Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
03/2014
03/26/2014CN203503709U Circuit board and light emitting product
03/26/2014CN203503708U Sapphire base LED encapsulation structure
03/26/2014CN203503707U Paster LED
03/26/2014CN203503706U Novel packaging structure of direct inserting round end LED
03/26/2014CN203503705U White-light LED packaging structure and white-light lighting device thereof
03/26/2014CN203503704U LED lamp and support pedestal thereof
03/26/2014CN203503703U LED packaging gel application structure
03/26/2014CN203503702U Leadless packaged light emitting diode
03/26/2014CN203503701U Flexible led light source filament
03/26/2014CN203503700U SMD LED structure
03/26/2014CN203503699U SMD-based LED packaging structure
03/26/2014CN203503698U High-lighting-effect LED chip for LED lamp
03/26/2014CN203503697U Direct inserting LED
03/26/2014CN203503696U COB type LED
03/26/2014CN203503695U Novel structure of direct inserting LED
03/26/2014CN203503694U LED support convenient to test
03/26/2014CN203503693U Power type LED packaging structure
03/26/2014CN203503692U Light-emitting device and lamp structure
03/26/2014CN203503691U SMT type LED structure
03/26/2014CN203503690U LED lamp with ceramic heat radiation substrate
03/26/2014CN203503689U Flip-chip-type LED chip
03/26/2014CN203503688U LED surface-roughened chip
03/26/2014CN203503687U Improved LED chip
03/26/2014CN203503686U LED chip with high luminous intensity
03/26/2014CN203503685U LED chip with high luminous efficiency
03/26/2014CN203503684U Light emitting diode epitaxial wafer of normal assembly structure
03/26/2014CN203503683U LED (light-emitting diode) chip with multiple light-emitting areas
03/26/2014CN203503682U LED quick crystal separation machine
03/26/2014CN203503654U High-brightness dimmable COB light source
03/26/2014CN203503653U Light-emitting diode chip
03/26/2014CN203503651U Novel high power LED light source
03/26/2014CN103688378A Optical element, optoelectronic component, and method for producing same
03/26/2014CN103688377A Light-emitting device and method for manufacturing same
03/26/2014CN103688375A Resin coating device, and resin coating method
03/26/2014CN103688374A Light emitting module
03/26/2014CN103688373A Illumination device and liquid crystal display device
03/26/2014CN103688372A Gel layers for light emitting diodes and methods of fabricating same
03/26/2014CN103688207A Light-influencing element for influencing the light emission of essentially point light sources and luminaire having a light-influencing element
03/26/2014CN103687925A Red phosphor and light-emitting device comprising same
03/26/2014CN103687897A Compound comprising isocyanuric skeleton, epoxy groups, and organopolysiloxane or silsesquioxane skeleton having sih groups, thermosetting resin composition comprising compound as agent for imparting adhesion, cured product, and sealing member for op
03/26/2014CN103687715A Component with a passageway made by three-dimensional printing
03/26/2014CN103687277A Light-emitting device
03/26/2014CN103682981A Nitride quantum well with polarization compensation mechanism, laser and light emitting diode
03/26/2014CN103682072A High-efficiency low-attenuation high-power white LED package structure
03/26/2014CN103682071A Light emitting device
03/26/2014CN103682070A Light emitting device
03/26/2014CN103682069A Multilayered LED printed circuit board
03/26/2014CN103682068A Light emitting device
03/26/2014CN103682067A Light-emitting device
03/26/2014CN103682066A Light-emitting diode module and manufacturing method thereof
03/26/2014CN103682065A Light-emitting diode device and manufacturing method thereof
03/26/2014CN103682064A Lateral LED and packaging method for lateral LED
03/26/2014CN103682063A Laterally light-emitting LED packaging structure and manufacturing method for laterally light-emitting LED packaging structure
03/26/2014CN103682062A Multi-scale microstructural packaging substrate with fractal feature and manufacturing method thereof
03/26/2014CN103682061A An omnidirectional reflector used for a light-emitting diode
03/26/2014CN103682060A Light-emitting diode lamp source device
03/26/2014CN103682059A Pre-manufacturing method and pre-manufactured structure for LED package
03/26/2014CN103682058A Substrate, display panel, and display apparatus
03/26/2014CN103682057A Light emitting device
03/26/2014CN103682056A Optical structure and illumination device with optical structure
03/26/2014CN103682055A LED packaging module and LED lamp with LED packaging module
03/26/2014CN103682054A Graphene based flexible photoelectric device packaging method
03/26/2014CN103682053A Blue fluorescent adhesive for LED
03/26/2014CN103682052A Light emitting diode
03/26/2014CN103682051A Light emitting diode package structure
03/26/2014CN103682050A LED (Light-Emitting Diode) encapsulating structure and encapsulating method
03/26/2014CN103682049A Waterproof chip LED (Light-Emitting Diode) and production technology thereof
03/26/2014CN103682048A LED (Light-Emitting Diode) package structure and package method
03/26/2014CN103682047A Cover plate for inorganic packaging of LED (Light Emitting Diode)
03/26/2014CN103682046A Ceramic substrate for LED (Light Emitting Diode)
03/26/2014CN103682045A LED packaging cup body processing method and corresponding die
03/26/2014CN103682044A White light LED device with light transmission ceramic chip used as luminous body
03/26/2014CN103682043A Die bonding method for horizontal LED chips and LED light source manufactured by die bonding method
03/26/2014CN103682042A Preparation method for light emitting device and light source
03/26/2014CN103682041A 发光装置 Light-emitting device
03/26/2014CN103682040A Lighting device, illuminating method, and application method for lighting device
03/26/2014CN103682039A Manufacture method of illumination device of automobile
03/26/2014CN103682038A Light emitting device and method for manufacturing same
03/26/2014CN103682037A Light emitting device
03/26/2014CN103682036A 发光装置 Light-emitting device
03/26/2014CN103682035A Wiring board, light-emitting device, and method of manufacturing wiring board
03/26/2014CN103682034A Light emitting module and lens structure thereof
03/26/2014CN103682033A Flip-chip light-emitting diode structure and manufacturing method thereof
03/26/2014CN103682032A LED light emitting device and manufacturing method thereof
03/26/2014CN103682031A Heat radiation baseplate with insulating and radiating layer and manufacturing method thereof
03/26/2014CN103682030A LED, LED device and LED manufacture technology
03/26/2014CN103682029A Light emitting device and lighting device comprising same
03/26/2014CN103682028A Light emitting diode package structure and manufacture method thereof
03/26/2014CN103682027A Light emitting device and manufacture method thereof
03/26/2014CN103682026A Semiconductor light emitting element and method for manufacturing same
03/26/2014CN103682025A Deep UV (Ultraviolet) diode epitaxial wafer, and deep UV diode chip and preparation method thereof
03/26/2014CN103682024A Semiconductor light emitting element
03/26/2014CN103682023A LED (Light Emitting Diode) structure and electrode formation method thereof
03/26/2014CN103682022A LED device structure
03/26/2014CN103682021A LED with metal electrodes adopting array microstructures and manufacturing method thereof
03/26/2014CN103682020A Manufacture method for LED (Light emitting diode) grain
03/26/2014CN103682019A Light-emitting diode and manufacturing method thereof
03/26/2014CN103682018A Light-emitting diode and manufacturing method thereof
03/26/2014CN103682017A Light emitting device
03/26/2014CN103682016A Manufacturing method for GaN epitaxy or substrate
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