Patents
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
03/2014
03/27/2014WO2014044592A1 Optoelectronic semiconductor chip and method for production thereof
03/27/2014WO2014044558A1 Optoelectronic component, optical element, and the production method thereof
03/27/2014WO2014044557A1 Optoelectronic component and method for producing an optoelectronic component
03/27/2014WO2014044556A1 Optoelectronic semiconductor chip, and light source comprising the optoelectronic semiconductor chip
03/27/2014WO2014044207A1 Vertical light emitting diode with current barrier function and manufacturing method thereof
03/27/2014WO2011122847A8 Optical device module and method for fabricating same
03/27/2014US20140088232 Silicone composition for sealing semiconductor
03/27/2014US20140087508 Method for producing group iii nitride semiconductor light-emitting device
03/27/2014US20140087506 Zinc oxide-containing transparent conductive electrode
03/27/2014US20140087505 Light-Emitting Diodes on Concave Texture Substrate
03/27/2014US20140087502 Light emitting diode chip having distributed bragg reflector and method of fabricating the same
03/27/2014US20140087501 Doped graphene transparent conductive electrode
03/27/2014US20140087500 Transparent conductive electrode stack containing carbon-containing material
03/27/2014US20140087499 Method for handling a semiconductor wafer assembly
03/27/2014US20140087498 Method of manufacturing light-emitting device
03/27/2014US20140087496 Methods and structures for forming and protecting thin films on substrates
03/27/2014US20140085705 Color electronic paper display and method of fabricating the same
03/27/2014US20140085557 Liquid crystal display panel and method of manufacturing the same
03/27/2014US20140084781 Light emitting device
03/27/2014US20140084780 Blue light-emitting phosphor and light-emitting device using the blue light-emitting phosphor
03/27/2014US20140084330 Light emitting device package
03/27/2014US20140084329 Light emitting unit, light emitting device, and method of manufacturing light emitting unit
03/27/2014US20140084328 Semiconductor light emitting element
03/27/2014US20140084327 Light-emitting device
03/27/2014US20140084326 Light-emitting diode and manufacturing method thereof
03/27/2014US20140084325 Optical element and semiconductor light emitting device using the optical element
03/27/2014US20140084324 Light-emitting devices
03/27/2014US20140084323 Light emitting device and display comprising a plurality of light emitting components on mount
03/27/2014US20140084322 Light-emitting device and method of manufacturing the same
03/27/2014US20140084321 Package for light-emitting device
03/27/2014US20140084320 Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
03/27/2014US20140084319 Array Substrate, Display Panel And Preparing Method Thereof
03/27/2014US20140084318 Light emitting device package and package substrate
03/27/2014US20140084317 Ultraviolet light emitting device
03/27/2014US20140084316 Semiconductor light emitting device and method for manufacturing same
03/27/2014US20140084315 Light emitting diode package and method for manufacturing the same
03/27/2014US20140084314 Injection molded microoptics
03/27/2014US20140084313 Light emitting diode package and method for manufacturing the same
03/27/2014US20140084310 Display device and method for manufacturing same
03/27/2014US20140084308 Overmold with single attachment using optical film
03/27/2014US20140084307 Optoelectronic device
03/27/2014US20140084286 Thin film transistor array substrate and method for manufacturing the same
03/27/2014US20140084258 Organic light emitting display device
03/27/2014US20140084257 Organic light emitting display panel and method of manufacturing the same
03/27/2014US20140084244 Wafer Level Photonic Device Die Structure and Method of Making the Same
03/27/2014US20140084243 Light emitting diode with three-dimensional nano-structures
03/27/2014US20140084242 Group iii nitride semiconductor light-emitting device
03/27/2014US20140084241 Group iii nitride semiconductor light-emitting device and method for producing the same
03/27/2014US20140084240 Micro device stabilization post
03/27/2014US20140084238 Nano-patterned substrate and epitaxial structure cross-reference to related application
03/27/2014US20140084212 Method for synthesizing indium phosphide nanoparticles and nanoparticles
03/27/2014US20140084182 Light emitting device package
03/27/2014DE112012002990T5 Beleuchtungsvorrichtung Lighting device
03/27/2014DE112012002326T5 Harzbeschichtungsvorrichtung und Harzbeschichtungsverfahren Resin coating apparatus and resin coating method
03/27/2014DE112012001618T5 Gestapelter Halbleiterkörper, Verfahren zum Herstellen desselben und Halbleiterelement Of the same stacked semiconductor body, method for manufacturing the semiconductor element and
03/27/2014DE102013101529A1 Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements Optoelectronic component and process for producing an optoelectronic component
03/27/2014DE102012223793A1 Optoelectronic component e.g. LED, has current path for draining charge carriers, which is formed parallel to p-n junction and is electrically connected to p-type and n-type semiconductor layers
03/27/2014DE102012217681A1 Optoelektronisches Bauteil und Verfahren zum Betreiben eines optoelektronischen Bauteils The optoelectronic device and methods of operating an optoelectronic device
03/27/2014DE102012217652A1 Optoelektronisches Bauteil The optoelectronic device
03/27/2014DE102012217644A1 Optoelektronisches Bauelement Optoelectronic component
03/27/2014DE102012217643A1 Optoelektronisches Bauelement Optoelectronic component
03/27/2014DE102012217633A1 Method for testing crack in optoelectronic component used for dark field illumination, involves classifying detected structure as crack, when detected structure has geometric feature corresponding to predetermined geometry parameters
03/27/2014DE102012217631A1 Optoelektronisches Bauelement mit einer Schichtstruktur Optoelectronic component with a layer structure
03/27/2014DE102012217623A1 Optoelectronic semiconductor device i.e. LED package, has optoelectronic semiconductor chip arranged at bottom of recess on plastic carrier and copper electrical conductor embedded in plastic substrate
03/27/2014DE102012217609A1 Optoelectronic semiconductor device i.e. LED, has support substrate embedded in mold body, and optoelectronic semiconductor chip arranged above top side of substrate, where top side of substrate flushingly terminates with mold body top side
03/27/2014DE102012217533A1 Verfahren zur Herstellung eines optoelektronischen Bauelements A process for producing an optoelectronic component
03/27/2014DE102012217521A1 Optoelektronisches Bauelement Optoelectronic component
03/27/2014DE102012216956A1 Lead frame for lighting device e.g. LED module, has fitting station for semiconductor light source that is arranged adjacent to contact surface of conductive paths that are non-destructive pivotable towards connecting portions
03/27/2014DE102012215449A1 Gehäuse für ein elektronisches bauelement, elektronische baugruppe, verfahren zum herstellen eines gehäuses für ein elektronisches bauelement und verfahren zum herstellen einer elektronischen baugruppe Housing for an electronic component, electronic module, method for manufacturing a housing for an electronic component and method for manufacturing an electronic module,
03/27/2014DE102012111123A1 Licht emittierendes Halbleiterbauelement Light-emitting semiconductor component
03/27/2014DE102012109183A1 Optoelektronische Vorrichtung Optoelectronic device
03/27/2014DE102012109159A1 Leiterrahmenverbund, Gehäuseverbund, Baugruppenverbund und Verfahren zum Ermitteln mindestens eines Messwerts einer Messgröße einer elektronischen Baugruppe Lead frame composite, composite housing, module assembly and method for determining at least one measured value of a measurand an electronic assembly
03/27/2014DE102012109158A1 Leuchtelement Light element
03/27/2014DE102012109156A1 Bauteilanordnung und Verfahren zum Herstellen von elektrischen Bauteilen Component arrangement and method for manufacturing of electrical components
03/27/2014DE102012109149A1 Ringlichtmodul und Verfahren zur Herstellung eines Ringlichtmoduls Ring light module and method of producing a ring light module
03/27/2014DE102012109145A1 Ringlichtmodul Ring light module
03/27/2014DE102012109139A1 Gehäuse für ein optoelektronisches Bauelement, Elektronische Baugruppe, Verfahren zum Herstellen von Gehäusen und Verfahren zum Herstellen elektronischer Baugruppen A housing for an optoelectronic component, Electronic module, method for producing housings and methods for making electronic assemblies
03/27/2014DE102012109131A1 Optoelektronische Bauelementevorrichtung, Verfahren zum Herstellen einer optoelektronischen Bauelementevorrichtung und Verfahren zum Betreiben einer optoelektronischen Bauelementevorrichtung Optoelectronic Devices device, method of manufacturing an opto-electronic device components and methods of operating an opto-electronic device components
03/27/2014DE102012109104A1 Beleuchtungseinrichtung, Hinterleuchtung für ein Display oder einen Fernseher und Display oder Fernseher Lighting device backlighting for a display or a display or TV and TV
03/27/2014DE102012109083A1 Optoelectronic component comprises layer sequence with active layer, which emits electromagnetic primary radiation, conversion element and passivation layer
03/27/2014DE102012109028A1 Optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils An optoelectronic semiconductor device and method for producing an optoelectronic semiconductor component,
03/27/2014DE102012109020A1 Conversion element comprises support element having recess which extends from first major surface to second major surface of element, and conversion agent to convert primary radiation incident on conversion agent into secondary radiation
03/27/2014DE102012108107A1 Leuchtdiodenvorrichtung Light emitting diode device
03/27/2014DE102004060708B4 Rotes Fluoreszenzmaterial und Weißlicht emittierende Dioden, die rotes Fluoreszenzmaterial verwenden Red fluorescent material and white light-emitting diodes using red fluorescent material
03/27/2014CA2827248A1 Compounds and methods for enhancing metal luminescence that can be selectively turned off
03/26/2014EP2711997A1 Light emitting device package
03/26/2014EP2711996A2 Ultraviolet light emitting device
03/26/2014EP2711995A1 Light-emitting device and method for manufacturing same
03/26/2014EP2711994A2 Light emitting diode
03/26/2014EP2711993A1 Light emitting device and illumination apparatus
03/26/2014EP2711992A2 Light emitting diode package and method for manufacturing same
03/26/2014EP2711991A1 Method for manufacturing gallium nitride-based film chip
03/26/2014EP2711410A1 Fluorescent substance, light-emitting device and method for producing fluorescent substance
03/26/2014EP2711409A1 Process for producing red phosphor
03/26/2014EP2710645A1 Semicondutor light emitting diode
03/26/2014EP2710644A1 Optoelectronic semiconductor module and display having a plurality of such modules
03/26/2014EP2710643A1 Gap engineering for flip-chip mounted horizontal leds
03/26/2014EP2710634A2 In-series electrical connection of light-emitting nanowires
03/26/2014CN203503711U Copper-covered AlSiC composite radiating substrate
03/26/2014CN203503710U Heat radiation structure for multi-chip board packaging module
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