| Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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| 01/28/2014 | US8637329 Method for producing semiconductor optical integrated device |
| 01/28/2014 | US8636924 Anisotropic conductive adhesive |
| 01/23/2014 | WO2014014300A2 Semiconductor light-emitting element |
| 01/23/2014 | WO2014014299A2 Semiconductor light-emitting element |
| 01/23/2014 | WO2014014298A1 Method for manufacturing semiconductor light-emitting element |
| 01/23/2014 | WO2014014178A1 Semiconductor light-emitting element, and production method, thin-film vapour-deposition device and thin-film vapour-deposition method for same |
| 01/23/2014 | WO2014014079A1 Light emitting device, wavelength conversion member, phosphor composition, and phosphor mixture |
| 01/23/2014 | WO2014014025A1 Silver-sulfidation-preventing material and method for forming silver-sulfidation-preventing film, and method for producing light-emitting device and light-emitting device |
| 01/23/2014 | WO2014014008A1 Production method for sealing layer-coated semiconductor element and semiconductor device |
| 01/23/2014 | WO2014014007A1 Sealing layer-coated semiconductor and production method for semiconductor device |
| 01/23/2014 | WO2014013984A1 Light-reflective anisotropic electro-conductive adhesive agent, and light-emitting device |
| 01/23/2014 | WO2014013665A1 Line light-emitting device and manufacturing method for same |
| 01/23/2014 | WO2014013406A1 Led with ceramic green phosphor and protected red phosphor layer |
| 01/23/2014 | WO2014012760A1 Optoelectronic semiconductor chip and method for fabricating an optoelectronic semiconductor chip |
| 01/23/2014 | WO2014012572A1 Optoelectronic semiconductor device and method for producing an optoelectronic semiconductor device |
| 01/23/2014 | WO2014012395A1 Stereo light-emitting device composed of flip-chip light-emitting unit array and manufacturing method therefor |
| 01/23/2014 | WO2014012346A1 Stereoscopic wrapped and encapsulated led chip |
| 01/23/2014 | WO2014012323A1 Method for manufacturing flip-chip bonding light-emitting diode |
| 01/23/2014 | WO2014012322A1 Flip-chip bonding nitride light-emitting diode and light-transmission substrate thereof, and manufacturing method of same |
| 01/23/2014 | WO2014012321A1 Method for manufacturing p-type and n-type semiconductor light-output vertical conduction light-emitting diodes |
| 01/23/2014 | US20140024168 Method for producing photoelectric conversion device |
| 01/23/2014 | US20140024159 Optoelectronic Device Containing at Least One Active Device Layer Having a Wurtzite Crystal Structure, and Methods of Making Same |
| 01/23/2014 | US20140024158 Method of fabricating a light-emitting element |
| 01/23/2014 | US20140024153 Producing method of semiconductor device |
| 01/23/2014 | US20140024150 Semiconductor light emitting element and method for manufacturing the same |
| 01/23/2014 | US20140022779 White light emitting device |
| 01/23/2014 | US20140021858 Electroluminescent devices and methods of making electroluminescent devices including an optical spacer |
| 01/23/2014 | US20140021592 Led lead frame structure and method of manufacturing led lead frame |
| 01/23/2014 | US20140021507 Optoelectronic Semiconductor Chip and Method for Producing Optoelectronic Semiconductor Chips |
| 01/23/2014 | US20140021506 Light emitting device and method of manufacturing the same |
| 01/23/2014 | US20140021505 Light-emitting device |
| 01/23/2014 | US20140021504 Light emitting device |
| 01/23/2014 | US20140021503 Semiconductor light emitting device |
| 01/23/2014 | US20140021502 Light-Emitting Device |
| 01/23/2014 | US20140021501 Light Emitting Diode Device with Enhanced Heat Dissipation, and the Method of Preparing the Same |
| 01/23/2014 | US20140021500 Light emitting device and manufacturing method thereof |
| 01/23/2014 | US20140021499 Flexible display apparatus and method of fabricating the same |
| 01/23/2014 | US20140021498 Light Emitting Element, Light Emitting Device Using the Light Emitting Element, and Transparent Substrate Used in Light Emitting Elements |
| 01/23/2014 | US20140021496 Thin film transistor array and el display employing thereof |
| 01/23/2014 | US20140021495 Light emitting device with phosphor wavelength conversion |
| 01/23/2014 | US20140021494 Color filter on array substrate and a manufacturing method for the same |
| 01/23/2014 | US20140021493 Solid state lighting component package with layer |
| 01/23/2014 | US20140021491 Multi-compound molding |
| 01/23/2014 | US20140021486 Light emitting diode and manufacturing method thereof |
| 01/23/2014 | US20140021483 Forming Light-Emitting Diodes Using Seed Particles |
| 01/23/2014 | US20140021482 Light emitting device having vertical structure and package thereof |
| 01/23/2014 | US20140021472 Printable medium that contains metal particles and effects etching, more particularly for making contact with silicon during the production of a solar cell |
| 01/23/2014 | US20140021442 Nitride semiconductor ultraviolet light-emitting element |
| 01/23/2014 | US20140021441 Semiconductor light emitting device and semiconductor light emitting apparatus |
| 01/23/2014 | US20140021440 Lighting device including quantum dots |
| 01/23/2014 | DE102013106858A1 Substrat für ein LED-Modul und Verfahren zu dessen Herstellung A substrate for an LED module and method for its production |
| 01/23/2014 | DE102012211143A1 Carrier e.g. circuit board, for e.g. organic LED of headlight for automobile, has guidance bodies linked with components at front side and exposed with respect to carrier at rear side, where bodies are projected over carrier at rear side |
| 01/23/2014 | DE102012105691A1 Verfahren zur Abscheidung einer elektrophoretisch abgeschiedenen partikulären Schicht, strahlungsemittierendes Halbleiterbauelement und optisches Element Method for depositing a electrophoretically deposited particulate layer, radiation-emitting semiconductor device and optical element |
| 01/22/2014 | EP2688115A1 Optical semiconductor package, optical semiconductor module, and manufacturing method of these |
| 01/22/2014 | EP2688114A1 White light source |
| 01/22/2014 | EP2688113A2 Producing method of semiconductor device |
| 01/22/2014 | EP2688095A2 Semiconductor component support and semiconductor device |
| 01/22/2014 | EP2687902A1 Quantum rod light-emitting display device |
| 01/22/2014 | EP2687572A1 Light-reflective anisotropic conductive adhesive and light-emitting device |
| 01/22/2014 | EP2686893A1 Semiconductor light emitting device and method for manufacturing the same |
| 01/22/2014 | EP2686892A1 Led having vertical contacts redistributed for flip chip mounting |
| 01/22/2014 | EP2686880A1 Led component |
| 01/22/2014 | EP2686717A1 Composite lens with diffusion |
| 01/22/2014 | EP2686604A1 Method for providing a reflective coating to a substrate for a light-emitting device |
| 01/22/2014 | CN203406333U LED packaging structure |
| 01/22/2014 | CN203406332U Light emitting diode with support provided with strip-shaped patterns |
| 01/22/2014 | CN203406331U Packaging rack set applied to light emitting diodes |
| 01/22/2014 | CN203406330U Packaging rack set applied to light emitting diodes |
| 01/22/2014 | CN203406329U Light emitting diode adopting a large divergence angle packaging mode |
| 01/22/2014 | CN203406328U A LED support with high reliability and a LED device thereof |
| 01/22/2014 | CN203406327U A packaging structure of a light emitting diode |
| 01/22/2014 | CN203406326U A light emitting diode with a special support structure |
| 01/22/2014 | CN203406325U LED integrated type copper-clad ceramic perforated substrate |
| 01/22/2014 | CN203406324U Light emitting diode with large divergence angle |
| 01/22/2014 | CN203406323U Light emitting diode with support provided with dot-shaped patterns |
| 01/22/2014 | CN203406322U Light emitting diode with large-divergence-angle pin cup |
| 01/22/2014 | CN203406321U Packaging frame set applied to light emitting diodes |
| 01/22/2014 | CN203406320U Packaging rack set applied to light emitting diodes |
| 01/22/2014 | CN203406319U Light emitting diode epitaxial wafer |
| 01/22/2014 | CN203406318U Antistatic light emitting diode epitaxial wafer |
| 01/22/2014 | CN203406317U GaN-based LED chip with high luminous efficiency |
| 01/22/2014 | CN203406316U Epitaxial wafer structure of light emitting diode |
| 01/22/2014 | CN203406315U Light emitting diode epitaxial wafer |
| 01/22/2014 | CN203406314U Blue light emitting diode epitaxial wafer structure with high light extraction rate |
| 01/22/2014 | CN203406313U Light emitting diode epitaxial wafer |
| 01/22/2014 | CN203406287U Light emitting diode using phosphor powder |
| 01/22/2014 | CN203406286U Full-color light emitting diode with improved pins |
| 01/22/2014 | CN203406285U Full-color light emitting diode |
| 01/22/2014 | CN203406284U Light-emitting apparatus |
| 01/22/2014 | CN203406282U Emitter-packaging structure |
| 01/22/2014 | CN203406026U Large-visual-angle light emitting diode module assembly |
| 01/22/2014 | CN103534919A LED driving circuit |
| 01/22/2014 | CN103534825A Encapsulant with index matched thixotropic agent |
| 01/22/2014 | CN103534824A Wavelength conversion element, method for manufacturing same, led element using the wavelength conversion element, and semiconductor laser light emitting device |
| 01/22/2014 | CN103534823A Conversion element and a light-emitting diode comprising such a conversion element |
| 01/22/2014 | CN103534822A Light emitting device and method for manufacturing same |
| 01/22/2014 | CN103534821A Light emitting diode (LED) packages, systems, devices and related methods |
| 01/22/2014 | CN103534820A Light emitting element drive circuit |
| 01/22/2014 | CN103534620A Composite lens with diffusion |
| 01/22/2014 | CN103534334A Process for producing red phosphor |