Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
10/2013
10/31/2013US20130285096 Light emitting diode package and method for manufacturing the same
10/31/2013US20130285095 Light emitting device and light emitting device package
10/31/2013US20130285094 Light emitting diode light source device
10/31/2013US20130285093 Light emitting diode package structure having a substrate including ceramic fibers
10/31/2013US20130285092 Light emitting diode
10/31/2013US20130285091 Semiconductor light emitting device and method for manufacturing same
10/31/2013US20130285090 Semiconductor light emitting device
10/31/2013US20130285089 Semiconductor light emitting device
10/31/2013US20130285087 Light emitting device and manufacturing method thereof
10/31/2013US20130285086 Method of forming a micro led device with self-aligned metallization stack
10/31/2013US20130285085 Light-emitting device package and method of manufacturing the same
10/31/2013US20130285084 Optoelectronic Semiconductor Component
10/31/2013US20130285082 Led package comprising encapsulation
10/31/2013US20130285081 Optoelectronic Semiconductor Component
10/31/2013US20130285080 Semiconductor light emitting device, method of manufacturing the same, image display device, and electronic apparatus
10/31/2013US20130285079 Display device and method for manufacturing the same
10/31/2013US20130285076 Light emitting diode device
10/31/2013US20130285075 Light-emitting device
10/31/2013US20130285074 Luminescent device and manufacturing method for luminescent device and semiconductor device
10/31/2013US20130285073 Led light disposed on a flexible substrate and connected with a printed 3d conductor
10/31/2013US20130285067 Method for forming a buried metal layer structure
10/31/2013US20130285066 Method of fabricating gallium nitride semiconductor, method of fabricating group iii nitride semiconductor device, and group iii nitride semiconductor device
10/31/2013US20130285064 Semiconductor light emitting device
10/31/2013US20130285015 Photoactive devices with improved distribution of charge carriers, and methods of forming same
10/31/2013US20130285013 Compound semiconductor devices and methods of fabricating the same
10/31/2013US20130285012 Light emitting diode and method of manufacturing the same
10/31/2013US20130285011 Semiconductor light emitting device and manufacturing method of the same
10/31/2013US20130285010 Stacked led device with posts in adhesive layer
10/31/2013DE10297527B4 Kompaktes Beleuchtungssystem und Anzeigeeinrichtung Compact lighting system and display device
10/31/2013DE102013207579A1 LED module i.e. chip-on-board module, for use in e.g. spotlight, has phosphor particles whose concentration decreases with gradient in region formed adjacent to another region, and phosphor layer applied on radiation surface of chip
10/31/2013DE102012213178A1 LED-Modul mit Leiterplatte LED module with PCB
10/31/2013DE102012209354A1 LED-Modul LED module
10/31/2013DE102012207166A1 LED-Anordnung LED array
10/31/2013DE102012207061A1 Electronic circuit arrangement for use in e.g. lamp module, of motor car, has electrically interconnected component coupled to contact element on carrier by connector, where connector and/or contact element is formed from graphene
10/31/2013DE102012206970A1 Optical device for illumination device used in e.g. motor vehicle headlamp, has light scattering medium is constructed and arranged, such that it acts on light scattering from the first wavelength region light
10/31/2013DE102012206966A1 LED-basierte Lichtquelle LED-based light source
10/31/2013DE102012206955A1 Verfahren zum Herstellen einer Streuschicht für elektromagnetische Strahlung und Streuschicht zum Streuen elektromagnetischer Strahlung A method of manufacturing a diffusing layer for electromagnetic radiation and scattering layer for scattering of electromagnetic radiation
10/31/2013DE102012103686A1 Epitaxiesubstrat, Verfahren zur Herstellung eines Epitaxiesubstrats und optoelektronischer Halbleiterchip mit einem Epitaxiesubstrat Epitaxial substrate, methods of manufacturing an epitaxial substrate and opto-electronic semiconductor chip having an epitaxial substrate
10/31/2013DE102012103633A1 Strahlungsemittierende Vorrichtung und Verfahren zum Herstellen einer derartigen Vorrichtung Radiation-emitting device and method of manufacturing such a device
10/31/2013CA2871573A1 Hybrid solar generator
10/30/2013EP2658001A2 Light emitting device
10/30/2013EP2658000A1 Substrate, light-emitting device, and illumination device
10/30/2013EP2657999A2 Wavelength converter and semiconductor light emitting device
10/30/2013EP2657998A2 Semiconductor light emitting device
10/30/2013EP2657997A2 Semiconductor light emitting device
10/30/2013EP2657996A2 Semiconductor light-emitting device
10/30/2013EP2657995A2 Semiconductor light emitting device and method for manufacturing same
10/30/2013EP2657994A2 Semiconductor light emitting device
10/30/2013EP2657993A2 Semiconductor light emitting device and manufacturing method of the same
10/30/2013EP2657992A2 Light emitting device and light emitting device package
10/30/2013EP2657991A1 Led light-emitting device, terminal number converter, and illumination device
10/30/2013EP2657967A2 Light emitting module
10/30/2013EP2657962A1 Electronic device with a metallisation layer having a high- and a low-melting-point component diffusion-bonded together and a synthetic resin layer covering the metallisation layer
10/30/2013EP2657755A1 Display apparatus
10/30/2013EP2656403A1 Method for producing an optoelectronic component and optoelectronic component
10/30/2013EP2656402A1 Light emitting diode chip and method of fabricating the same
10/30/2013EP2656384A1 Method for producing an electrical terminal support
10/30/2013EP2656117A1 Led (light emitting diode) luminous source module
10/30/2013EP2655545A1 Lighting device with polymer containing matrices
10/30/2013CN203260640U High-strength cooling heat dissipation device of high-power LED
10/30/2013CN203260639U High-luminous-efficiency and good-heat-dissipation COB light source
10/30/2013CN203260638U LED luminescent module
10/30/2013CN203260637U LED support spot-plating mold
10/30/2013CN203260636U Conductive structure of LED support conductive base
10/30/2013CN203260635U LED support conductive device with fixed support rods
10/30/2013CN203260634U LED support spot-plating mold
10/30/2013CN203260633U LED package structure requiring no welding line
10/30/2013CN203260632U LED support and terminal material strip
10/30/2013CN203260631U Led light source device
10/30/2013CN203260630U COB packaged by using glass lens
10/30/2013CN203260629U Chip integration and packaging structure of high-lightness LED light source
10/30/2013CN203260628U Packaging structure for light emitting diode
10/30/2013CN203260627U Packaging structure of light emitting diode
10/30/2013CN203260626U Novel automation complete equipment for LED module group packaging
10/30/2013CN203260625U LED bracket leveling device applicable to a variety of widths
10/30/2013CN203260624U LED support conductive device
10/30/2013CN203260623U LED package with high power and small light emergence angle
10/30/2013CN203260622U Four-pin LED
10/30/2013CN203260621U LED integrated light source ceramic support provided with retaining walls
10/30/2013CN203260620U Ceramic base material upside-down mounting LED integrated light source support
10/30/2013CN203260619U Novel high-heat-conductivity COB substrate
10/30/2013CN203260618U LED support and module thereof
10/30/2013CN203260617U Support plate of package substrate used for switching-over
10/30/2013CN203260616U Led芯片 Led chip
10/30/2013CN203260579U SMD (Surface Mounted Device) packaging apparatus for single LED lamp bead with six chips in series
10/30/2013CN203260578U Four-pin LED packaging structure
10/30/2013CN203253675U Light emitting diode (LED) support ultrasonic wave deoiling device
10/30/2013CN103380551A Semiconductor light emitting element and light emitting device using same
10/30/2013CN103380502A Light-emitting-element base substrate, and led device
10/30/2013CN103380501A Light emitting diodes with low junction temperature and solid state backlight components including light emitting diodes with low junction temperature
10/30/2013CN103380500A CMOS based micro-photonic systems
10/30/2013CN103380327A Light-emitting diode source of white light with a remote phosphor converter
10/30/2013CN103380193A Phosphor, production method for same, and light-emitting device
10/30/2013CN103378282A Method for manufacturing light emitting diode encapsulating structures
10/30/2013CN103378281A Former manufacturing process and structure of light emitting diode lead frame
10/30/2013CN103378280A 发光二极管及其透镜 Light-emitting diode and lens
10/30/2013CN103378279A Light emitting diode encapsulating structure and manufacturing method thereof
10/30/2013CN103378278A Light emitting diode encapsulating structure
10/30/2013CN103378277A Lens and light-emitting diode packaging structure with same
10/30/2013CN103378276A Light-emitting diode and light distribution structure thereof
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