Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
02/2014
02/13/2014US20140042387 Semiconductor light-emitting device and manufacturing method thereof
02/13/2014DE10350707B4 Elektrischer Kontakt für optoelektronischen Halbleiterchip und Verfahren zu dessen Herstellung An electrical contact for the optoelectronic semiconductor chip and method of manufacture
02/13/2014DE102013108581A1 Lichtemittierende Halbleitervorrichtung A semiconductor light emitting device
02/13/2014DE102013108560A1 Beleuchtungsvorrichtung Lighting device
02/13/2014DE102012218897A1 LED or LED prototype structure manufacturing method for multicolored LED display, involves limiting active surface of LED by limiting trench, and forming active surface and front side contacting structure to surround limiting trench
02/13/2014DE102012214219A1 LED module used in e.g. medical endoscope, has optical diffusing layer with minimal absorption function, that is arranged in optical path with aperture, and support side portion that is mounted with carrier with light sources
02/13/2014DE102012212963A1 Optoelektronisches Halbleiterbauteil An optoelectronic semiconductor device
02/13/2014DE102012107384A1 Optoelektronisches Halbleiterbauelement und Verfahren zum Herstellen eines Spiegelbereichs auf einem Halbleiterkörper An optoelectronic semiconductor device and method of manufacturing a mirror portion on a semiconductor body
02/13/2014DE102012107290A1 Optoelektronisches Halbleiterbauteil, Konversionsmittelplättchen und Verfahren zur Herstellung eines Konversionsmittelplättchens Optoelectronic semiconductor component, conversion means platelets and methods of making a conversion medium plate
02/12/2014EP2696380A2 Light emitting module and lighting system
02/12/2014EP2696379A2 Light emitting device
02/12/2014EP2696378A1 Light emitting device
02/12/2014EP2696377A1 Light emitting device
02/12/2014EP2696376A2 Current blocking structure for a light emitting diode
02/12/2014EP2696375A2 Light emitting diode
02/12/2014EP2696365A2 Semiconductor buffer structure, semiconductor device including the same, and method of manufacturing semiconductor device using semiconductor buffer structure
02/12/2014EP2695207A1 Optoelectronic semiconductor chip
02/12/2014EP2695189A1 Ceramic printed circuit board comprising an al cooling body
02/12/2014CN203434205U Luminous source for LED lamp
02/12/2014CN203434204U LED packaging structure with asymmetrical rectangular light spot
02/12/2014CN203434203U LED chip cooling strusture
02/12/2014CN203434202U Highly-reliable high-efficiency LED lamp bead
02/12/2014CN203434201U Light-emitting diode (LED) bead
02/12/2014CN203434200U High-power full-angle uniform light-emitting LED light bar with separated fluorescent powder and chip
02/12/2014CN203434199U Led光源 Led light
02/12/2014CN203434198U LED support with double face silver-plated substrate
02/12/2014CN203434197U Multi-primary-color LED eutectic wafer
02/12/2014CN203434196U LED encapsulation structure and LED display screen
02/12/2014CN203434195U Thermoelectricity-separation COB packaging structure
02/12/2014CN203434194U LED stent and copper plate stent
02/12/2014CN203434193U LED packaged by use of AlSiC composite substrate
02/12/2014CN203434192U Bearing heat-radiating plate, and LED light source of remote phosphor structure
02/12/2014CN203434191U Led模块 Led Module
02/12/2014CN203434190U Green chip and red fluorescence powder small module high luminous flux LED package structure
02/12/2014CN203434189U Green chip and red fluorescence powder strip-shaped high strength LED package structure
02/12/2014CN203434188U Phase change support for three-dimensional LED packaging
02/12/2014CN203434187U High-efficiency light-emitting diode (LED) chip
02/12/2014CN203434186U LED chip and LED
02/12/2014CN203434185U LED chip
02/12/2014CN203434184U Green chip and red fluorescence powder small module high refractive index LED package structure
02/12/2014CN203434183U Optimized LED patterned substrate and LED chip
02/12/2014CN203434182U LED eutectic wafer
02/12/2014CN203434181U GaN base LED epitaxial wafer
02/12/2014CN203434159U Insulated structure of GaN-based semiconductor LED chip
02/12/2014CN203434157U Full-color LED chip suitable for high-resolution LED display screen
02/12/2014CN203434156U 360-degree-luminescence LED device
02/12/2014CN203434155U COB surface light source
02/12/2014CN203434130U Packaging device
02/12/2014CN203433762U Arc-shaped LED (light-emitting diode) display panel
02/12/2014CN203425993U Novel dispenser with fluorescent powder thickness vision detector
02/12/2014CN103582958A Method of attaching a light emitting device to a support substrate
02/12/2014CN103582957A Method for arranging a plurality of LEDs in packaging units and packaging unit having a plurality of LEDs
02/12/2014CN103582564A Laminate sheet, application therefor, and method for producing same
02/12/2014CN103579481A Light emitting diode device with enhanced heat dissipation, and the method of preparing the same
02/12/2014CN103579480A Semiconductor device with thermoelectric separation and manufacturing method thereof
02/12/2014CN103579479A Package for heat dissipation type LED lamp
02/12/2014CN103579478A Method for manufacturing flip integrated LED chip light source module
02/12/2014CN103579477A Light emitting diode flip chip packaging method based on through hole technology
02/12/2014CN103579476A Substrate for led module and method for manufacturing the same
02/12/2014CN103579475A 背光组件 Backlight assembly
02/12/2014CN103579474A Light-emitting device
02/12/2014CN103579473A Welding and temperature detecting method for LED element
02/12/2014CN103579472A Light source encapsulation structure
02/12/2014CN103579471A Composite substrate with protection layer preventing metal from diffusion
02/12/2014CN103579470A Light emitting diode lead frame structure and manufacturing method thereof
02/12/2014CN103579469A 半导体发光装置及其制造方法 The semiconductor light emitting device and manufacturing method
02/12/2014CN103579468A LED packaging structure
02/12/2014CN103579467A Wafer class micro-lens coining forming method
02/12/2014CN103579466A 发光装置 Light-emitting device
02/12/2014CN103579465A Method of making light emitting device and light emitting device made thereof
02/12/2014CN103579464A White light LED packaging method and corresponding packaging structure
02/12/2014CN103579463A Light emitting diode package and display apparatus having the same
02/12/2014CN103579462A Light source of LED steering lamp of automobile
02/12/2014CN103579461A Method for manufacturing wafer full-color LED display array
02/12/2014CN103579460A High-brightness white light LED and manufacturing method thereof
02/12/2014CN103579459A LED packaging method
02/12/2014CN103579458A LED packaging structure and method thereof
02/12/2014CN103579457A LED integration packaging structure and method thereof
02/12/2014CN103579456A COB area light source and glue blocking wall manufacturing method thereof
02/12/2014CN103579455A light-emitting device manufacturing method
02/12/2014CN103579454A Producing method of semiconductor device
02/12/2014CN103579453A 发光装置 Light-emitting device
02/12/2014CN103579452A LED light source capable of stimulating fluorescent powder on multiple faces
02/12/2014CN103579451A LED single crystal cup-in-cup support
02/12/2014CN103579450A Light-emitting diode lamp bar
02/12/2014CN103579449A LED material strap with identification structure
02/12/2014CN103579448A Light emitting diode packaging structure
02/12/2014CN103579447A Light-emitting diode of inversion structure and manufacturing method thereof
02/12/2014CN103579446A Method for manufacturing support structure of LED
02/12/2014CN103579445A Light source encapsulating structure for bulb lamp
02/12/2014CN103579444A Novel COB area light source encapsulating structure
02/12/2014CN103579443A 发光二极管装置及其制作方法 Light-emitting diode device and manufacturing method thereof
02/12/2014CN103579442A Manufacturing method of support structure of light-emitting diode
02/12/2014CN103579441A Light emitting module and lighting system
02/12/2014CN103579440A 发光二极管结构 Light-emitting diode structure
02/12/2014CN103579439A Light-emitting diode core and method for manufacturing same
02/12/2014CN103579438A Light-emitting component and manufacturing method thereof
02/12/2014CN103579437A Semiconductor light emitting device and manufacturing method thereof
02/12/2014CN103579436A Semiconductor light emitting structure and manufacturing method thereof
02/12/2014CN103579435A GaN-based power-type light-emitting diode and manufacturing method thereof
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