| Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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| 09/19/2013 | DE102012005082A1 Semiconductors useful as components of thermionic converters, thermionic cooling devices, photovoltaic cells, light emitting diodes, light areas or flat panel displays, comprise band gaps having a specific work function |
| 09/18/2013 | EP2639841A1 Light-emitting device, and method for manufacturing circuit board |
| 09/18/2013 | EP2639840A2 Reflective body and a light-emitting device equipped with the same |
| 09/18/2013 | EP2639839A1 Ac led white light luminous device |
| 09/18/2013 | EP2639831A2 Light emitting diode package |
| 09/18/2013 | EP2639494A1 Lamp and lighting device |
| 09/18/2013 | EP2638576A1 Luminescence conversion element, method for the manufacture thereof and opto-electronic component having a luminesence conversion element |
| 09/18/2013 | EP2638575A1 Optoelectronic semiconductor chip and method for producing same |
| 09/18/2013 | CN203205463U Structure combining heat dissipation device with heating device |
| 09/18/2013 | CN203205462U High-brightness LED chip carrier structure having strong heat radiation function |
| 09/18/2013 | CN203205461U Full-color surface-mounting support |
| 09/18/2013 | CN203205460U Thin-type surface-mounted support |
| 09/18/2013 | CN203205459U LED centrifugal sedimentation device |
| 09/18/2013 | CN203205458U LED package substrate |
| 09/18/2013 | CN203205457U Direct inset type LED with heat conduction function |
| 09/18/2013 | CN203205456U LED support with stable structure |
| 09/18/2013 | CN203205455U LED support |
| 09/18/2013 | CN203205454U Package structure of LED light source |
| 09/18/2013 | CN203205453U Semiconductor light-emitting chip and semiconductor lighting lamp |
| 09/18/2013 | CN203205452U Three-dimensional quantum-well photoelectric bare chip |
| 09/18/2013 | CN203205451U Nano nonpolar surface GaN cone array material |
| 09/18/2013 | CN203205418U LED with front and back sides shining |
| 09/18/2013 | CN203205416U Integrated packaged LED light source component |
| 09/18/2013 | CN103314457A Light emitting device chip scale package |
| 09/18/2013 | CN103314456A Light-emitting device |
| 09/18/2013 | CN103314074A Sialon phosphor, method for producing same, and light-emitting device package using same |
| 09/18/2013 | CN103311422A Light emitting diode packaging structure |
| 09/18/2013 | CN103311421A Moisture-proof LED support |
| 09/18/2013 | CN103311420A Semiconductor light emitting device having multi-cell array |
| 09/18/2013 | CN103311419A Method of improving lighting effect of COB (chip on board) light source |
| 09/18/2013 | CN103311418A 发光二极管模组 Light-emitting diode module |
| 09/18/2013 | CN103311417A Phosphor coating method for high-power LEDs |
| 09/18/2013 | CN103311416A Method for coating fluorescent glue onto LED (Light-Emitting Diode) wafer and film-pressing mould thereof |
| 09/18/2013 | CN103311415A Light Emitting Device, And Illumination Apparatus And System Using Same |
| 09/18/2013 | CN103311414A Phosphor encapsulating sheet, light emitting diode device, and producing method thereof |
| 09/18/2013 | CN103311413A White light emitting device |
| 09/18/2013 | CN103311412A Luminaire |
| 09/18/2013 | CN103311411A Light-emitting diode (LED) chip packaging method |
| 09/18/2013 | CN103311410A Integrated LED with high thermal conductivity and high breakdown voltage |
| 09/18/2013 | CN103311409A Semiconductor light-emitting device and manufacturing method thereof |
| 09/18/2013 | CN103311408A High-reflectivity LED support |
| 09/18/2013 | CN103311407A Patch-type LED (light emitting diode) bracket and manufacturing method |
| 09/18/2013 | CN103311406A Packaging process for white light-emitting diodes (LEDs) |
| 09/18/2013 | CN103311405A Die attach adhesive pressing method and pressurizing device |
| 09/18/2013 | CN103311404A Encapsulating sheet, light emitting diode device, and producing method thereof |
| 09/18/2013 | CN103311403A Lighting module |
| 09/18/2013 | CN103311402A LED packages and carrier |
| 09/18/2013 | CN103311401A Substrate for carrying light emitting diodes and manufacturing method thereof |
| 09/18/2013 | CN103311400A Method for manufacturing light-emitting diode encapsulating structure |
| 09/18/2013 | CN103311399A LED (Light-Emitting Diode) luminescent device |
| 09/18/2013 | CN103311398A LED (Light Emitting Diode) chip with electrode transitional layer and manufacturing method thereof |
| 09/18/2013 | CN103311397A Improved p-gan layer of an led through pressure ramping growing |
| 09/18/2013 | CN103311396A Diode with Si-based substrate |
| 09/18/2013 | CN103311395A Laser stripping film LED (Light-Emitting Diode) and preparation method thereof |
| 09/18/2013 | CN103311394A GaN-based LED and epitaxial growth method thereof |
| 09/18/2013 | CN103311393A 氮化物半导体元件和氮化物半导体晶片 The nitride semiconductor element and the nitride semiconductor wafer |
| 09/18/2013 | CN103311392A Stealth cutting LED (light emitting diode) chip and manufacture method thereof |
| 09/18/2013 | CN103311391A Light emitting diode grain and preparation method thereof |
| 09/18/2013 | CN103311390A MQS light-emitting layer of GaN-based LED epitaxial wafer |
| 09/18/2013 | CN103311389A Light-emitting diode epitaxial wafer and manufacturing method thereof |
| 09/18/2013 | CN103311388A Semiconductor ultraviolet source device |
| 09/18/2013 | CN103311387A Patterned substrate and manufacturing method thereof |
| 09/18/2013 | CN103311386A Graphical sapphire substrate preparation method |
| 09/18/2013 | CN103311385A Manufacturing method for semiconductor lighting DA (direct attach) eutectic chip |
| 09/18/2013 | CN103311384A Method for preparing patterned substrate |
| 09/18/2013 | CN103311383A Light-emitting diode chip mounter and alignment system thereof |
| 09/18/2013 | CN103311382A LED (Light-emitting diode) chip and preparation method for same |
| 09/18/2013 | CN103311381A Production method for packaging structures of light-emitting diode |
| 09/18/2013 | CN103311380A Semiconductor packaging process and packaging structures thereof |
| 09/18/2013 | CN103311379A GaN-based LED and method for manufacturing GaN-based LED |
| 09/18/2013 | CN103311378A Manufacturing method for LED package structure |
| 09/18/2013 | CN103311261A Integrated LED (Light Emitting Diode) light emitting device and manufacturing method thereof |
| 09/18/2013 | CN103311234A Light emitting diode package |
| 09/18/2013 | CN103311233A Light emitting diode packaging structure |
| 09/18/2013 | CN103311232A Integrated multilayer lighting device |
| 09/18/2013 | CN103311115A Manufacturing method of sapphire substrate with identifiable front side and back side |
| 09/18/2013 | CN103307483A LED light source module based on printed circuit board |
| 09/18/2013 | CN103307474A 光源模块 The light source module |
| 09/18/2013 | CN103305917A Method for manufacturing GaN template substrate and GaN template substrate |
| 09/18/2013 | CN103305221A Eu<3+>-doped vanadate fluorescent material, and preparation method and application thereof |
| 09/18/2013 | CN103305216A Borate red fluorescent powder and preparation method and application thereof |
| 09/18/2013 | CN103305215A Phosphors and method for producing thereof |
| 09/18/2013 | CN103305005A Curable silicone resin composition and optoelectronic device |
| 09/18/2013 | CN103302006A LED die bonding method and LED |
| 09/18/2013 | CN102549329B 灯 Light |
| 09/18/2013 | CN102522466B Method for packaging LED illuminating device |
| 09/18/2013 | CN102516932B Transparent liquid silica gel and preparation method thereof |
| 09/18/2013 | CN102403413B LED (Light-Emitting Diode) heat dissipation base plate, LED packaging structure, and manufacturing method of LED heat dissipation base plate and LED packaging structure |
| 09/18/2013 | CN102341923B Led assembly having redundancy electrode and fabrication method thereof |
| 09/18/2013 | CN102208510B Group III nitride semiconductor light-emitting device |
| 09/18/2013 | CN102203966B Method for manufacturing semiconductor light-emitting element |
| 09/18/2013 | CN102148309B LED (light emitting diode) chip with improved structure |
| 09/18/2013 | CN102130260B Luminous device and manufacturing method thereof |
| 09/18/2013 | CN102113102B Relaxation of strained layers |
| 09/18/2013 | CN102005517B Method of fabricating light emitting diode using laser lift-off technique and laser lift-off apparatus |
| 09/18/2013 | CN101978513B Semiconductor light emitting module and method for manufacturing the same |
| 09/18/2013 | CN101933168B Plasmon enhanced light-emitting diodes |
| 09/18/2013 | CN101921591B 绿光发光材料及其制备方法 Green light-emitting material and preparation method |
| 09/18/2013 | CN101880461B Resin composition for encapsulating optical semiconductor element |
| 09/18/2013 | CN101849281B A method of manufacturing an organic electronic or optoelectronic device |