Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
03/2014
03/26/2014CN103682015A Molybdenum doped indium oxide conductive film, preparation method and application thereof
03/26/2014CN103682014A LED with surface microstructure and manufacturing method thereof
03/26/2014CN103682013A Method for preparing nano-scale spherical structure on surface of light-emitting diode
03/26/2014CN103682012A Deep UV (Ultraviolet) LED and preparation method thereof
03/26/2014CN103682011A Semiconductor light-emitting device and fabricating method thereof
03/26/2014CN103682010A LED chip and preparation method
03/26/2014CN103682009A Nitride semiconductor wafer, nitride semiconductor device, and method for manufacturing nitride semiconductor wafer
03/26/2014CN103682008A Nitride semiconductor wafer, nitride semiconductor device, and method for manufacturing nitride semiconductor wafer
03/26/2014CN103682007A Pre-cutting a back side of a silicon substrate for growing better III-V group compound layer on a front side of the substrate
03/26/2014CN103682006A LED (light emitting diode) structure and manufacturing method thereof
03/26/2014CN103682005A LED epitaxial growth process
03/26/2014CN103682004A Light emitting diode flip chip for improving light-out rate and preparation method thereof
03/26/2014CN103682003A AlGaInP LED (Light-Emitting Diode) chip for processing window layer sidewall slope with wet method
03/26/2014CN103682002A Group III nitride semiconductor light-emitting device and method for producing same
03/26/2014CN103682001A Group iii nitride semiconductor light-emitting device
03/26/2014CN103682000A III-V group compound devices with improved efficiency and droop rate
03/26/2014CN103681999A Photonic Devices with Embedded Hole Injection Layer to Improve Efficiency and Droop Rate
03/26/2014CN103681998A Multiple quantum well layer structure
03/26/2014CN103681997A LED chip capable of emitting light in required color and manufacturing method thereof
03/26/2014CN103681996A UV (Ultraviolet) LED and preparation method thereof
03/26/2014CN103681995A Led chip preparation method and led chip
03/26/2014CN103681994A Light emitting device
03/26/2014CN103681993A Method for producing group III nitride semiconductor light-emitting device
03/26/2014CN103681992A Semiconductor substrate, semiconductor device and semiconductor substrate manufacturing method
03/26/2014CN103681991A Silicone lens for LED (Light Emitting Diode) packaging and manufacturing method thereof
03/26/2014CN103681990A LED packaged piece and manufacturing method thereof
03/26/2014CN103681989A Preparation method for nanometer titanate layer on light emitting surface of LED
03/26/2014CN103681988A LED standard square sheet and manufacturing method thereof
03/26/2014CN103681987A Method for blending fluorescent adhesive for LED
03/26/2014CN103681986A GaN-based light emitting diode epitaxial wafer and preparation method thereof
03/26/2014CN103681985A Light-emitting diode epitaxial wafer and manufacture method thereof
03/26/2014CN103681984A Disassembling method for sealing member of light-emitting device and light-emitting device with detachable sealing member
03/26/2014CN103681983A Method for coating fluorescent powder layer on light emitting element and air injection device
03/26/2014CN103681982A Method for manufacturing light-emitting diode
03/26/2014CN103681981A A method for producing a power light emitting diode
03/26/2014CN103681980A A method for cutting light emitting diodes with back-plated reflecting layers
03/26/2014CN103681979A Light-emitting diode and modulation method for luminous efficiency and intensity of light-emitting diode
03/26/2014CN103681978A White LED package method and white LED using package method
03/26/2014CN103681977A Method for preparing low-damage patterned substrate capable of improving light emitting stability of GaN-LED
03/26/2014CN103681726A Light-emitting diodes substrate array
03/26/2014CN103681649A Proximity sensor package and packing method thereof
03/26/2014CN103681644A High voltage LED with improved heat dissipation and light extraction
03/26/2014CN103681643A LED packaging method and LED packaging device
03/26/2014CN103681629A Light emitting diode device
03/26/2014CN103681493A Wafer cutting method
03/26/2014CN103680677A Low firing temperature copper composition
03/26/2014CN103680340A Integrated LED display encapsulated module suitable for ultrahigh display density
03/26/2014CN103680335A Display device and light-emitting element
03/26/2014CN103672810A LED (light-emitting diode)-PCB (printed circuit board) combined double-faced conductive radiator
03/26/2014CN103672771A Light-emitting device and method of manufacturing the same
03/26/2014CN103668460A Group 13 nitride crystal, group 13 nitride crystal substrate, and method of manufacturing group 13 nitride crystal
03/26/2014CN103666473A Method for preparing europium ion doped lanthanum aluminum long afterglow light-emitting film
03/26/2014CN103666470A Fluorescent substance, light-emitting device and method for producing fluorescent substance
03/26/2014CN103666467A Halogenated oxycarbidonitride phosphor and devices using same
03/26/2014CN103666466A Oxycarbidonitride phosphor and devices using same
03/26/2014CN103666367A LED (light-emitting diode) organosilicon pouring sealant and application thereof
03/26/2014CN103665886A LED (light emitting diode) encapsulation material composition and preparation method thereof
03/26/2014CN103665879A Organic silicon gel composition for high-power LED (light-emitting diode) packaging
03/26/2014CN102977884B Phosphors and white light emitting devices utilizing the same
03/26/2014CN102610712B Light emitting diode (LED) package method and structure
03/26/2014CN102569572B High bright light emitting diode
03/26/2014CN102516500B Organic silicon modified epoxy resin for packaging LED (Light Emitting Diode), and preparation method and application thereof
03/26/2014CN102504811B Blue-violet light excited 660-nanometer red fluorescent material and high-temperature microwave preparation method thereof
03/26/2014CN102428138B Encapsulant compositions, methods of manufacture and uses thereof
03/26/2014CN102349169B LED module for modified lamps and modified LED lamp
03/26/2014CN102299132B Package for semiconductor device, and method for manufacturing the same and semiconductor device
03/26/2014CN102208402B High-color-rendering light-emitting diode (LED) chip module, white light LED device and manufacturing method thereof
03/26/2014CN102171843B Adapted semiconductor light emitting device and method for manufacturing the same
03/26/2014CN102169937B Light emitting diode, light emitting diode package, method of manufacturing light emitting diode and illumination system
03/26/2014CN102143986B Siloxane compound, curable resin composition, cured object obtained therefrom, and photosemiconductor element
03/26/2014CN101969092B Metal substrate photonic quasi-crystal HB-LED (High-Brightness Light Emitting Diode) chip in vertical structure as well as manufacturing method and application thereof
03/26/2014CN101949058B Group III nitride semiconductor free-standing substrate and method of manufacturing the same, group III nitride semiconductor device and method of manufacturing the same
03/26/2014CN101807643B Light-emitting device
03/26/2014CN101752471B Photoelectric element
03/26/2014CN101740696B Semiconductor light emitting device
03/26/2014CN101626058B Group III nitride based semiconductor light emitting element and epitaxial wafer
03/25/2014US8680586 Semiconductor light emitting device including GaAs substrate and method for manufacturing the same
03/25/2014US8680575 Semiconductor device and method of fabrication
03/25/2014US8680572 Microdisplay packaging system
03/25/2014US8680571 Gallium nitride based light emitting diode
03/25/2014US8680570 Gallium nitride devices with vias
03/25/2014US8680569 Method for manufacturing gallium oxide based substrate, light emitting device, and method for manufacturing the light emitting device
03/25/2014US8680568 Semiconductor light-emitting device
03/25/2014US8680567 Electronic devices with yielding substrates
03/25/2014US8680566 Semiconductor light emitting device including oxide layers with different oxygen contents
03/25/2014US8680565 Light emitting diode and flip-chip light emitting diode package
03/25/2014US8680564 Group III nitride semiconductor light-emitting device
03/25/2014US8680563 Optoelectronic component and method for the production thereof
03/25/2014US8680562 Light emitting device
03/25/2014US8680561 Semiconductor light emitting device and method for manufacturing same
03/25/2014US8680560 LED and LED package
03/25/2014US8680559 Light emitting diode having electrode extensions for current spreading
03/25/2014US8680558 Light-emitting dies incorporating wavelength-conversion materials and related methods
03/25/2014US8680557 Producing method of light emitting diode device and light emitting diode element
03/25/2014US8680556 Composite high reflectivity layer
03/25/2014US8680555 Semiconductor light emitting device
03/25/2014US8680553 Light-emitting device, light-receiving device and method of manufacturing the same
03/25/2014US8680552 Light emitting device package including light emitting diode, and lighting system having the same
03/25/2014US8680551 High power ultraviolet light sources and method of fabricating the same
03/25/2014US8680549 Semiconductor light-emitting device and lighting instrument employing the same
1 ... 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ... 994