Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
04/2014
04/16/2014CN203553215U Uniform light mixing color temperature adjustable type chip carrier
04/16/2014CN203553214U LED filament
04/16/2014CN203553213U LED packaging structure
04/16/2014CN203553212U Composable wafer direct packaging COB support
04/16/2014CN203553211U Light-emitting diode support
04/16/2014CN203553210U Flip-chip LED support and LED light
04/16/2014CN203553209U Novel LED packaging body
04/16/2014CN203553208U Forward mounting LED packaging composition and LED lamp strip
04/16/2014CN203553207U LED chip packaging body with glass substrate
04/16/2014CN203553206U Secondary injection molding type LED bracket
04/16/2014CN203553205U LED (Light Emitting Diode) tube chip and LED tube
04/16/2014CN203553204U LED tube baking device
04/16/2014CN203553203U Etching basket for LED chip
04/16/2014CN203553202U Pressing block for hot-pressing turning technology for wafer of light emitting diode
04/16/2014CN203553176U Multi-chip diode
04/16/2014CN203553168U Wafer inverted integrated LED display package module
04/16/2014CN203553166U Novel LED light source
04/16/2014CN203553165U Improved LED silica gel luminous chip structure
04/16/2014CN203553164U High color rendering led filament
04/16/2014CN203553163U Improved LED silica gel chip packaging structure
04/16/2014CN203553162U High luminous efficiency high-power integrated LED with uniform light spot
04/16/2014CN203553161U Upside-down mounting LED lamp strip
04/16/2014CN203553160U Forward mounting LED lamp strip
04/16/2014CN203553159U High-colour-rendering-index LED (light-emitting diode) lamp
04/16/2014CN203553158U Self-heat-dissipation light emitting diode (LED) light source
04/16/2014CN203549480U Public-pole side lighting device
04/16/2014CN103733368A Techniques for manufacturing planar patterned transparent contact and/or electronic devices including same
04/16/2014CN103733364A Semiconductor chip that emits polarized radiation
04/16/2014CN103733363A Wavelength conversion body and method for manufacturing same
04/16/2014CN103733362A LED device having improved luminous efficacy
04/16/2014CN103733361A Glass ceramic body, substrate for mounting light-emitting element, and light-emitting device
04/16/2014CN103733360A Light emitting diode and method of manufacturing same
04/16/2014CN103733359A Method for manufacturing a semiconductor light-emitting element and semiconductor light-emitting element manufactured thereby
04/16/2014CN103733335A LED mixing chamber with reflective walls formed in slots
04/16/2014CN103733308A Nitride semiconductor structure and method of fabricating same
04/16/2014CN103733244A Light-emitting device, display apparatus, illumination apparatus, and electricity-generating apparatus
04/16/2014CN103732809A Method for peeling group 13 element nitride film
04/16/2014CN103732640A Acrylate-based composition
04/16/2014CN103732557A Glass ceramic body, substrate for mounting light-emitting element, and light-emitting device
04/16/2014CN103732354A Method for producing ceramic composite for photoconversion
04/16/2014CN103731208A Transmission device and reception device for visible light communication
04/16/2014CN103730603A Method for encapsulating organic light-emitting device and organic light-emitting body
04/16/2014CN103730567A LED device and manufacturing method thereof
04/16/2014CN103730566A Light-emitting device
04/16/2014CN103730565A Aluminum nitride Chip On Board (COB) light-emitting diode (LED) light source and packaging method thereof
04/16/2014CN103730564A Semiconductor support
04/16/2014CN103730563A LED support and electronic device using same
04/16/2014CN103730562A Light emitting diode with heat release effect
04/16/2014CN103730561A Lighting apparatus production
04/16/2014CN103730560A Light-emitting diode structure
04/16/2014CN103730559A Method for arranging LED arrays and LED arrays arranged on PCB
04/16/2014CN103730558A LED adopting composite transparent conducting layer and preparation method thereof
04/16/2014CN103730557A Light-emitting diode with novel P-type electron barrier layer structure and growth method
04/16/2014CN103730556A Light-emitting diode chip and manufacturing method thereof
04/16/2014CN103730555A Nitride semiconductor light-emitting device
04/16/2014CN103730554A Growing method for GaN-based LED epitaxial wafer
04/16/2014CN103730553A Nitride semiconductor structure
04/16/2014CN103730552A Epitaxial growth method for improving LED light emitting efficiency
04/16/2014CN103730551A Semiconductor light emitting element and light emitting device
04/16/2014CN103730550A Manufacture method of current blocking layer and corresponding light-emitting diode (LED) chip
04/16/2014CN103730549A SiC-substrate-based perpendicular structural GaN-based ultraviolet LED (Light Emitting Diode) and production method thereof
04/16/2014CN103730548A Method for utilizing high-temperature oxidation gas to recycle patterned sapphire substrate
04/16/2014CN103730547A LED chip manufacturing method
04/16/2014CN103730546A LED structure with high light extraction efficiency and manufacturing method thereof
04/16/2014CN103730545A Manufacturing method of AlGaN-based vertical structure deep ultraviolet LED
04/16/2014CN103730544A Method for separating growth substrate, method for manufacturing light-emitting diode, and light-emitting diode
04/16/2014CN103730543A Manufacturing method for light emitting diode and light emitting diode manufactured through manufacturing method
04/16/2014CN103730480A Manufacturing method and structure of high-voltage-driven inverted LED thin film chips
04/16/2014CN103730479A GaN-based LED integrated chip with multiple light-emitting sub areas
04/16/2014CN103730454A LED with functions of adjusting color temperature and improving color rendering
04/16/2014CN103730377A Method of die bonding and apparatus thereof
04/16/2014CN103728683A Display substrate and manufacturing method thereof
04/16/2014CN103727438A LED lamp and manufacturing method
04/16/2014CN103727431A LED lamp
04/16/2014CN103725249A LED (Light Emitting Diode) packaging silica gel with high refraction index
04/16/2014CN103724940A Flowable resin premix
04/16/2014CN103724939A Packaged diode
04/16/2014CN103724519A Photocurable composition for packaging organic light emitting apparatus, encapsulated device and encapsulated apparatus
04/16/2014CN103013505B Preparation method of single-substrate fluorescent powder for white-light LEDs (light-emitting diodes)
04/16/2014CN102844898B LED lighting device
04/16/2014CN102796381B Condensation type RTV silicone rubber composition with matte surface, its preparation method and application
04/16/2014CN102775790B LED (light-emitting diode) packaging adhesive and production method thereof
04/16/2014CN102709406B Manufacturing method for copper substrate light emitting diode (LED) with cleavability
04/16/2014CN102695558B UV-irradiation apparatus
04/16/2014CN102643551B Organic silicon semiconductor packaging adhesive composition
04/16/2014CN102604635B Zirconium-phosphate-based luminescent material, preparation method thereof, and application thereof
04/16/2014CN102549071B Liquid-crystal polyester resin composition, molded object thereof, and optical device
04/16/2014CN102427109B Auxiliary part and connecting circuit of light source
04/16/2014CN102412354B White light-emitting diode (LED) epitaxial structure and manufacturing method thereof, and white LED chip structure
04/16/2014CN102290504B Chip-on-board (COB) packaged light-emitting diode (LED) module based on high-thermal-conductivity substrate flip-chip bonding technique and production method
04/16/2014CN102290347B Etching system
04/16/2014CN102255035B Multi-LED chip packaging structure on substrate
04/16/2014CN102252299B Radiating system for light-emitting diode (LED) lamp and LED lamp
04/16/2014CN102203942B Lighting device using solid state light emitting devices having a transparent heat sink
04/16/2014CN102163667B Semiconductor light-emitting structure
04/16/2014CN102099894B Methods of fabricating semiconductor structures or devices using layers of semiconductor material having selected or controlled lattice parameters
04/16/2014CN102074634B Light emitting device and light emitting device package
04/16/2014CN102064268B Light-emitting diode packaging structure
04/16/2014CN101926014B Semiconductor device package
04/16/2014CN101728474B Manufacturing technology of high heat-conductivity high-power LED substrate
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