Patents
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
11/2013
11/20/2013CN103400908A Surface-roughened light-emitting diode and manufacturing method thereof
11/20/2013CN103400850A Flexible LED array device for micro-displaying and lighting and manufacture method
11/20/2013CN103400849A Minitype LED array device for displaying and lighting and preparation method
11/20/2013CN103400835A Integrated packaging method for LED (light emitting diode) module
11/20/2013CN103400834A Transparent-electrode flexible LED micro-display array chip
11/20/2013CN103400833A Led module and manufacturing method thereof
11/20/2013CN103396800A Boron aluminate-based blue fluorescent powder, preparation method and application
11/20/2013CN103396799A LED (light-emitting diode) lamp as well as preparation method of red emitting inorganic luminescent material used in LED lamp
11/20/2013CN103396795A Vanadate fluorescent powder, and preparation method and application thereof
11/20/2013CN103396794A Eu<3+> activated sodium barium tungstate fluorescent powder, preparation method and application thereof
11/20/2013CN103396791A Novel aluminate-based green phosphors
11/20/2013CN103396665A Polyamide composition for reflective plate, reflective plate, light-emitting device comprising said reflective plate, and illumination device and image display device comprising said light-emitting device
11/20/2013CN102927481B High-power LED lamp
11/20/2013CN102543985B Semiconductor packaging device and semiconductor substrate structure thereof
11/20/2013CN102504814B Direct white light fluorescent material excited by ultraviolet light and preparation method and application thereof
11/20/2013CN102368521B Cutting method for LED wafer
11/20/2013CN102354723B Flip semiconductor luminescent device and manufacturing method thereof
11/20/2013CN102334204B Nitride semiconductor light-emitting element and process for production thereof
11/20/2013CN102282687B Led packaging enabling light emitting with uniform colors
11/20/2013CN102270633B High-power flip-chip array LED chip and manufacturing method thereof
11/20/2013CN102227006B Semiconductor device manufacturing method and semiconductor device
11/20/2013CN102201516B LED (light emitting diode) with InGaN nanopillar array active region and fabrication method thereof
11/20/2013CN102191045B Preparation method of nitrogen oxide green fluorescent powder material
11/20/2013CN102127442B Zirconium phosphate-based luminescent material as well as preparation method and application thereof
11/20/2013CN102017196B Semiconductor light emitting device
11/20/2013CN102002269B Fluorescent powder coating liquid of white light emitting diode as well as preparation method and coating method thereof
11/20/2013CN101981713B Nitride semiconductor element and method for manufacturing same
11/20/2013CN101935526B Phosphor, method for producing the same, and light emitting device
11/20/2013CN101924175B Packaging device of light-emitting diode and packaging method thereof
11/20/2013CN101894901B Package for multiple light emitting diodes
11/20/2013CN101840979B Luminescent material, luminescent material complex and method of manufacturing the same, fluorescent labeling reagent and method of manufacturing the same, and light emitting element
11/20/2013CN101500359B Direct-current power supply device, power supply device for driving LED and semiconductor integrated circuit for driving power supply
11/20/2013CN101438424B Uniform emission led package
11/19/2013US8587501 Electroluminescent display device with optically communicating chiplets
11/19/2013US8587346 Driving circuit and electronic device using the same
11/19/2013US8587218 Illuminating device
11/19/2013US8587118 Light emitting device package and manufacturing method thereof
11/19/2013US8587022 Nitride semiconductor light-emitting element and process for production thereof
11/19/2013US8587021 Mounting structure for solid state light sources
11/19/2013US8587020 LED lamps
11/19/2013US8587019 Grooved plate for improved solder bonding
11/19/2013US8587018 LED structure having embedded zener diode
11/19/2013US8587017 Light emitting device and method of fabricating a light emitting device
11/19/2013US8587016 Light emitting device package having light emitting device on inclined side surface and lighting system including the same
11/19/2013US8587015 Light-emitting element
11/19/2013US8587014 LED packaging structure with blind hole welding device
11/19/2013US8587013 Semiconductor package structure
11/19/2013US8587011 Light-emitting device, light-emitting module, and lamp
11/19/2013US8587010 Light emitting device package and method of manufacturing the same
11/19/2013US8587008 Light-emitting device
11/19/2013US8587007 Light emitting device
11/19/2013US8587005 Nitride semiconductor light emitting device array
11/19/2013US8587004 Semiconductor light emitting device, its manufacturing method, semiconductor device and its manufacturing method
11/19/2013US8587003 Organic EL display device and manufacturing method of the same
11/19/2013US8587001 Light-emitting diode light module free of jumper wires
11/19/2013US8586963 Semiconductor light-emitting devices having concave microstructures providing improved light extraction efficiency and method for producing same
11/19/2013US8586391 Method of manufacturing light-emitting device
11/19/2013US8586128 Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof
11/19/2013US8585821 SiC epitaxial substrate and method for producing the same
11/19/2013US8585272 Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
11/19/2013US8585254 Lens, light source unit, backlight apparatus, and display apparatus
11/19/2013US8585252 Lighting assembly
11/19/2013DE202013102104U1 Hermetisch gasdichtes optoelektronisches oder elektrooptisches Bauteil Hermetically sealed gas optoelectronic or electro-optical component
11/14/2013WO2013170016A1 Light-emitting diodes with low temperature dependence
11/14/2013WO2013170010A1 High output power, high efficiency blue light-emitting diodes
11/14/2013WO2013169636A1 Light emitting diode (led) contact structures and process for fabricating the same
11/14/2013WO2013169120A1 Ceramic heat sink components and method for their fabrication
11/14/2013WO2013169032A1 Light-emitting diodes having improved light extraction efficiency
11/14/2013WO2013168929A1 Light emitting diode having plurality of light emitting elements and method of fabricating the same
11/14/2013WO2013168802A1 Led module
11/14/2013WO2013168376A1 Light emitting diode drive apparatus and semiconductor device
11/14/2013WO2013168037A1 Remote phosphor and led package
11/14/2013WO2013167567A1 Method for producing a component carrier, an electronic arrangement and a radiation arrangement, and component carrier, electronic arrangement and radiation arrangement
11/14/2013WO2013167399A1 Optoelectronic component and method for producing an optoelectronic component
11/14/2013WO2013166601A1 Light emitting material and method for production thereof
11/14/2013US20130303777 Luminescent material, and organic light-emitting element, wavelength-converting light-emitting element, light-converting light-emitting element, organic laser diode light-emitting element, dye laser, display device, and illumination device using same
11/14/2013US20130302931 Stacked layers of nitride semiconductor and method for manufacturing the same
11/14/2013US20130302930 Method of manufacturing gallium nitride-based semiconductor light emitting device
11/14/2013US20130302929 Display device and method for fabricating same
11/14/2013US20130302927 Light-Emitting Device and Manufacturing Method Thereof
11/14/2013US20130302924 Semiconductor device and manufacturing method thereof
11/14/2013US20130302922 Quasicrystalline structures and uses thereof
11/14/2013US20130302921 Method for producing electro-optical device and substrate for electro-optical device
11/14/2013US20130302920 Method and system for template assisted wafer bonding
11/14/2013US20130302919 Method for manufacturing led package
11/14/2013US20130302209 High Efficiency Solid-State Light Source and Methods of Use and Manufacture
11/14/2013US20130301986 Design For Spacer Resin Pattern Helping to Reduce Optical Coupling Loss in Optical Waveguide For Light-Emitting Element or Light-Receiving Element on Semiconductor
11/14/2013US20130301276 Slim type backlight unit with through-hole adhesive heat dissipating means
11/14/2013US20130301012 Light emitting device, super-luminescent diode, and projector
11/14/2013US20130300992 Liquid crystal display device and method of manufacturing the same
11/14/2013US20130300984 Light source package structure, fabricating method thereof and liquid crystal display
11/14/2013US20130300971 Method for Manufacturing Liquid Crystal Display Device and Liquid Crystal Display Device
11/14/2013US20130300966 Thin Film Transistor Substrate, Display Apparatus Utilizing Same, and Related Manufacturing Methods
11/14/2013US20130300964 Liquid Crystal Display Device and Manufacturing Method Thereof
11/14/2013US20130300952 Touch display panel and fabricating method thereof
11/14/2013US20130299870 Light emitting device
11/14/2013US20130299869 Light-emitting module
11/14/2013US20130299868 Dry flux bonding device and method
11/14/2013US20130299867 Light-emitting diode chip
11/14/2013US20130299866 Light emitting diode with two alternative mounting sides for mounting on circuit board