Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
02/2014
02/27/2014US20140054634 Silicate phosphor exhibiting high light emission characteristics and moisture resistance, and light emitting device
02/27/2014US20140054633 Light emitting device
02/27/2014US20140054632 Silicone coated light-emitting diode
02/27/2014US20140054631 Led array
02/27/2014US20140054629 Light emitting device and lighting system having the same
02/27/2014US20140054628 Substrate, light-emitting device, and lighting apparatus
02/27/2014US20140054627 Semiconductor light-emitting device
02/27/2014US20140054625 Vertical light emitting diodes
02/27/2014US20140054623 Semiconductor light-emitting device
02/27/2014US20140054622 Light emitting package
02/27/2014US20140054621 Semiconductor light-emitting device including transparent plate with slanted side surface
02/27/2014US20140054619 Method and Apparatus for Packaging Phosphor-Coated LEDS
02/27/2014US20140054618 Light-emitting diode devices
02/27/2014US20140054616 Method and Apparatus for Fabricating Phosphor-Coated LED Dies
02/27/2014US20140054613 Light-Emitting Transistors with Improved Performance
02/27/2014US20140054605 Composite Substrates, Light Emitting Devices and a Method of Producing Composite Substrates
02/27/2014US20140054599 Flexible semiconductor devices and methods of manufacturing the same
02/27/2014US20140054594 Semiconductor light emitting device
02/27/2014US20140054583 Display device and method for manufacturing the same
02/27/2014US20140054582 Display device
02/27/2014US20140054554 Organic light emitting diode display device
02/27/2014US20140054544 Light emitting device
02/27/2014US20140054543 Light emitting device
02/27/2014US20140054542 Light emitting device, light emitting device package and lighting system
02/27/2014US20140054541 Method of manufacturing quantum dot device, quantum dot device manufactured by using the method, and method of measuring electron mobility of quantum dot device
02/27/2014US20140054540 Device including semiconductor nanocrystals & method
02/27/2014US20140054078 Lead Frame Base Plate for Light Emitting Device and Manufacturing Method of Light Emitting Device Using the Same
02/27/2014DE102013013856A1 LED for use in e.g. daytime running lamp of vehicle, has dielectric layer made from dielectric material e.g. plastic, glass or ceramics, and forming light exit surface of LED, where layer is directly arranged on phosporous element
02/27/2014DE102012215067A1 Method for producing isolated semiconductor devices e.g. LED, involves carrying out etching process for cutting the substrate in separation areas formed in substrate through recess walls, and forming isolated semiconductor devices
02/27/2014DE102012110836A1 Optoelektronischer Halbleiterchip und Verfahren zur Herstellung von optoelektronischen Halbleiterchips The optoelectronic semiconductor chip and method for the production of optoelectronic semiconductor chips
02/27/2014DE102012107829A1 Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements Optoelectronic component and process for producing an optoelectronic component
02/27/2014DE102012107797A1 Verfahren zur Herstellung eines Licht emittierenden Halbleiterbauelements und Licht emittierendes Halbleiterbauelement A process for preparing a semiconductor light-emitting device and light-emitting semiconductor component
02/27/2014DE102012107795A1 Optoelektronischer Halbleiterkörper und optoelektronischer Halbleiterchip The optoelectronic semiconductor body and optoelectronic semiconductor chip
02/26/2014EP2701216A2 Light emitting device
02/26/2014EP2701215A1 Light-emitting apparatus, backlight unit, liquid crystal display apparatus, and illumination apparatus
02/26/2014EP2701214A1 Light emitting device and method for manufacturing same
02/26/2014EP2701213A1 White light source and white light source system using same
02/26/2014EP2701212A2 Light emitting diode
02/26/2014EP2701211A2 Light emitting device
02/26/2014EP2701210A2 Light emitting device
02/26/2014EP2701205A1 Method of manufacturing quantum dot device, quantum dot device manufactured by using the method, and method of measuring electron mobility of quantum dot device
02/26/2014EP2701193A2 Light emitting device
02/26/2014EP2701183A1 Structure for growth of nitride semiconductor layer, stacked structure, nitride-based semiconductor element, light source, and manufacturing method for same
02/26/2014CN203456511U Lamp board based on LED wafer structure
02/26/2014CN203456510U LED enamelled substrate
02/26/2014CN203456509U High-efficiency white-light LED device packaging structure
02/26/2014CN203456508U Led透镜 Led lens
02/26/2014CN203456507U Light emitting diode suitable for ultraviolet source
02/26/2014CN203456506U Novel LED structure
02/26/2014CN203456505U LED structure
02/26/2014CN203456504U 发光二极管显示装置 Light-emitting diode display device
02/26/2014CN203456503U Light emitting diode, backlight and display device
02/26/2014CN203456502U Plug-in LED frame structure
02/26/2014CN203456501U COB packaging structure based on LED wafer structure
02/26/2014CN203456500U COB aluminium substrate
02/26/2014CN203456499U LED metal material belt and LED base structure provided with same
02/26/2014CN203456498U LED bracket
02/26/2014CN203456497U LED lamp?bracket
02/26/2014CN203456496U High-heat radiation LED lamp?bracket
02/26/2014CN203456495U Led芯片 Led chip
02/26/2014CN203456494U Flip-chip LED chip
02/26/2014CN203456493U LED wafer structure
02/26/2014CN203456458U Heat radiation type high-power LED apparatus
02/26/2014CN203456457U SMD LED structure characterized by polycrystalline packaging
02/26/2014CN203456456U LED structure characterized by polycrystalline packaging
02/26/2014CN203456455U 发光二极管显示屏 LED display
02/26/2014CN203456454U Integrated LED?structure capable of giving out light of any color
02/26/2014CN203456453U LED with all faces shining
02/26/2014CN203456443U Lead frame assembly and lead frame thereof
02/26/2014CN103608941A Method for producing a lighting device and lighting device
02/26/2014CN103608940A Lighting fixture with cooling flow channel
02/26/2014CN103608939A Light emitting devices having shielded silicon substrates
02/26/2014CN103608938A Semiconductor light-emitting device, exhibit irradiation illumination device, meat irradiation illumination device, vegetable irradiation illumination device, fresh fish irradiation illumination device, general-use illumination device, and semiconductor light-emitting system
02/26/2014CN103608937A Ultra small LED and method for manufacturing same
02/26/2014CN103608936A Method for producing a plurality of optoelectronic semiconductor chips
02/26/2014CN103608921A LED array having embedded LED and method therefor
02/26/2014CN103608920A LED array comprising scattering portions on LEDs and method of manufacturing same
02/26/2014CN103608407A Composition having high refraction
02/26/2014CN103606622A LED integrated-type light source
02/26/2014CN103606621A Ceramic heat dissipation body LED lamp body structure
02/26/2014CN103606620A Led封装结构 Led package structure
02/26/2014CN103606619A Near ultraviolet light-emitting diode capable of promoting growth of plants and preparing method thereof
02/26/2014CN103606618A Light emitting diode light bar and packaging method thereof
02/26/2014CN103606617A Flip-chip light emitting diode with transparent electrode
02/26/2014CN103606616A LED packaging process
02/26/2014CN103606615A Ceramic surface LED-mounted encapsulation structure and encapsulation method thereof
02/26/2014CN103606614A Fluorescent plate used for white-light LED and preparation process of fluorescent plate
02/26/2014CN103606613A Flip-chip light emitting diode with symmetrical electrodes, and preparation method thereof
02/26/2014CN103606612A Electrode structure of light-emitting diode
02/26/2014CN103606611A Vertical light emitting diode with high light extraction efficiency
02/26/2014CN103606610A Electrode structure of light-emitting diode
02/26/2014CN103606609A Manufacturing method of light emitting diode electrode
02/26/2014CN103606608A Vertical type light emitting diode with high light-emitting efficiency
02/26/2014CN103606607A Electrode structure with coarsened surface
02/26/2014CN103606606A Method of forming electrode bonding structure
02/26/2014CN103606605A Platform type light-emitting diode
02/26/2014CN103606604A Manufacturing method for light emitting diode
02/26/2014CN103606603A Preparation method for SiC-substrate GaN-based LED
02/26/2014CN103606602A Method for manufacturing semiconductor chip
02/26/2014CN103606601A Manufacturing method of step type light-emitting diode
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