Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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01/09/2014 | US20140008692 Molded package for light emitting device and light emitting device using the same |
01/09/2014 | US20140008691 Device and electronic apparatus |
01/09/2014 | US20140008690 Phosphor for light emitting device and method for manufacturing the same, and light emitting device using the same |
01/09/2014 | US20140008689 Package of light emitting diode and method for manufacturing the same |
01/09/2014 | US20140008688 Semiconductor device and method for manufacturing the same |
01/09/2014 | US20140008687 Light emitting device package and lighting system |
01/09/2014 | US20140008686 Curable resin composition for reflection of light, and optical semiconductor device |
01/09/2014 | US20140008685 Patterned uv sensitive silicone-phosphor layer over leds |
01/09/2014 | US20140008684 Illumination system with light source, radiation converting element and filter |
01/09/2014 | US20140008683 Method for Producing a Semiconductor Chip Emitting Radiation, Semiconductor Chip Emitting Radiation, and Component Emitting Radiation |
01/09/2014 | US20140008682 Reflective pockets in led mounting |
01/09/2014 | US20140008681 Led with thin package struture and method for manufacturing the same |
01/09/2014 | US20140008680 Sialon phosphor, method for producing same, and light-emitting device package using same |
01/09/2014 | US20140008679 Substrate for mounting element and optical module |
01/09/2014 | US20140008678 Light emitting diode device |
01/09/2014 | US20140008677 Light emitting diode |
01/09/2014 | US20140008676 Optical enhancement of light emitting devices |
01/09/2014 | US20140008675 Emitting Device with Improved Extraction |
01/09/2014 | US20140008673 Light emitting apparatus and surface light source apparatus having the same |
01/09/2014 | US20140008671 Light emitting device having vertically stacked light emitting diodes |
01/09/2014 | US20140008670 Thin film transistor array substrate and liquid crystal display using the same |
01/09/2014 | US20140008669 Parallel plate slot emission array |
01/09/2014 | US20140008667 Method for manufacturing a monolithic led micro-display on an active matrix panel using flip-chip technology and display apparatus having the monolithic led micro-display |
01/09/2014 | US20140008665 Semiconductor light emitting device having multi-cell array and method of manufacturing the same |
01/09/2014 | US20140008657 Method of manufacturing flexible display and substrate for manufacturing flexible display |
01/09/2014 | US20140008655 Pixel structure and manufacturing method thereof |
01/09/2014 | US20140008654 Pixel structure of display panel and method for manufacturing the same |
01/09/2014 | US20140008610 Semiconductor light emitting device |
01/09/2014 | US20140008609 Light emitting device with nanorod therein and the forming method thereof |
01/09/2014 | US20140008608 Semiconductor light-emitting devices including contact layers to form reflective electrodes |
01/09/2014 | US20140008607 Quantum efficiency of multiple quantum wells |
01/09/2014 | US20140007930 Photo Active Layer by Silicon Quantum Dot and the Fabrication Method Thereof |
01/09/2014 | DE102013106774A1 Verfahren zur Herstellung einer Halbleiter-LED A process for producing a semiconductor LED |
01/09/2014 | DE102012211837A1 Beleuchtungsvorrichtung mit Leuchstoffanordnung und Laser Lighting device with Leuchstoffanordnung and laser |
01/09/2014 | DE102012211553A1 Housing for LED light module, has plate-like inner region serving as assembled coverage areas comprising sorting regions surrounded by separation lines, where separation lines are formed at side turned towards semiconductor light module |
01/08/2014 | EP2682993A2 Molded package for light emitting device and light emitting device using the same |
01/08/2014 | EP2682992A1 Light-emitting diode chip |
01/08/2014 | EP2682987A2 Light emitting device package |
01/08/2014 | EP2682447A2 Method of manufacturing nanophosphors, light emitting diode and method of manufacturing light emitting diode |
01/08/2014 | EP2682446A2 Illuminating device |
01/08/2014 | EP2681777A1 Semiconductor devices and fabrication methods |
01/08/2014 | CN203386813U Novel semiconductor light emitting device used for illumination |
01/08/2014 | CN203386812U LED device |
01/08/2014 | CN203386811U LED support |
01/08/2014 | CN203386810U SMD-type LED support and terminal material strip thereof |
01/08/2014 | CN203386809U Super power alternating current paster light emitting diode |
01/08/2014 | CN203386808U LED three-dimensional packaging structure |
01/08/2014 | CN203386807U LED packaging structure |
01/08/2014 | CN203386806U LED chip COB packaging structure |
01/08/2014 | CN203386805U Wafer fixing glue pressurizing device |
01/08/2014 | CN203386804U Ultraviolet and blue light LED dual-drive white light illuminating device |
01/08/2014 | CN203386803U Semiconductor light-emitting device used for high-definition LED display screen |
01/08/2014 | CN203386802U Novel LED support |
01/08/2014 | CN203386801U LED-type SMD support |
01/08/2014 | CN203386800U LED-used support |
01/08/2014 | CN203386799U LED support with cup |
01/08/2014 | CN203386798U Novel LEDSMD support |
01/08/2014 | CN203386797U High-temperature-resistance LED support |
01/08/2014 | CN203386796U LED luminous strip packaging structure |
01/08/2014 | CN203386795U Condensing chamber emission LED light source |
01/08/2014 | CN203386794U Ceramic LED light source packaging structure |
01/08/2014 | CN203386793U Led封装结构 Led package |
01/08/2014 | CN203386792U Led封装结构 Led package |
01/08/2014 | CN203386791U High-power LED support |
01/08/2014 | CN203386790U White LED having uniform color temperature and high color rendering performance |
01/08/2014 | CN203386789U Light-emitting element |
01/08/2014 | CN203386788U Feed clamping device for LED material belts |
01/08/2014 | CN203386751U Silicon-based multiple module-group layer superposing LED (Light-Emitting Diode) structure |
01/08/2014 | CN203386750U Improved-type six-chip LED package structure |
01/08/2014 | CN203386749U Saving-type dual-core wire bonding mode LED packaging structure |
01/08/2014 | CN203386748U Heat-dissipation ceramic-packaged LED light source |
01/08/2014 | CN203386737U LED die bonder die sucking swing arm device |
01/08/2014 | CN203386434U LED display module based on COB (chip on board) packaging technique and display screen |
01/08/2014 | CN203384692U LED (light-emitting diode) package lamp |
01/08/2014 | CN103503183A Led光源 Led light |
01/08/2014 | CN103503182A 氮化物半导体发光装置 The nitride semiconductor light emitting device |
01/08/2014 | CN103503181A Optoelectronic semiconductor component |
01/08/2014 | CN103503180A Conversion element for light-emitting diodes and production method |
01/08/2014 | CN103503179A Phosphor-enhanced lighting device, retrofit light bulb and light tube with reduced color appearance |
01/08/2014 | CN103503178A Optical element and semiconductor light-emitting device employing same |
01/08/2014 | CN103503177A Method for manufacturing light emitting device and light emitting device |
01/08/2014 | CN103503176A Carrier, optoelectronic component with carrier and production method thereof |
01/08/2014 | CN103503175A Component carrier assembly having a trench structure which separates component carrier regions, and method for producing a plurality of component carrier regions |
01/08/2014 | CN103503174A Super-luminescent diode |
01/08/2014 | CN103503173A Method and means for enhancing greenhouse lights |
01/08/2014 | CN103503172A Radiation-emitting semiconductor chip having integrated ESD protection |
01/08/2014 | CN103503171A Semiconductor light emitter device |
01/08/2014 | CN103503148A Semiconductor stacked body, method for manufacturing same, and semiconductor element |
01/08/2014 | CN103503136A Patterned UV sensitive silicone-phosphor layer over LEDs |
01/08/2014 | CN103503134A Light emitting diodes and substrates |
01/08/2014 | CN103500790A Flip high-voltage light-emitting diode (LED) chip structure and manufacturing method thereof |
01/08/2014 | CN103500789A Method for increasing fluorescent powder utilization rate of LED (light-emitting diode) light-emitting device and LED light-emitting device |
01/08/2014 | CN103500788A Integratable nanostructure infrared light source |
01/08/2014 | CN103500787A Ceramic COB (Chip-on-Board) packaged LED (light-emitting diode) light source with bottom capable of being directly soldered on heat sink |
01/08/2014 | CN103500786A Full-angle luminous LED (light-emitting diode) light source and preparation method thereof |
01/08/2014 | CN103500785A Surface-mounted type LED (Light Emitting Diode) packaging structure |
01/08/2014 | CN103500784A Epitaxial structure, growth process and chip process of near-infrared light emitting diode |
01/08/2014 | CN103500783A Light-emitting diode chip production method |
01/08/2014 | CN103500782A Structure of light emitting diode |
01/08/2014 | CN103500781A Efficient AlGaInP light emitting diode epitaxial wafer and preparation method thereof |