Patents
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
01/2014
01/16/2014US20140017836 Method for making light emitting diode
01/16/2014US20140017835 Liquid crystal display panel and manufacturing method thereof
01/16/2014US20140017833 Manufacturing method for liquid crystal display device
01/16/2014US20140017831 Method for enhancing electrical injection efficiency and light extraction efficiency of light-emitting devices
01/16/2014US20140017829 Light emitting device provided with lens for controlling light distribution characteristic
01/16/2014US20140017828 High-reflection submount for light-emitting diode package and fabrication method thereof
01/16/2014US20140016660 Metallic Contact for Optoelectronic Semiconductor Device
01/16/2014US20140015872 El display device, driving method thereof, and electronic equipment provided with the el display device
01/16/2014US20140015433 Driving device
01/16/2014US20140015000 Resin composition, resin sheet, cured resin sheet, resin sheet laminate, cured resin sheet laminate and method for producing same, semiconductor device and led device
01/16/2014US20140014999 Solid state lighting devices with low contact resistance and methods of manufacturing
01/16/2014US20140014998 Semiconductor light-emitting device
01/16/2014US20140014997 Nitride semiconductor light-emitting element and light source including the nitride semiconductor light-emitting element
01/16/2014US20140014996 Electroluminescence display device
01/16/2014US20140014995 Optoelectronic component and method for producing an optoelectronic component
01/16/2014US20140014994 Optoelectronic device and the manufacturing method thereof
01/16/2014US20140014993 Light-emitting device
01/16/2014US20140014992 Led mounting substrate and method of manufacturing the same
01/16/2014US20140014991 Light-Emitting Element with Window Layers Sandwiching Distributed Bragg Reflector
01/16/2014US20140014990 Light-emitting device packages and methods of manufacturing the same
01/16/2014US20140014989 Optoelectronic Semiconductor Chip and a Method for the Production Thereof
01/16/2014US20140014988 Lighting devices including patterned optical components and associated devices, systems, and methods
01/16/2014US20140014987 Methods and apparatuses for shifting chromaticity of light
01/16/2014US20140014986 Light-emitting-element mount substrate and led device
01/16/2014US20140014980 Semiconductor light-emitting device
01/16/2014US20140014979 Liquid crystal display device and manufacturing method therefor
01/16/2014US20140014978 Led module
01/16/2014US20140014977 Optoelectronic semiconductor device and method for producing an optoelectronic semiconductor device
01/16/2014US20140014976 Optical device and processing method of the same
01/16/2014US20140014975 Semiconductor chip including heat radiation member, and display module
01/16/2014US20140014974 Light-emitting device having patterned substrate and method of manufacturing thereof
01/16/2014US20140014963 Electro-optical device and electronic device
01/16/2014US20140014962 Display device and pixel defect correcting method
01/16/2014US20140014961 Display device and display panel thereof
01/16/2014US20140014944 Pixel structure and fabrication method thereof
01/16/2014US20140014913 Method of repairing short circuit defect, and display apparatus and organic light emitting display apparatus manufactured by using the method
01/16/2014US20140014912 Pixel and organic light emitting display device having the same
01/16/2014US20140014910 Organic light-emitting display apparatus and method of manufacturing the same
01/16/2014US20140014901 Light emitting diode
01/16/2014US20140014900 Light emitting source and method for emitting light based on boron nitride nanotubes
01/16/2014US20140014899 Multi-quantum well structure and light emitting diode having the same
01/16/2014US20140014898 Light emitting device and light emitting device package
01/16/2014US20140014897 Semiconductor light emitting device with doped buffer layer and method of manufacturing the same
01/16/2014US20140014896 Light emitting diode device using charge accumulation and method of manufacturing the same
01/16/2014US20140014895 Nitride semiconductor light-emitting element
01/16/2014US20140014894 High performance light emitting diode with vias
01/16/2014DE112009002597B4 LED-Beleuchtungsvorrichtung und Scheinwerfer-LED-Beleuchtungsvorrichtung LED lighting device and headlight LED lighting device
01/16/2014DE102013011663A1 Leuchtstoff und Licht-emittierende Vorrichtungen, welche diesen umfassen Fluorescent and light-emitting devices which comprise this
01/16/2014DE102012212320A1 Carrier device for receiving component e.g. LED, has carrier that is arranged with molding material with receiving area for receiving the component, and anchoring structure is designed so that molding material with carrier is anchored
01/16/2014DE102012212086A1 Verfahren zum herstellen einer komponente eines optoelektronischen bauelements und verfahren zum herstellen eines optoelektronischen bauelements A method of manufacturing a component of an optoelectronic device and methods of manufacturing an optoelectronic component
01/16/2014DE102012106364A1 Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchip The optoelectronic semiconductor chip and method for producing an optoelectronic semiconductor chip
01/16/2014DE102012106290A1 Beleuchtungs- oder Lichtempfangseinrichtung sowie Verfahren zu ihrer Herstellung Lighting or light-receiving means as well as processes for their preparation
01/16/2014DE102012105176A1 Optoelektronischer Halbleiterchip The optoelectronic semiconductor chip
01/15/2014EP2685513A1 Light-reflective anisotropic conductive adhesive and light-emitting device
01/15/2014EP2685512A1 Method for manufacturing light emitting device and mixed phosphor solution
01/15/2014EP2685511A1 Semiconductor light-emitting element and method of manufacturing thereof
01/15/2014EP2685505A1 Thin-film transistor, manufacturing method therefor, and display device
01/15/2014EP2685496A2 Light emitting apparatus
01/15/2014EP2684224A1 A light emitting module, a lamp, a luminaire and a display device
01/15/2014EP2684223A1 Housing for high-power light-emitting diodes
01/15/2014EP2683856A1 Process for manufacturing silicon-based nanoparticles from metallurgical-grade silicon or refined metallurgical-grade silicon
01/15/2014EP2683667A1 Glass system for hermetically connecting cu components, and housing for electronic components
01/15/2014CN203398164U Full-angle luminous LED bracket, and LED lamppost with same
01/15/2014CN203398163U LED support of high air tightness
01/15/2014CN203398162U Extensible integrated packaging light source
01/15/2014CN203398161U 360 degree luminous LED bracket, and LED lamppost with same
01/15/2014CN203398160U LED light source packaging structure
01/15/2014CN203398159U High-cup three-in-one straight-insert LED lamp
01/15/2014CN203398158U LED packaging structure
01/15/2014CN203398157U LED light source of low-heat-resistance packaging
01/15/2014CN203398156U LED substrate based on hard alumina materials
01/15/2014CN203398155U LED lamp bead with superhigh color rendering performance
01/15/2014CN203398154U LED lamp bead with high luminous efficiency and high color rendering performance
01/15/2014CN203398153U Led封装结构 Led package
01/15/2014CN203398152U Led
01/15/2014CN203398151U Vehicle LED assembly
01/15/2014CN203398150U Led外延片 Led wafer
01/15/2014CN203398149U Novel GaN-base light emitting diode epitaxial structure
01/15/2014CN203398113U Radiating ceramic packaged LED light source
01/15/2014CN203398110U LED light source combination of fixed-type and fixed-specification packaging
01/15/2014CN203398109U Light emitting device and illumination device
01/15/2014CN203391230U LED (Light Emitting Diode) packaging mould for PCB (Printed Circuit Board)
01/15/2014CN103518267A Group III nitride semiconductor light-emitting element and method for producing same
01/15/2014CN103518266A Group III nitride semiconductor light-emitting element
01/15/2014CN103517577A Method for manufacturing conductive post of ceramic packaging substrate
01/15/2014CN103517542A Circuit board, electronic module comprising the same, lighting device, and circuit board manufacturing method
01/15/2014CN103515521A Copper-covered ALSiC composite radiating substrate and manufacturing method thereof
01/15/2014CN103515520A Light emitting diode encapsulating structure and manufacturing method thereof
01/15/2014CN103515519A Light emitting diode and method of manufacturing the same
01/15/2014CN103515518A Encapsulating method of light emitting diode
01/15/2014CN103515517A Light emitting diode module assembly
01/15/2014CN103515516A Light-emitting diode packaging structure
01/15/2014CN103515515A Packing structure and method
01/15/2014CN103515514A Lighting device
01/15/2014CN103515513A Method for manufacturing light-emitting device
01/15/2014CN103515512A LED secondary packing process and LED pixel tube manufactured through process
01/15/2014CN103515511A Light emitting diode encapsulating structure and encapsulating method thereof
01/15/2014CN103515510A Method for manufacturing illuminating apparatus and illuminating apparatus manufactured by the same
01/15/2014CN103515509A Method for preparing large-power LED base and large-power LED base thereof
01/15/2014CN103515508A Light emitting diode package and its used heat-removal module