Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
10/2013
10/30/2013CN103378275A Light emitting diode encapsulating structure
10/30/2013CN103378274A Light-emitting device and manufacturing method thereof
10/30/2013CN103378273A Method for encapsulating light emitting diode
10/30/2013CN103378272A Encapsulation method of sedimentation fluorescent powder and LED thereof
10/30/2013CN103378271A Packaging structure of light emitting diode and manufacturing method thereof
10/30/2013CN103378270A Manufacturing method of LED assembly and LED assembly
10/30/2013CN103378269A Light emitting device
10/30/2013CN103378268A Package and method for manufacturing package
10/30/2013CN103378267A Light-emitting diode package
10/30/2013CN103378266A Substrate structure
10/30/2013CN103378265A Method for manufacturing light emitting module carrier plate
10/30/2013CN103378264A Light-emitting diode encapsulation manufacturing process and encapsulation structure thereof
10/30/2013CN103378263A Method for manufacturing light emitting diode encapsulating structure
10/30/2013CN103378262A Light emitting diode and encapsulating method thereof
10/30/2013CN103378261A Light emitting diode encapsulating structure
10/30/2013CN103378260A Method for manufacturing packaging structure of light emitting diode
10/30/2013CN103378259A Electronic module and lighting device including electronic module
10/30/2013CN103378258A Method for packaging LED phosphor and LED lamp packaged by same
10/30/2013CN103378257A 发光二极管封装方法 The method of the light emitting diode package
10/30/2013CN103378256A LED packaging module, lighting device with same, and method for producing LED packaging module
10/30/2013CN103378255A Semiconductor light-emitting element
10/30/2013CN103378254A Light-emitting component
10/30/2013CN103378253A Novel surface roughening method for GaN-based light emitting diode
10/30/2013CN103378252A Light-emitting diode module mortise and tenon
10/30/2013CN103378251A Electrical contact structure of light emitting diode
10/30/2013CN103378250A Manufacturing method for light emitting diode
10/30/2013CN103378249A Light-emitting diode semiconductor layer having dielectric material layer and method for producing same
10/30/2013CN103378248A Patterned substrate and light emitting diode structure
10/30/2013CN103378247A Epitaxial structure body
10/30/2013CN103378246A Buffer layer structure of light emitting diode
10/30/2013CN103378245A Light emitting diode device
10/30/2013CN103378244A 发光二极管器件及其制造方法 A light emitting diode device and a manufacturing method
10/30/2013CN103378243A GaN base ultraviolet semiconductor light-emitting diode
10/30/2013CN103378242A 发光二极管 Led
10/30/2013CN103378241A Novel GaN-based light emitting diode device and producing method thereof
10/30/2013CN103378240A Light emitting device and light emitting device package
10/30/2013CN103378239A Epitaxial structure body
10/30/2013CN103378238A 发光二极管 Led
10/30/2013CN103378237A Epitaxial structure
10/30/2013CN103378236A Epitaxy structural body with microstructure
10/30/2013CN103378235A Light emitting diode
10/30/2013CN103378234A 发光二极管 Led
10/30/2013CN103378233A Light emitting diode crystal grain and light emitting diode packaging structure using same
10/30/2013CN103378232A Extracting method
10/30/2013CN103378231A Method for production of selective growth masks using imprint lithography
10/30/2013CN103378230A Production method for flat substrate with low defect density
10/30/2013CN103378229A Method for production of selective growth masks using underfill dispensing and sintering
10/30/2013CN103378228A Peeling method
10/30/2013CN103378227A Method for forming patterned sapphire substrate
10/30/2013CN103378226A Method for manufacturing light emitting diode
10/30/2013CN103378225A Manufacturing method of LED assembly and LED assembly
10/30/2013CN103378224A Preparing method of epitaxial structure
10/30/2013CN103378223A Preparation method of epitaxial structure body
10/30/2013CN103378222A Method for manufacturing graphere layer by laser
10/30/2013CN103378221A Method for preparing graphic sapphire substrate for GaN growth
10/30/2013CN103378220A High-voltage light-emitting diode chip and method for manufacturing same
10/30/2013CN103378219A Method for manufacturing LED (light-emitting diode)
10/30/2013CN103378218A Method of making patterned substrate for nitride epitaxial growth
10/30/2013CN103378122A Semiconductor light, light emitting diode array and methods of manufacture thereof
10/30/2013CN103378121A 发光二极管装置 Light-emitting diode device
10/30/2013CN103378081A Semiconductor light emitting device and production method thereof
10/30/2013CN103378079A Multiple-chip array type chip-on-board (COB) inversely-installed eutectic packaging structure and method
10/30/2013CN103378077A LED light-emitting device
10/30/2013CN103378051A Electronic device
10/30/2013CN103377908A LED chip miter cutting method, LED luminous element and LED lighting device
10/30/2013CN103377876A Preparation method of epitaxial structure body
10/30/2013CN103375691A COB-packaged LED plant lamp and production method thereof
10/30/2013CN103374348A Wavelength conversion substance
10/30/2013CN103374325A LED (Light Emitting Diode) and encapsulation adhesive thereof
10/30/2013CN102775954B LED (Light-Emitting Diode) packaging silica gel with high refractive index, light transmittance and power, and method for preparing same
10/30/2013CN102543801B Die bonder
10/30/2013CN102509754B Dispensing arm structure for die bonder
10/30/2013CN102376604B Vacuum processing equipment and temperature control method thereof, and semiconductor device processing method
10/30/2013CN102280569B High heat conducting substrate, light-emitting diode (LED) device and LED component
10/30/2013CN102268256B Fluorescent material able to emit red and green lights under excitation of blue lights and preparation method thereof
10/30/2013CN102234426B Resin composition for optical lens and optical package
10/30/2013CN102203969B Luminescent diode chip
10/30/2013CN102130241B Light emitting diode array structure and manufacturing method thereof
10/30/2013CN101997076B Light emitting diode package
10/30/2013CN101939855B Semiconductor light emitting device and method of making same
10/30/2013CN101933171B Optical-electronic component and method for production thereof
10/30/2013CN101834264B Optoelectronic component which emits electromagnetic radiation, and method for production of optoelectronic component
10/30/2013CN101794852B Lighting emitting device package
10/30/2013CN101728451B Semiconductor photoelectric element
10/30/2013CN101720513B Optoelectronic component and method for producing plurality of optoelectronic components
10/29/2013US8569948 Electroluminescent devices and methods of making electroluminescent devices including an optical spacer
10/29/2013US8569944 Light emitting device
10/29/2013US8569939 Luminous device with heat pipe and method of manufacturing heat pipe lead for luminous device
10/29/2013US8569862 Integrated circuit devices with crack-resistant fuse structures
10/29/2013US8569795 Semiconductor device and method of manufacturing the same
10/29/2013US8569794 Group III nitride semiconductor device and method for manufacturing the same, group III nitride semiconductor light-emitting device and method for manufacturing the same, and lamp
10/29/2013US8569792 Silicone resin sheet, producing method thereof, encapsulating sheet, and light emitting diode device
10/29/2013US8569791 LED and method for manufacturing the same
10/29/2013US8569790 Light emitting diode package having interconnection structures
10/29/2013US8569789 Light emitting diode package with reflective layer
10/29/2013US8569787 Light source apparatus using semiconductor light emitting device
10/29/2013US8569786 Light emitting device and illumination device
10/29/2013US8569785 Semiconductor light source for illuminating a physical space including a 3-dimensional lead frame
10/29/2013US8569784 Light emitting device and method for manufacturing the same
10/29/2013US8569783 Light-emitting device
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