Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
04/2014
04/03/2014US20140091356 Light emitting device
04/03/2014US20140091355 Method for forming current diffusion layer in light emitting diode device and method for fabricating the same
04/03/2014US20140091354 Light emitting diode having two separated substrate parts connected together by encapsulation
04/03/2014US20140091353 Vertical structure leds
04/03/2014US20140091352 Light emitting diode
04/03/2014US20140091351 Light emitting diode chip
04/03/2014US20140091350 Semiconductor light emitting device and method for manufacturing same
04/03/2014US20140091349 Optical designs for high-efficacy white-light emitting diodes
04/03/2014US20140091348 Encapsulating sheet-covered semiconductor element, producing method thereof, semiconductor device, and producing method thereof
04/03/2014US20140091347 Phosphor layer attaching kit, optical semiconductor element-phosphor layer attaching body, and optical semiconductor device
04/03/2014US20140091346 Phosphor adhesive sheet, optical semiconductor element-phosphor layer pressure-sensitive adhesive body, and optical semiconductor device
04/03/2014US20140091345 Luminescence device
04/03/2014US20140091344 Illumination component package
04/03/2014US20140091343 Color filter substrate manufacturing method, display device manufacturing method, color filter substrate, and display device
04/03/2014US20140091341 Device and method for an led with a convex cover
04/03/2014US20140091340 Plastic leaded chip carrier with diagonally oriented light sources for fine-pitched display
04/03/2014US20140091339 Semiconductor device, display, and electronic apparatus
04/03/2014US20140091338 Light emitting diode
04/03/2014US20140091337 Light-emitting device, light-emitting device assembly, and electrode-bearing substrate
04/03/2014US20140091335 Light emitting device
04/03/2014US20140091334 Encapsulating sheet-covered semiconductor element, producing method thereof, semiconductor device, and producing method thereof
04/03/2014US20140091333 Light emitting device equipped with protective member
04/03/2014US20140091330 Led package structure with transparent electrodes
04/03/2014US20140091329 LED Emitter with Improved White Color Appearance
04/03/2014US20140091323 Semiconductor epitaxial structure
04/03/2014US20140091291 Array substrate and manufacturing method thereof, oled display device
04/03/2014US20140091290 Encapsulated structure of light-emitting device, encapsulating process thereof and display device comprising encapsulated structure
04/03/2014US20140091280 Array substrate and manufacturing method thereof, display device
04/03/2014US20140091277 Light emitting diode having vertical topology and method of making the same
04/03/2014US20140091276 Light emitting diode
04/03/2014US20140091275 Quantum Dot Light Enhancement Substrate
04/03/2014US20140091266 Material for a molded resin for use in a semiconductor light-emitting device
04/03/2014DE102012217932A1 Optoelectronic component has LEDs whose contact surfaces are electrically contacted with the contact surfaces of Zener diodes that are electrically connected in series, such that the LEDs are electrically connected in series
04/03/2014DE102012113003A1 Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils und optoelektronisches Halbleiterbauteil A method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component
04/03/2014DE102012109274A1 Optoelektronisches Bauelement, Verfahren zum Herstellen eines optoelektronischen Bauelementes, Verfahren zum Betreiben eines optoelektronischen Bauelementes Optoelectronic component, A method of manufacturing an optoelectronic component, A method of operating an optoelectronic component
04/03/2014DE102012109271A1 Optoelektronische Bauelementevorrichtung, Verfahren zum Herstellen einer optoelektronischen Bauelementevorrichtung und ein Verfahren zum Betreiben einer optoelektronischen Bauelementevorrichtung Optoelectronic Devices device, method for manufacturing an optoelectronic components apparatus and method for operating an opto-electronic device components
04/03/2014DE102012109258A1 Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelementes Optoelectronic component and method of manufacturing an optoelectronic component
04/03/2014DE102012109236A1 Method for producing optoelectronic component e.g. solar cell, involves editing optical characteristic of functional layer, so that optoelectronic property of optoelectronic component unit is changed to target property
04/03/2014DE102012109218A1 Verfahren zum Herstellen einer optoelektronischen Baugruppe und optoelektronische Baugruppe A method of manufacturing an optoelectronic assembly and optoelectronic assembly
04/03/2014DE102012109217A1 Beleuchtungsvorrichtung zum Erzeugen einer Lichtemission und Verfahren zum Erzeugen einer Lichtemission A lighting device for generating light emission and a method for generating a light emission
04/03/2014DE102012109216A1 Optoelektronische Baugruppe und Verfahren zum Betreiben einer optoelektronischen Baugruppe The optoelectronic assembly and method of operating an optoelectronic assembly
04/03/2014DE102012105708A1 Optoelectronic semiconductor device manufacturing method, involves separating substrate along main extension plane of substrate for producing optoelectronic semiconductor arrangements such that arrangements partially include layer sequences
04/02/2014EP2713411A2 Luminescence device
04/02/2014EP2713410A1 Light emitting device
04/02/2014EP2713397A2 Optical arrangement and illumination device with an optical arrangement
04/02/2014EP2713396A1 Overlay circuit structure for interconnecting semiconductor light emitting devices
04/02/2014EP2713138A1 Light source and optical coherence tomography apparatus using the same
04/02/2014EP2712908A2 Phosphor adhesive sheet, optical semiconductor element-phosphor layer pressure-sensitive adhesive body, and optical semiconductor device
04/02/2014EP2712905A1 Phosphor layer attaching kit, optical semiconductor element-phosphor layer attaching body, and optical semiconductor device
04/02/2014CN203521476U LED packaging structure with high heat conduction performance
04/02/2014CN203521475U Floating heat radiation copper sheet support used for LED flip chip packaging and LED packaging member
04/02/2014CN203521474U Heat sink for electronic component
04/02/2014CN203521473U Silica-gel structured LED chip
04/02/2014CN203521472U Welding electrode structure of flip-chip LED chip and flip-chip LED chip
04/02/2014CN203521471U Lamp and light-emitting device
04/02/2014CN203521470U LED silica gel chip packaging mould
04/02/2014CN203521469U LED lamp bead with apple green luminescence
04/02/2014CN203521468U Light emitting diode
04/02/2014CN203521467U LED silica gel chip packaging structure
04/02/2014CN203521466U LED comprehensive experiment wafer fixing platform
04/02/2014CN203521465U Led固晶机 Led Bonder
04/02/2014CN203521464U Uniform-luminescence SMD surface mount unit-base backlight
04/02/2014CN203521463U High-thermal conductivity LED-COB packaging substrate
04/02/2014CN203521462U LED integrated light-source module
04/02/2014CN203521461U Semiconductor element covered with case chip and semiconductor device
04/02/2014CN203521460U LED packaging structure with high heat conduction performance
04/02/2014CN203521459U Light-emitting assembly and light-emitting device
04/02/2014CN203521458U Flip-chip LED chip capable of emitting light omnibearingly
04/02/2014CN203521457U LED packaging structure with multi-layer cambered textures
04/02/2014CN203521456U Reflecting layer structure of flip-chip LED chip and flip-chip LED chip
04/02/2014CN203521455U LED chip
04/02/2014CN203521454U Ohmic contact electrode structure of flip-chip LED chip and flip-chip LED chip
04/02/2014CN203521453U Novel cadmium sulfide thin film
04/02/2014CN203521452U LED chip structure for improving light emitting efficiency
04/02/2014CN203521451U Welding protection structure of flip-chip LED chip and flip-chip LED chip
04/02/2014CN203521414U Super-power photoelectric device for balancing thermal field distribution
04/02/2014CN203521408U LED light source based on silver-plated aluminum substrate
04/02/2014CN203517457U Light-emitting diode light bar device and backlight module with light-emitting diode light bar device
04/02/2014CN203517379U Lamp bulb based on inversely-installed LED chips and transparent ceramic substrates
04/02/2014CN203509273U Vertical type hot eutectic device
04/02/2014CN203509272U LED eutectic device compositely heated by hot plate and light waves
04/02/2014CN103703579A Printed wiring board, printed wiring board assembly, method for manufacturing printed wiring board, and illuminating apparatus
04/02/2014CN103703578A Light emitting device, illuminating device, and display device
04/02/2014CN103703577A Reflector for light-emitting diode and housing
04/02/2014CN103703576A Multiple quantum well for ultraviolet light emitting diode and a production method therefor
04/02/2014CN103703575A Power supply device and lighting device
04/02/2014CN103703102A Rare-earth aluminum garnet type fluorescent substance and light-emitting device obtained using same
04/02/2014CN103700758A LED (Light-emitting Diode) package unit, package methods thereof, and array area light source
04/02/2014CN103700757A Surface-mounted LED (light-emitting diode) lead frame and manufacturing method thereof
04/02/2014CN103700756A White light-emitting diode and backlight module
04/02/2014CN103700755A Alternating-current drive LED (light emitting diode) lamp, lead bracket and integral preparation method
04/02/2014CN103700754A LED (Light Emitting Diode) encapsulation piece, backlight module and display device
04/02/2014CN103700753A 360-degree luminous flexible LED (Light-emitting Diode) light bar
04/02/2014CN103700752A Salient point bonding structure of vertical structure LED chip and process
04/02/2014CN103700751A LED (Light-emitting diode) capable of dynamically adjusting visual effect
04/02/2014CN103700750A Light emitting device package
04/02/2014CN103700749A Light-emitting diode and manufacturing method thereof
04/02/2014CN103700748A Light-emitting diode
04/02/2014CN103700747A Light-emitting diode and manufacturing method thereof
04/02/2014CN103700746A Light-emitting semiconductor device
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