-emitting device and method for manufacturing same
03/19/2014CN103650174A Light-emitting diode (LED) for achieving an asymmetric light output
03/19/2014CN103650173A Semiconductor light-emitting device
03/19/2014CN103650172A Distributed bragg reflector for reflecting light of multiple wavelengths from an led
03/19/2014CN103650171A Method of bonding a semiconductor device to a support substrate
03/19/2014CN103650139A Lighting device
03/19/2014CN103649811A Light-influencing element for influencing the light emission of essentially point light sources
03/19/2014CN103649634A Light-emitting module
03/19/2014CN103649628A Member for controlling luminous flux, light-emitting device, and illumination device
03/19/2014CN103649619A Light-emitting device and illumination device
03/19/2014CN103649270A LED lighting device having a phosphor composition
03/19/2014CN103649218A Curable epoxy resin composition
03/19/2014CN103649216A Resin composition for sealing optical semiconductor, and optical semiconductor device using same
03/19/2014CN103649215A Resin composition for forming fluorescent sheet
03/19/2014CN103648998A Method for producing a conversion element, and conversion element
03/19/2014CN103647015A Light-emitting diode encapsulation structure and light emitting device
03/19/2014CN103647014A Transparent packaging LED light source and manufacturing technology thereof
03/19/2014CN103647013A Wavelength conversion device manufacturing method and light-emitting device
03/19/2014CN103647012A Chip transfer method for LED (light-emitting diode) wafer level package
03/19/2014CN103647011A Light-emitting diode encapsulation structure and light emitting device
03/19/2014CN103647010A Manufacturing method of high power LED chip
03/19/2014CN103647009A Nitride light emitting diode and manufacturing method thereof
03/19/2014CN103647008A Method for growing semi-polarity GaN (gallium nitride) thick film
03/19/2014CN103647007A COB (chip on board) encapsulating method
03/19/2014CN103647006A Light-emitting diode (LED)-COB (chip on board) light source and preparation method thereof
03/19/2014CN103647005A Pattern-segmented sapphire substrate used for AlGaInN material system film growth
03/19/2014CN103647004A An LED lamp tube baking apparatus
03/19/2014CN103647003A Photochromic switching film and method for producing the same
03/19/2014CN103646961A Silicon-based Group III nitride thin film containing high resistance parasitic conductive layer and growth method
03/19/2014CN103646900A Test method and test system for LED wafer
03/19/2014CN103644549A LED (Light-emitting diode) heat dissipation structure
03/19/2014CN103642493A Inorganic luminescent material with high luminous efficiency and high stability and preparation method of inorganic luminescent material
03/19/2014CN102775549B High-ultraviolet transmissivity electronic packaging material and preparation method thereof
03/19/2014CN102629652B Light emitting diode and preparation method thereof
03/19/2014CN102492420B Cesium aluminosilicate phosphor and preparation method thereof
03/19/2014CN102456816B LED (Light-Emitting Diode) package structure and LED stereo display device
03/19/2014CN102433122B Nitride phosphor and manufacturing method thereof, and light emitting device using the same
03/19/2014CN102412347B Fabrication method of substrate with phosphor powder and fabrication method of light-emitting module
03/19/2014CN102280565B Light emitting device package using quantum dot, illumination apparatus and display apparatus
03/19/2014CN102104090B Light-emitting diode chip bonding method, bonded light-emitting diode and chip structure
03/19/2014CN101807638B Semiconductor light emitting device
03/19/2014CN101760194B Red fluorescent powder used by white light LED and preparation method thereof
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