Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
10/2013
10/17/2013US20130270592 Submount based surface mount device (smd) light emitter components and methods
10/17/2013US20130270591 Polycarbonate compositions containing converions material chemistry and having enhanced optical properties, methods of making and articles comprising the same
10/17/2013US20130270590 Led module
10/17/2013US20130270589 Optoelectronic device with non-continuous back contacts
10/17/2013US20130270588 Lead frame assembly, led package and led light bar
10/17/2013US20130270587 Remote phosphor led constructions
10/17/2013US20130270586 Light Emitting Diode Package and Method of Manufacturing the Same
10/17/2013US20130270585 System and methods for warm white led light source
10/17/2013US20130270584 Optoelectronic package and method for making same
10/17/2013US20130270583 Method of forming copper wiring and method of manufacturing display device
10/17/2013US20130270582 Display Device
10/17/2013US20130270581 Multi-chip light emitter packages and related methods
10/17/2013US20130270580 Flat Panel Display Device and Method of Manufacturing the Same
10/17/2013US20130270575 Semiconductor wafer comprising gallium nitride layer having one or more silicon nitride interlayer therein
10/17/2013US20130270574 Nitride-based semiconductor element and method for fabricating the same
10/17/2013US20130270573 LEDs with Efficient Electrode Structures
10/17/2013US20130270570 Method of manufacturing thin film transistor
10/17/2013US20130270567 Thin film transistor, method of fabricating thin film transistor and pixel structure
10/17/2013US20130270565 Thin film transistor array panel and method for manufacturing the same
10/17/2013US20130270547 Display device, array substrate, and thin film transistor thereof
10/17/2013US20130270527 Backplane for flat panel display apparatus, method of manufacturing the backplane, and organic light emitting display apparatus including the backplane
10/17/2013US20130270520 Light-emitting device
10/17/2013US20130270519 Non-Uniform Multiple Quantum Well Structure
10/17/2013US20130270518 System for frequency conversion, semiconducting device and method for operating and manufacturing the same
10/17/2013US20130270517 Super lattice structure, semiconductor device and semiconductor light emitting device having super lattice structure, and method of making super lattice structure
10/17/2013US20130270516 Polarized White Light Devices Using Non-Polar or Semipolar Gallium Containing Materials and Transparent Phosphors
10/17/2013US20130270515 Light emitting diode
10/17/2013US20130270514 Low resistance bidirectional junctions in wide bandgap semiconductor materials
10/17/2013US20130269913 Heat pipe
10/17/2013DE112006000694B4 Gehäuse für Lichtemissionsvorrichtung, lichtemittierende Vorrichtung und Beleuchtungsvorrichtung Housing for light emitting device, light emitting device and lighting device
10/17/2013DE102012206101A1 Licht emittierendes Halbleiter-Bauelement Light-emitting semiconductor component
10/17/2013DE102012103161A1 Optoelektronisches Halbleiterbauteil An optoelectronic semiconductor device
10/17/2013DE102012103159A1 Strahlung emittierendes Bauelement, transparentes Material und Füllstoffpartikel sowie deren Herstellungsverfahren Radiation emitting device, transparent material and filler particles and their preparation method
10/17/2013DE102006027306B4 Verfahren zur Herstellung einer Glaskeramik mit einer Granatphase und Verwendung der danach hergestellten Glaskeramik A process for producing a glass-ceramic having a garnet phase, and use the glass ceramic produced thereby
10/17/2013DE10142541B4 Elektrolumineszierender Körper Electro Luminescent body
10/16/2013EP2650935A2 Light emitting lamp
10/16/2013EP2650934A1 Light-emitting device
10/16/2013EP2650933A1 Nitride semiconductor light-emitting element
10/16/2013EP2650932A1 Semiconductor light emitting device and method for manufacturing the same
10/16/2013EP2650603A1 Package structure of led light source module
10/16/2013EP2650343A1 Sulfur-containing phosphor coated with zno compound
10/16/2013EP2650082A1 Ceramic composite for photoconversion, and method for manufacture thereof
10/16/2013EP2649656A1 Lighting apparatus for generating light
10/16/2013EP2649655A1 High luminous output led lighting devices
10/16/2013EP2649654A1 A method for manufacturing a light emitting diode
10/16/2013EP2649647A1 Opto-electronic semiconductor component, method for producing same and use of such a component
10/16/2013EP2649633A2 Carbonitride and carbidonitride phosphors and lighting devices using the same
10/16/2013CN203242669U Packaging structure for LED (light-emitting diode) lamp beads
10/16/2013CN203242668U LED support with good air impermeability
10/16/2013CN203242667U Color-based controllable multi-chip combined LED module
10/16/2013CN203242666U Led器件 Led device
10/16/2013CN203242665U White-light lamp acquiring white light through secondary excitation conversion of blue-light LED
10/16/2013CN203242664U LED packaging adhesive bracket, LED packaging device and LED
10/16/2013CN203242663U LED support and LED integrated light
10/16/2013CN203242662U LED (light-emitting diode) support
10/16/2013CN203242661U Semiconductor substrate and semiconductor device
10/16/2013CN203242660U TOP-LED package device
10/16/2013CN203242659U A LED white light module with a fluorescent lamp cover
10/16/2013CN203242658U LED packaging device
10/16/2013CN203242657U Electricity-saving light emitting diode
10/16/2013CN203242623U Low light decay high light efficiency multi-chip combined LED module
10/16/2013CN203242621U Led发光装置 Led light-emitting device
10/16/2013CN103354956A Light emitting diode having photonic crystal structure and method of fabricating the same
10/16/2013CN103354955A 半导体发光装置 The semiconductor light emitting device
10/16/2013CN103354270A Process for removing spilling of EMC packaging LED lead frame
10/16/2013CN103354269A High-reliability SMD LED packaging structure
10/16/2013CN103354268A Planar LED one-step lens forming method
10/16/2013CN103354267A Packaging method for white LED (Light-Emitting Diode) light source
10/16/2013CN103354266A Thin type wafer lever LED (Light-Emitting Diode) packaging structure and method
10/16/2013CN103354265A Structure and method for packaging strip-shaped high-refractive-index LED formed by green chip and red phosphor
10/16/2013CN103354264A Structure and method for packaging rectangular high-luminous-flux LED formed by green chip and red phosphor
10/16/2013CN103354263A Structure and method for packaging square high-refractive-index LED formed by green chip and red phosphor
10/16/2013CN103354262A Structure and method for packaging strip-shaped high-luminous-flux LED formed by green chip and red phosphor
10/16/2013CN103354261A Structure and method for packaging square high-luminous-flux LED formed by green chip and red phosphor
10/16/2013CN103354260A Structure and method for packaging small-module high-luminous-flux LED formed by green chip and red phosphor
10/16/2013CN103354259A Structure and method for packaging small-module high-refractive-index LED formed by green chip and red phosphor
10/16/2013CN103354258A Structure and method for packaging small-module high-intensity LED formed by green chip and red phosphor
10/16/2013CN103354257A Structure and method for packaging strip-shaped high-intensity LED formed by green chip and red phosphor
10/16/2013CN103354256A Structure and method for packaging rectangular high-refractive-index LED formed by green chip and red phosphor
10/16/2013CN103354255A Low blue light LED light source
10/16/2013CN103354254A Multi-ceramic-layer LED packaging structure
10/16/2013CN103354253A Method for manufacturing semiconductor light emitting device
10/16/2013CN103351863A Red fluorescent powder and preparation method thereof
10/16/2013CN102618035B CdSe quantum dot silicon resin composite material emitting white fluorescence and preparation method thereof
10/16/2013CN102559187B Yellow fluorosulfide phosphors, preparation method and light-emitting diode thereof
10/16/2013CN102437151B Full-color SMD LED (Surface Mounted Device Light Emitting Diode) bracket structure and packaging product device thereof
10/16/2013CN102255030B Light emitting module
10/16/2013CN102239362B LED device with uniform lighting density and reduced dazzling effect
10/16/2013CN102227807B Radiation-emitting semiconductor chip and its manufacture method
10/16/2013CN102217099B A light emitting device having a refractory phosphor layer
10/16/2013CN102199276B Silicon-containing epoxy resin composition for light-emitting diode (LED) package and preparation method thereof
10/16/2013CN102154008B Red fluorescent material and preparation method thereof
10/16/2013CN102148323B Lens assembly
10/16/2013CN102130226B Light emitting device and method of manufacture
10/16/2013CN102097446B Lighting emitting device and producing method thereof
10/16/2013CN102027608B Light emitting device and a method of manufacturing the same
10/16/2013CN102020851B Light conversion flexible high molecular material and application thereof
10/16/2013CN101880525B Liquid-state fluorescer composition and luminous assembly
10/16/2013CN101859862B 发光装置 Light-emitting device
10/16/2013CN101853908B Method of driving GaN-based semiconductor light emitting element, method of driving planar light source device, and method of driving light emitting device
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