| Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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| 01/22/2014 | CN103533765A Method for improving metal surface roughness on ceramic substrate wihth through hole and the ceramic substrate |
| 01/22/2014 | CN103531702A LED structure of flip chip |
| 01/22/2014 | CN103531701A A light emitting diode package and a manufacturing method thereof |
| 01/22/2014 | CN103531700A Waveguide structure capable of extending operating temperature range of SLD chip |
| 01/22/2014 | CN103531699A 发光二极管装置 Light-emitting diode device |
| 01/22/2014 | CN103531698A Manufacturing method of edge-lighting-type light-emitting diodes |
| 01/22/2014 | CN103531697A Encapsulating layer-covered semiconductor element, producing method thereof, and semiconductor device |
| 01/22/2014 | CN103531696A A packaging glue forming tool and an operating method thereof |
| 01/22/2014 | CN103531695A Molded package for light emitting device and light emitting device using the same |
| 01/22/2014 | CN103531694A Backlight source of direct type backlight unit and light mixing method thereof |
| 01/22/2014 | CN103531693A Preparation method for COB (chip on board) area light source with large irritation angle |
| 01/22/2014 | CN103531692A Phosphor layer-covered LED, producing method thereof, and LED device |
| 01/22/2014 | CN103531691A Phosphor layer-covered LED, producing method thereof, and LED device |
| 01/22/2014 | CN103531690A Led芯片及其制备方法 Led chip and its preparation method |
| 01/22/2014 | CN103531689A Light emitting device |
| 01/22/2014 | CN103531688A Reflecting layer-phosphor layer-covered LED, producing method thereof, LED device, and producing method thereof |
| 01/22/2014 | CN103531687A A light emitting diode array |
| 01/22/2014 | CN103531686A Light-emitting component and manufacturing method thereof |
| 01/22/2014 | CN103531685A PSS (pattern sapphire substrate) based epitaxial wafer processing method |
| 01/22/2014 | CN103531684A Light emitting diode chip and manufacture method thereof |
| 01/22/2014 | CN103531683A Gallium nitride light emitting diode and preparation method thereof |
| 01/22/2014 | CN103531682A LED (Light Emitting Diode) chip structure capable of improving light emitting efficiency |
| 01/22/2014 | CN103531681A GaN-based white light-emitting diode and preparation method thereof |
| 01/22/2014 | CN103531680A LED epitaxy structure and preparation method thereof |
| 01/22/2014 | CN103531679A Method for preparing quantum-dot single photon source in hexagonal-prism nano microcavity |
| 01/22/2014 | CN103531678A Method for removing GaN-based epitaxial layer on substrate |
| 01/22/2014 | CN103531677A Dual-welding-arm system for automatic LED (Light Emitting Diode) wafer sorting machine |
| 01/22/2014 | CN103531676A Led manufacturing method |
| 01/22/2014 | CN103531675A Led manufacturing method |
| 01/22/2014 | CN103531674A Method of manufacturing an led |
| 01/22/2014 | CN103531673A Method of manufacturing an led |
| 01/22/2014 | CN103531672A Epitaxial growth method has the structure and porosity |
| 01/22/2014 | CN103531671A Production process of light-emitting diode and light-emitting diode |
| 01/22/2014 | CN103531670A Light-emitting diode and manufacturing method thereof |
| 01/22/2014 | CN103531669A Method for manufacturing light emitting diode packaging structure |
| 01/22/2014 | CN103531612A 半导体器件 Semiconductor devices |
| 01/22/2014 | CN103531605A 堆栈半导体装置及其制造方法 Stack semiconductor device and manufacturing method |
| 01/22/2014 | CN103531584A Light emitting device package |
| 01/22/2014 | CN103531583A A light emitting diode array module |
| 01/22/2014 | CN103531514A Encapsulating layer-covered semiconductor element, producing method thereof, and semiconductor device |
| 01/22/2014 | CN103531108A Light-emitting diode (LED) display screen and packaging method thereof |
| 01/22/2014 | CN103529635A LED (light emitting diode) plane light source for engine sheet clamp of digital color film processing machine |
| 01/22/2014 | CN103526190A Device for controlling light-emitting wavelength and uniformity of epitaxial wafers in MOCVD (Metal Organic Chemical Vapor Deposition) system and method thereof |
| 01/22/2014 | CN103525421A Method for manufacturing nano phosphors, light emitting diode and method for manufacturing light emitting diode |
| 01/22/2014 | CN103525406A Composite film and production method thereof as well as photoelectric element and photoelectric device |
| 01/22/2014 | CN103525095A Curable organopolysiloxane composition |
| 01/22/2014 | CN102458019B Cct modulating method and led light source module |
| 01/22/2014 | CN102443246B Silicon-containing resin packaging composition |
| 01/22/2014 | CN102403436B Method for manufacturing heat sink of semi-conductor light emitting component |
| 01/22/2014 | CN102339920B Light-emitting component |
| 01/22/2014 | CN102326270B Light-emitting device |
| 01/22/2014 | CN102280549B Light-emitting device and projector |
| 01/22/2014 | CN101896575B Conversion LED |
| 01/22/2014 | CN101864268B Thermal conductive adhesive |
| 01/22/2014 | CN101790800B Optoelectronic device with upconverting luminophoric medium |
| 01/22/2014 | CN101542752B Thin-film semiconductor component and component assembly |
| 01/22/2014 | CN101324305B Light-emitting diode arrays and methods of manufacture |
| 01/21/2014 | US8634021 Electronic flash, electronic camera and light emitting head |
| 01/21/2014 | US8633643 LED package, LED package module having the same and manufacturing method thereof, and head lamp module having the same and control method thereof |
| 01/21/2014 | US8633507 LED with versatile mounting ways |
| 01/21/2014 | US8633506 Semiconductor light emitting device and method for manufacturing the same |
| 01/21/2014 | US8633505 Light source having light emitting diode |
| 01/21/2014 | US8633504 Light emitting device and manufacturing method thereof |
| 01/21/2014 | US8633503 Wafer level light emitting diode package and method of fabricating the same |
| 01/21/2014 | US8633502 Lighting apparatus encapsulated with synthetic resin material having translucent illumination section and also having heat sink section mixed with thermal conductive material |
| 01/21/2014 | US8633495 Nitride semiconductor light-emitting device and method of manufacturing the same |
| 01/21/2014 | US8633473 High contrast light emitting device and method for manufacturing the same |
| 01/21/2014 | US8633467 Light emitting diode |
| 01/21/2014 | US8633408 Miniature housing and support arrangement having at least one miniature housing |
| 01/21/2014 | US8633092 Quantum well device |
| 01/21/2014 | US8633054 Organic light-emitting display device and method of manufacturing the same |
| 01/21/2014 | US8633046 Manufacturing method for semiconductor light-emitting element |
| 01/21/2014 | DE202013009082U1 Diode Diode |
| 01/16/2014 | WO2014011964A1 Metallic contact for optoelectronic semiconductor device |
| 01/16/2014 | WO2014011469A1 Light emitting diode primary optic for beam shaping |
| 01/16/2014 | WO2014011419A1 Submount for led device package |
| 01/16/2014 | WO2014011202A2 Emission in nanoscale structures via nanocavity plasmons |
| 01/16/2014 | WO2014011016A1 Optical module and method for manufacturing same |
| 01/16/2014 | WO2014010961A1 Method for manufacturing carbon nanotube film |
| 01/16/2014 | WO2014010816A1 Light emitting device, and method for fabricating the same |
| 01/16/2014 | WO2014010807A1 Method for producing electronic device containing nanoparticles |
| 01/16/2014 | WO2014010798A1 Etching chamber for manufacturing semiconductor led |
| 01/16/2014 | WO2014010779A1 Light-emitting element having a transparent electrode and production method for same |
| 01/16/2014 | WO2014010420A1 Resin composition, cured product thereof, and optical semiconductor device using same |
| 01/16/2014 | WO2014010354A1 Light emission device, illumination device, and insulating substrate |
| 01/16/2014 | WO2014010211A1 Light emitting module |
| 01/16/2014 | WO2014010161A1 Light emitting module |
| 01/16/2014 | WO2014010146A1 Bulb-shaped lamp and lighting device |
| 01/16/2014 | WO2014010140A1 Nitride semiconductor light emitting device |
| 01/16/2014 | WO2014009856A1 Reducing or eliminating nanopipe defects in iii-nitride structures |
| 01/16/2014 | WO2014009311A1 Light-reflecting substrate for led applications |
| 01/16/2014 | WO2014009141A1 Method for producing a part of an optoelectronic component and method for producing an optoelectronic component |
| 01/16/2014 | WO2014009062A1 Illuminating or light-receiving device and method for the production thereof |
| 01/16/2014 | WO2014008927A1 Method for encapsulating an optoelectronic device and light-emitting diode chip |
| 01/16/2014 | WO2014008773A1 Method of fabricating surface-mounted led module |
| 01/16/2014 | WO2013174761A3 Optoelectronic component and method for producing same |
| 01/16/2014 | WO2013171151A3 Method for producing a ceramic conversion element, ceramic conversion element and optoelectronic semiconductor component |
| 01/16/2014 | US20140017840 Nitride-based light-emitting device |
| 01/16/2014 | US20140017839 Strain-engineered bandgaps |
| 01/16/2014 | US20140017837 Method of cutting silicon substrate having light-emitting element package |