| Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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| 11/14/2013 | US20130299865 Led assembly comprising a light scattering layer |
| 11/14/2013 | US20130299864 Light emitting device, light emitting module, and method for manufacturing light emitting device |
| 11/14/2013 | US20130299863 Light-emitting diode structure and method for manufacturing the same |
| 11/14/2013 | US20130299862 Luminescence Conversion Element, Method for the Manufacture Thereof and Optoelectronic Component Having a Luminescence Conversion Element |
| 11/14/2013 | US20130299861 Led structure, led device and methods for forming the same |
| 11/14/2013 | US20130299860 Semiconductor light-emitting device |
| 11/14/2013 | US20130299859 Substrate for optical semiconductor apparatus, method for manufacturing the same, optical semiconductor apparatus and method for manufacturing the same |
| 11/14/2013 | US20130299858 Light emitting diode (led) contact structures and process for fabricating the same |
| 11/14/2013 | US20130299857 Light-Emitting Device |
| 11/14/2013 | US20130299856 Luminous glazing unit |
| 11/14/2013 | US20130299854 Light emitting device, method of fabricating the same and lighting system |
| 11/14/2013 | US20130299853 High voltage light emitting diode and fabricating method thereof |
| 11/14/2013 | US20130299852 Substrate for optical semiconductor apparatus, method for manufacturing the same, optical semiconductor apparatus, and method for manufacturing the same |
| 11/14/2013 | US20130299851 Lighting device |
| 11/14/2013 | US20130299850 Active matrix substrate, display device, method for inspecting the active matrix substrate, and method for inspecting the display device |
| 11/14/2013 | US20130299847 Semiconductor light emitting device and method for manufacturing same |
| 11/14/2013 | US20130299844 Enhanced light extraction efficiency for light emitting diodes |
| 11/14/2013 | US20130299841 GaN-Based Optocoupler |
| 11/14/2013 | US20130299838 Thin-film transistor array substrate and manufacturing method for the same |
| 11/14/2013 | US20130299833 Thin film transistor array panel, liquid crystal display, method for repairing the same, color filter array panel and method for manufacturing the same |
| 11/14/2013 | US20130299832 Semiconductor device and method of fabricating the same |
| 11/14/2013 | US20130299830 Display device |
| 11/14/2013 | US20130299816 Light emitting device, display apparatus, and illuminating apparatus |
| 11/14/2013 | US20130299779 Vertical topology light emitting device |
| 11/14/2013 | US20130299778 Group III Nitride Semiconductor Light-Emitting Device Including a Superlatice Layer |
| 11/14/2013 | US20130299777 Light-emitting diodes with low temperature dependence |
| 11/14/2013 | US20130299776 High output power, high efficiency blue light-emitting diodes |
| 11/14/2013 | US20130299775 Nitride based semiconductor light emitting device |
| 11/14/2013 | US20130299774 Light-emitting diode device and a method of manufacturing the same |
| 11/14/2013 | US20130298972 Optoelectronic device and the manufacturing method thereof |
| 11/14/2013 | US20130298829 Thin film deposition apparatus and method of manufacturing organic light-emitting display apparatus using the same |
| 11/14/2013 | US20130298396 Method of making a heat radiating structure for high-power led |
| 11/14/2013 | DE102013100611A1 Integrally-formed multi-layer light emitting device has lead frame with conductive rods arranged in sleeve, so that rod ends are extended from sleeve, and rods are connected to light emitting chip by metal-wire bonding |
| 11/14/2013 | DE102012207969A1 Light source device e.g. LED has light source cover whose specific side portion is clouded, melted and partially removed, so that predetermined target light intensity and/or target radiation level are adjusted |
| 11/14/2013 | DE102012207854A1 Optoelektronisches bauelement undverfahren zum herstellen eines optoelektronischen bauelements Optoelectronic component undverfahren for the manufacture of an optoelectronic component |
| 11/14/2013 | DE102012207772A1 Varistor paste for forming geometric flexible varistor for electronic component device, comprises carrier matrix consisting of electrical insulative material that exhibits varistor properties and is selected from elastomer |
| 11/14/2013 | DE102012207593A1 Producing components, comprises applying molding material comprising recesses, on lead frame, providing predetermined breaking points between recesses, separating connecting lines intersecting breaking points, and breaking molding material |
| 11/14/2013 | DE102012104148A1 Optoelectronic semiconductor component, has optical diffuser element fixed downstream to semiconductor chip in radiation pattern and comprising profile and having optical transparency and optical diffuse effect based on viewing angle |
| 11/14/2013 | DE102012104111A1 Optoelectronic semiconductor device has semiconductor chip which is located in or at the geometric center of the chip covering layer |
| 11/14/2013 | DE102012104035A1 Method for manufacturing conversion layer utilized for conversion of electrically generated data into light emission, involves partially applying particles on mounting surface and maintaining main surfaces of chip remain free from particles |
| 11/14/2013 | DE102012102859A1 Optoelektronisches Bauelement umfassend eine Konverterträgerschicht, und Verfahren zur Herstellung eines optoelektronischen Bauelements umfassend eine Konverterträgerschicht An optoelectronic component comprising a converter carrier layer, and methods for producing an optoelectronic component comprising a converter carrier layer |
| 11/14/2013 | DE102004015903B4 Lichtemissionsdiodeneinrichtung Light emitting diode device |
| 11/13/2013 | EP2662907A2 Lighting device |
| 11/13/2013 | EP2662906A2 Lighting device |
| 11/13/2013 | EP2662894A2 Light-emitting diode arrangement, in particular for illumination purposes and method for producing an arrangement of light emitting diodes |
| 11/13/2013 | EP2662431A1 Red phosphor, method for producing red phosphor, white light source, illumination device, and liquid crystal display device |
| 11/13/2013 | EP2662430A1 Beta type sialon, light-emitting device and application thereof |
| 11/13/2013 | EP2661777A2 Packaging photon building blocks having only top side connections in an interconnect structure |
| 11/13/2013 | EP2661772A1 Led arrangement for generating white light |
| 11/13/2013 | CN203288655U Multiple primary color combined LED support |
| 11/13/2013 | CN203288654U Led flip chip |
| 11/13/2013 | CN203288653U Novel direct insertion surface mounted LED luminous tube |
| 11/13/2013 | CN203288652U Full-angle LED (Light-Emitting Diode) packaging structure |
| 11/13/2013 | CN203288651U Improvement structure for diode conducting wire |
| 11/13/2013 | CN203288650U Light source module of light emitting diode (LED) |
| 11/13/2013 | CN203288649U A LED-lamp-used fluorescent powder glass membrane for converting blue light into white light |
| 11/13/2013 | CN203288648U White light-emitting diode with high light extraction efficiency |
| 11/13/2013 | CN203288647U LED lamp bead having uniform light emission and LED light fixture |
| 11/13/2013 | CN203288646U Reinforcement light extraction structure for LED substrate |
| 11/13/2013 | CN203288645U Circular MCOB packaging structure |
| 11/13/2013 | CN203288644U Distributed high-voltage LED (Light-Emitting Diode) module group |
| 11/13/2013 | CN203288643U Flexible substrate for light-emitting diode |
| 11/13/2013 | CN203288642U Straight inserting LED pedestal |
| 11/13/2013 | CN203288641U Die bonding arm structure applicable to die bonder of LED packaging device |
| 11/13/2013 | CN203288640U A narrow-rim LED support structure distributed in twenty-two rows |
| 11/13/2013 | CN203288639U Light emitting diode paster provided with red light chip and blue light chip in serial/parallel connection |
| 11/13/2013 | CN203288638U Short cup type large irradiation range LED support structure |
| 11/13/2013 | CN203288637U Light emitting diode |
| 11/13/2013 | CN203288636U Patterned substrate capable of adjusting emitting angle of LED (light-emitting diode) |
| 11/13/2013 | CN203288635U CdSe quantum dot LED device using rodlike WO3 as hole transport layer |
| 11/13/2013 | CN203288634U Full-automatic feeding structure suitable for LED packaging device die bonder |
| 11/13/2013 | CN203288594U High-voltage LED chip having microstructure reflection reducing coating |
| 11/13/2013 | CN203288591U White light emitting diode (LED) with blue and green substrate |
| 11/13/2013 | CN203288590U LED light bar |
| 11/13/2013 | CN203288571U General COB clamp structure for die bonder of LED packaging device |
| 11/13/2013 | CN103392243A Fluid cooled lighting element |
| 11/13/2013 | CN103392242A 发光装置 Light-emitting device |
| 11/13/2013 | CN103392241A Optoelectronic semiconductor element and method for producing an optoelectronic semiconductor element |
| 11/13/2013 | CN103392093A Light emitting module and lighting device for vehicle |
| 11/13/2013 | CN103390720A Light emitting device |
| 11/13/2013 | CN103390719A Fluorescent membrane for white-light LED module chip |
| 11/13/2013 | CN103390718A Forming technology and packaging method for upper die provided with ball LED package |
| 11/13/2013 | CN103390717A Laminated LED light emitting module and manufacturing method |
| 11/13/2013 | CN103390716A Light source adopting LED chip packaging technology |
| 11/13/2013 | CN103390715A Light-emitting diode (LED) packaged with AlSiC composite substrate |
| 11/13/2013 | CN103390714A Integral type LED (Light Emitting Diode) encapsulation structure and method |
| 11/13/2013 | CN103390713A Semi-conductor luminescent device provided with light reflection layer |
| 11/13/2013 | CN103390712A Light-emitting diode structure and method for manufacturing the same |
| 11/13/2013 | CN103390711A LED chip with electrode reflective layers and manufacture method thereof |
| 11/13/2013 | CN103390710A Led芯片及其制备方法 Led chip and its preparation method |
| 11/13/2013 | CN103390709A Light-emitting diode with dual-function electrodes and manufacturing method thereof |
| 11/13/2013 | CN103390708A Light-emitting diode encapsulation structure and manufacturing method thereof |
| 11/13/2013 | CN103390707A Semiconductor light emitting device and manufacturing method thereof |
| 11/13/2013 | CN103390706A Patterned base material with emitting angle convergent and light-emitting diode element |
| 11/13/2013 | CN103390705A Method of controlling epitaxial growth of thickness of membrane of quantum well |
| 11/13/2013 | CN103390704A Light-emitting diode device and manufacturing method thereof |
| 11/13/2013 | CN103390703A Preparation method of low-damage and high-density film and LED chip provided with film |
| 11/13/2013 | CN103390702A Light emitting device, super-radiation luminescent diode, and projector |
| 11/13/2013 | CN103390701A Method for machining base plate |
| 11/13/2013 | CN103390700A Light-emitting diode encapsulation manufacturing procedure and encapsulation structure thereof |