Patents
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
11/2013
11/07/2013US20130292716 Light emitting device chip scale package
11/07/2013US20130292715 Method of producing an optoelectronic component and component
11/07/2013US20130292712 Multi-dimensional solid state lighting device array system and associated methods and structures
11/07/2013US20130292710 Light emitting device
11/07/2013US20130292709 LED Lens Design with More Uniform Color-Over-Angle Emission
11/07/2013US20130292708 Submount based light emitter components and methods
11/07/2013US20130292707 Semiconductor Optical Emission Device
11/07/2013US20130292697 Gallium nitride based light emitting diode and fabrication method thereof
11/07/2013US20130292693 Light emitting diode
11/07/2013US20130292692 Light emitting diode
11/07/2013US20130292687 Structures and Devices Based on Boron Nitride and Boron Nitride-III-Nitride Heterostructures
11/07/2013US20130292679 Light-Emitting Display Device And Electronic Device Including The Same
11/07/2013US20130292672 Light-emitting device
11/07/2013US20130292652 Display device and method of manufacturing the same
11/07/2013US20130292645 High efficiency light emitting diode
11/07/2013US20130292644 Semiconductor light emitting device
11/07/2013US20130292643 Light-emitting device
11/07/2013US20130292642 Light emitting diode and method for manufacturing the same
11/07/2013US20130292641 Semiconductor device and method of producing the same
11/07/2013US20130292640 Light emitting diode and forming method thereof
11/07/2013US20130292639 Light emitting devices having current reducing structures
11/07/2013US20130292638 Superlattice Structure
11/07/2013US20130292637 Multi-quantum well led structure with varied barrier layer composition
11/07/2013US20130292636 Solid-state transducer assemblies with remote converter material for improved light extraction efficiency and associated systems and methods
11/07/2013DE102012207519A1 Verfahren zum herstellen eines bauelementträgers, einer elektronischen anordnung und einer strahlungsanordnung und bauelementträger, elektronische anordnung und strahlungsanordnung Method of manufacturing a component-carrier, an electronic arrangement and a radiation arrangement and component-makers, electronic assembly and radiation arrangement
11/07/2013DE102012103983A1 Leuchtdiodenanordnung insbesondere zu Beleuchtungszwecken und Verfahren zur Herstellung einer Leuchtdiodenanordnung LED arrangement, in particular for illumination purposes and methods of producing a light emitting diode arrangement
11/07/2013DE102012009135A1 Optical system used as lighting in e.g. aircraft, has catch formed through which position of circuit board is fixed to position of lens holder such that each LED of LED array is associated with respective lens of lens array
11/07/2013DE102012008639A1 Verfahren zur Herstellung eines optischen Moduls mit einer Silikonoptik A method of manufacturing an optical module having a silicon Optics
11/07/2013DE102012008637A1 Optisches Modul mit Ausformung zur Montage Optical module with shaping for mounting
11/07/2013DE102006043843B4 Verfahren zur Herstellung einer Leuchtdiode mit vertikaler Struktur A process for producing a light emitting diode having a vertical structure
11/06/2013EP2660887A1 Light-emitting module and lamp using same
11/06/2013EP2660886A2 Lead Frame for Optical Semiconductor Device and Optical Semiconductor Device Using the Same
11/06/2013EP2660885A1 Light device, light emitting diode package using the same, and backlight device
11/06/2013EP2660884A1 Light-emitting apparatus and method of manufacturing thereof
11/06/2013EP2660883A2 Light emitting device, light emitting device manufacturing method, light emitting package, and lighting system
11/06/2013EP2660882A1 Semiconductor light-emitting device
11/06/2013EP2660881A1 Light-emitting diode driver circuit and led light source
11/06/2013EP2660864A2 Light-emitting diode structure and method for manufacturing the same
11/06/2013EP2660855A1 Semiconductor device and process for production thereof
11/06/2013EP2660301A1 Red phosphor, production method for red phosphor, white light source, illumination device, and liquid crystal display device
11/06/2013EP2659737A1 Led-based illumination modules with thin color converting layers
11/06/2013EP2659525A1 Conversion element and a light-emitting diode comprising such a conversion element
11/06/2013EP2659524A1 Encapsulation housing and led module with the same
11/06/2013EP2659523A1 Composite substrate, semiconductor chip having a composite substrate and method for producing composite substrates and semiconductor chips
11/06/2013EP2659522A1 Method for producing a plurality of semiconductor components
11/06/2013EP2659513A2 Array assemblies with high voltage solid state lighting dies
11/06/2013CN203277503U Radiating fin structure and radiating device of electronic component
11/06/2013CN203277502U Novel light-emitting element structure of connector
11/06/2013CN203277501U Substrate structure with light reflection layer and semiconductor luminescent source
11/06/2013CN203277500U LED light source module group
11/06/2013CN203277499U LED module group
11/06/2013CN203277498U Lighting assembly and pedestal thereof
11/06/2013CN203277497U Packaging structure of high-power LED spot light source
11/06/2013CN203277496U White package for light-emitting diode (LED) of horizontal type electrode structure with sapphire at bottom thereof
11/06/2013CN203277495U All light beam angle luminescence LED light source module
11/06/2013CN203277494U Novel LED support and LED device thereof
11/06/2013CN203277493U LED (light-emitting diode) lamp bead with separated fluorescence
11/06/2013CN203277492U Led灯 Led lights
11/06/2013CN203277491U LED support structure having illumination angles of 118.65 degrees
11/06/2013CN203277490U LED integrated optical source
11/06/2013CN203277489U White light packaging structure of plurality of blue light emitting diodes
11/06/2013CN203277488U Welding protection structure of LED flip chip
11/06/2013CN203277487U N electrode connection structure of LED flip chip
11/06/2013CN203277486U LED chip
11/06/2013CN203277485U Lighting device, LED chip forming multidirectional light exiting and sapphire substrate thereof
11/06/2013CN203277381U LED multi-cup integration COB packaging structure
11/06/2013CN203277380U Lighting assembly and lighting apparatus
11/06/2013CN103385037A LED-based illumination modules with thin color converting layers
11/06/2013CN103384924A Packaging photon building blocks having only top side connections in an interconnect structure
11/06/2013CN103384923A Optoelectronic semiconductor chip and method for producing optoelectronic semiconductor chips
11/06/2013CN103384922A Nitride semiconductor light emitting element and LED system
11/06/2013CN103384914A Method for embedding a LED network
11/06/2013CN103384795A Manufacturing method for lighting device and holder
11/06/2013CN103383988A Light-emitting diode light source and light-emitting diode light source module
11/06/2013CN103383987A Light-emitting diode (LED) module radiating structure
11/06/2013CN103383986A Light-emitting diode dice with wavelength conversion layer and manufacturing method thereof
11/06/2013CN103383985A Light-emitting diode (LED) packaged on basis of AlSiC composite substrate
11/06/2013CN103383984A Lead frame for optical semiconductor device and optical semiconductor device using the same
11/06/2013CN103383983A Light emitting diode encapsulation, PCB type radiating substrate used for light emitting diode encapsulation and manufacturing method of PCB type radiating substrate
11/06/2013CN103383982A Electrode contact structure of light emitting diode
11/06/2013CN103383981A 发光二极管元件 Light-emitting diode element
11/06/2013CN103383980A Method for preparing orderly gallium nitride nano pillar array with ultraviolet soft imprinting
11/06/2013CN103383949A Light-emitting diode structure and method for manufacturing the same
11/06/2013CN103383074A Led lamps with improved quality of light
11/06/2013CN103382557A Wet etching method of zinc oxide and/or zinc oxide alloy
11/06/2013CN102676113B Light-emitting diode (LED) packaging silica gel and preparation method thereof
11/06/2013CN102569604B Hidden pin high-power LED (light-emitting diode) bracket and packaging structure and packaging process thereof
11/06/2013CN102522398B COB (Chip On Board) integrated-packaged LED (Light-Emitting Diode) with high color-rendering index and high reliability
11/06/2013CN102437264B Semiconductor structure and formation method thereof
11/06/2013CN102403421B Method for coating LED module fluorescent powder mixture
11/06/2013CN102376847B Composite optical device, mold, preparation method and optical system
11/06/2013CN102354725B High-power light emitting diode with radiating substrate made of diamond-like film-copper composite material
11/06/2013CN102315379B Photoelectric element with thermoelectric structure
11/06/2013CN102315354B Packaging structure of light emitting diode
11/06/2013CN102299231B Light emitting diode (LED) packaging structure and manufacturing method thereof
11/06/2013CN102277164B Fluorescent powder and light emitting device
11/06/2013CN102244164B Light-emitting diode crystalline grain modules, encapsulation method thereof and removal jig thereof
11/06/2013CN102237470B Light emitting diode packaging structure and manufacturing method thereof as well as manufacturing method of base
11/06/2013CN102237466B Luminescent assembly encapsulation structure and manufacturing process thereof
11/06/2013CN102232249B Light-emitting element and light-emitting device using the same