Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
02/2014
02/20/2014DE102012214487A1 Band-shaped light emitting module e.g. LED module has two portions that are formed separately and bonded directly, so that shining tape encapsulated into polymeric material of first portion is formed downstream to second portion
02/20/2014DE102012214484A1 Verfahren zum Herstellen eines bandförmigen Leuchtmoduls A method of manufacturing a band-shaped light-emitting module
02/20/2014DE102012107578A1 Optoelectronic component for light generation in optical position measuring device, has LED chip for emitting light, and masking article arranged above LED chip to mask light emitted by LED chip
02/19/2014EP2698832A2 Semiconductor light emitting device
02/19/2014EP2698661A1 Illumination light generation apparatus
02/19/2014EP2697837A2 Solid state lighting device including green shifted red component
02/19/2014EP2697836A1 Led wavelength-converting structure including a textured thin film structure
02/19/2014EP2697835A1 Method for producing a semiconductor body
02/19/2014EP2697561A1 Device and method for manipulating an emission characteristic of a light-emitting diode
02/19/2014CN203445158U Light-emitting diode module using metal substrate printed circuit board having heat radiation pattern
02/19/2014CN203445157U Directly-surface mounted type LED lamp bead
02/19/2014CN203445156U Led引线框架 Led lead frame
02/19/2014CN203445155U LED lead frame
02/19/2014CN203445154U LED flip chip packaging device and packaging structure using same
02/19/2014CN203445153U Light focusing structure of light source and light focusing type COB (Chip On Board) light source
02/19/2014CN203445152U Novel pasting LED light source packaging structure
02/19/2014CN203445151U LED package structure
02/19/2014CN203445150U High-heat-radiation LED lamp based on COB technology
02/19/2014CN203445149U Novel high-power LED packaging structure
02/19/2014CN203445148U Infrared light emitting diode packaging structure suitable for SMT process
02/19/2014CN203445147U LED substrates and LED light sources composed thereof
02/19/2014CN203445146U Directly-surface mounted type LED support
02/19/2014CN203445145U Led光源 Led light
02/19/2014CN203445144U Flip-chip light-emitting diode with Bragg reflecting layer
02/19/2014CN203445143U Light-emitting diode structure for reducing defect density of blue light LED
02/19/2014CN203445142U Blue LED epitaxial structure with asymmetric barrier layer
02/19/2014CN203445141U Impressing apparatus
02/19/2014CN203445117U Led封装结构及汽车车灯 Led package structure and car headlights
02/19/2014CN203445116U Planar silicon diode array
02/19/2014CN203444719U LED display module of arc-shaped structure
02/19/2014CN203444717U LED display screen panel with high pixel density
02/19/2014CN203442629U LED ceiling lamp based on COB technology
02/19/2014CN203442506U Integrated photoelectricity engine module
02/19/2014CN203437818U A processing device capable of increasing sapphire laser back wet etching rate
02/19/2014CN103597622A Semiconductor nanoparticle-based materials for use in light emitting diodes, optoelectronic displays and the like
02/19/2014CN103597621A Method for manufacturing light emitting device and mixed phosphor solution
02/19/2014CN103597620A Optoelectronic semiconductor chip, display having such a semiconductor chip, and use of such a semiconductor chip or display
02/19/2014CN103597619A Method for manufacturing element
02/19/2014CN103597618A Light emitting device with dislocation bending structure
02/19/2014CN103597617A High emission power and low efficiency droop semipolar blue light emitting diodes
02/19/2014CN103597616A Led器件 Led device
02/19/2014CN103597054A Red phosphor and light-emitting element
02/19/2014CN103594615A 大功率led模组 High power led module
02/19/2014CN103594614A Chip (wafer) heat radiation double metal post used for light source
02/19/2014CN103594613A Forward-installed LED chip without bonding wire and packaging method of forward-installed LED chip
02/19/2014CN103594612A LED illuminating lamp
02/19/2014CN103594611A 发光模块 The light emitting module
02/19/2014CN103594610A Remote fluorescence piece used for LED and manufacturing method
02/19/2014CN103594609A High-color-rendering-index white-light LED manufacturing method
02/19/2014CN103594608A White light LED, backlight module and manufacturing method of white light LED
02/19/2014CN103594607A 照明装置 Lighting device
02/19/2014CN103594606A Frisbee-shaped support of LED
02/19/2014CN103594605A LED photoelectric component
02/19/2014CN103594604A LED support with electrodes being fully wrapped and packaged, SMD LED lamp and manufacturing method thereof
02/19/2014CN103594603A Novel SMD-LED support, paster type LED, manufacturing method of paster type LED and manufacturing method of SMD-LED support
02/19/2014CN103594602A SMD-LED support with insulating material pasted, SMD-LED with insulating material pasted, and manufacturing methods of SMD-LED support with insulating material and SMD-LED with insulating material pasted
02/19/2014CN103594601A Light emitting diode structure
02/19/2014CN103594600A Light-emitting device
02/19/2014CN103594599A A SMD light emitting diode device with high reliability and high brightness
02/19/2014CN103594598A Light emitting diode
02/19/2014CN103594597A Lamination electrode on light-emitting device
02/19/2014CN103594596A Method for manufacturing laminated electrode
02/19/2014CN103594595A Light-emitting device with improved electrode structures
02/19/2014CN103594594A Flip-chip light-emitting diode with coarsened transparent electrodes
02/19/2014CN103594593A Manufacture method of flip-chip light-emitting diode with coarsened transparent electrodes
02/19/2014CN103594592A Flip-chip light-emitting diode with coarsened transparent electrodes
02/19/2014CN103594591A Manufacture method of flip-chip light-emitting diode with coarsened transparent electrodes
02/19/2014CN103594590A Method for manufacturing flip-chip light emitting diode
02/19/2014CN103594589A Light emitting diode
02/19/2014CN103594588A Wire bonding electrode of light emitting diode
02/19/2014CN103594587A Method for manufacturing wire bonding electrode of light emitting diode
02/19/2014CN103594586A Method for manufacturing electrode structure with roughened surface
02/19/2014CN103594585A Step-type light-emitting diode
02/19/2014CN103594584A Semiconductor light emitting device, method of manufacturing same and light emitting apparatus
02/19/2014CN103594583A Flip-chip light emitting diode
02/19/2014CN103594582A High-light-emitting-efficiency vertical type light-emitting diode
02/19/2014CN103594581A Manufacturing method of flatbed light-emitting diode
02/19/2014CN103594580A High-brightness LED graphical machining method
02/19/2014CN103594579A Epitaxial structure of nitride light emitting diode
02/19/2014CN103594578A Semiconductor light emitting device
02/19/2014CN103594577A Semiconductor light emitting element and light emitting device
02/19/2014CN103594576A Light-emitting device
02/19/2014CN103594575A Double-laminated-layer electrode light-emitting device
02/19/2014CN103594574A Semiconductor light emitting device
02/19/2014CN103594573A Multiple quantum well structure of high-brightness LED
02/19/2014CN103594572A Alternating-current light-emitting device
02/19/2014CN103594571A Packaging method for LED fluorescent powder and packaging die used for same
02/19/2014CN103594570A Epitaxial growth method for LED structure containing superlattice barrier layer and structure body of LED structure
02/19/2014CN103594569A Manufacture method of flip-chip light-emitting diode with coarsened transparent electrodes
02/19/2014CN103594568A 半导体器件及其制作方法 Semiconductor device and manufacturing method thereof
02/19/2014CN103594567A Method for manufacturing high-light-emitting-efficiency vertical type light-emitting diode
02/19/2014CN103594566A Method for manufacturing light emitting device, method for adjusting chromaticity of light emitting device and apparatus for adjusting chromaticity of light emitting device
02/19/2014CN103594565A Method of manufacturing light emitting diode
02/19/2014CN103594464A COB packaging structure of light-emitting diode
02/19/2014CN103594463A Integrated LED displaying packaging module with LED chips arranged in wafers in inverted mode
02/19/2014CN103594462A LED integration packaging structure and packaging method thereof
02/19/2014CN103594461A Diodes, printable compositions of a liquid or gel suspension of diodes or other two-terminal integrated circuits, and methods of making same
02/19/2014CN103594460A Diodes, printable compositions of a liquid or gel suspension of diodes or other two-terminal integrated circuits, and methods of making same
02/19/2014CN103594459A LED lamp heat dissipation chip binding frame method with good cooling performance
02/19/2014CN103594403A Water transmission device and semiconductor device provided with same
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