| Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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| 01/02/2014 | US20140001501 Lighting device |
| 01/02/2014 | US20140001498 Substrate for mounting a plurality of light emitting elements |
| 01/02/2014 | US20140001497 Method for providing a reflective coating to a substrate for a light emitting device |
| 01/02/2014 | US20140001496 Relampable led structure |
| 01/02/2014 | US20140001495 Light emitting diode lamp |
| 01/02/2014 | US20140001484 Method Of Manufacturing Gallium Nitride Substrate And Gallium Nitride Substrate Manufactured By The Same |
| 01/02/2014 | US20140001483 Light emitting diode and method for fabricating the same |
| 01/02/2014 | US20140001476 Semiconductor device and manufacturing method thereof |
| 01/02/2014 | US20140001475 Manufacturing method of array substrate, array substrate and lcd device |
| 01/02/2014 | US20140001463 Array substrate, display panel having the same and method of manufacturing the array substrate |
| 01/02/2014 | US20140001435 Electroluminescent light source with high light emission intensity |
| 01/02/2014 | US20140001434 Light emitting diode structure and manufacturing method thereof |
| 01/02/2014 | US20140001404 Fluorescent material of light-emitting diode and method for preparing the same |
| 01/02/2014 | US20140001156 Method for Etching a Ceramic Phosphor Converter |
| 01/02/2014 | US20140000793 Method of manufacturing an led |
| 01/02/2014 | US20140000701 Back Contact Electrodes for Cadmium Telluride Photovoltaic Cells |
| 01/02/2014 | DE102013106799A1 Verfahren zum Ätzen eines keramischen Leuchtstoffkonverters A method of etching a ceramic phosphor converter |
| 01/02/2014 | DE102013106683A1 Halbleitervorrichtungen und Verfahren zur Herstellung derselben Semiconductor devices and methods of manufacturing the same |
| 01/02/2014 | DE102012211220A1 Elektrisches Bauteil und Verfahren zum Herstellen von elektrischen Bauteilen Electrical component and method for manufacturing of electrical components |
| 01/02/2014 | DE102012211217A1 Optoelektronische bauelementevorrichtung und verfahren zum herstellen einer optoelektronischen bauelementevorrichtung Optoelectronic Devices apparatus and method for producing an opto-electronic device components |
| 01/02/2014 | DE102012210751A1 Conversion element for generating conversion radiation, has upper side, lower side facing away from upper side and side surfaces connecting upper side and lower side, and opaque region comprises first of the side surfaces |
| 01/02/2014 | DE102012210743A1 Lighting device e.g. LED-lighting module, has light sensor arranged at distance opposite to semiconductor light sources that are designed with different colors, and photoconductive optic arranged upstream of light sensor |
| 01/02/2014 | DE102012105677A1 Leuchtdiodenmodul und Kfz-Scheinwerfer Light emitting diode module and vehicle headlights |
| 01/02/2014 | DE102012105619A1 Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements Optoelectronic component and process for producing an optoelectronic component |
| 01/01/2014 | EP2680331A2 Encapsulating layer-covered semiconductor element, producing method thereof, and semiconductor device |
| 01/01/2014 | EP2680330A2 Encapsulating layer-covered semiconductor element, producing method thereof, and semiconductor device |
| 01/01/2014 | EP2680329A2 Phosphor layer-covered LED, producing method thereof, and LED device |
| 01/01/2014 | EP2680328A2 Phosphor layer-covered LED, producing method thereof, and LED device |
| 01/01/2014 | EP2680327A2 Reflecting layer-phosphor layer-covered LED, producing method thereof, LED device, and producing method thereof |
| 01/01/2014 | EP2680326A2 Semiconductor light emitting device |
| 01/01/2014 | EP2680325A2 Method of manufacturing a light emitting diode |
| 01/01/2014 | EP2680324A1 Method of manufacturing a LED |
| 01/01/2014 | EP2680323A1 Method for manufacturing a light-emitting diode (LED) |
| 01/01/2014 | EP2680322A1 Method of manufacturing an led |
| 01/01/2014 | EP2680053A1 Lighting device |
| 01/01/2014 | EP2679890A1 Lighting apparatus |
| 01/01/2014 | EP2679887A1 Light source unit |
| 01/01/2014 | EP2678887A1 Light emitting diode with polarization control |
| 01/01/2014 | EP2678881A1 Semiconductor device and fabrication method |
| 01/01/2014 | CN203377266U Flexible COB (chip on board) packaging LED |
| 01/01/2014 | CN203377265U LED packaging structure |
| 01/01/2014 | CN203377264U Backlight LED with high light emitting efficiency |
| 01/01/2014 | CN203377263U Fluorescent glue sheet LED |
| 01/01/2014 | CN203377262U LED (light-emitting diode) package module capable of being connected in parallel or in series |
| 01/01/2014 | CN203377261U Light emitting diode (LED) packaging support and LED packaging structure |
| 01/01/2014 | CN203377260U Bracket for backlight LED |
| 01/01/2014 | CN203377259U Backlight LED |
| 01/01/2014 | CN203377258U Bicrystal patch LED encapsulation structure for raising light-emitting efficiency |
| 01/01/2014 | CN203377257U Integratedly packaged LED bracket |
| 01/01/2014 | CN203377256U LED package support with mechanical support structure |
| 01/01/2014 | CN203377255U LED radiating bracket |
| 01/01/2014 | CN203377254U Strip high light flux LED package structure with green chip and red fluorescence powder |
| 01/01/2014 | CN203377253U Small module high strength LED package structure with green chip and red fluorescence powder |
| 01/01/2014 | CN203377252U Chip LED with LED drive IC |
| 01/01/2014 | CN203377251U High-thermal conductivity high-light extraction high-voltage withstanding integrated LED |
| 01/01/2014 | CN203377250U Integrated-type LED with high breakdown voltage and high thermal conductivity |
| 01/01/2014 | CN203377249U SMD-type LED support without curved surface reflection |
| 01/01/2014 | CN203377248U High reflectivity LED support |
| 01/01/2014 | CN203377247U LED packaging structure without welding |
| 01/01/2014 | CN103493229A Method and apparatus for manufacturing optical device |
| 01/01/2014 | CN103493228A Led-package manufacturing system and resin application method for led-package manufacturing system |
| 01/01/2014 | CN103493227A Light-emitting apparatus, backlight unit, liquid crystal display apparatus, and illumination apparatus |
| 01/01/2014 | CN103493226A White light source and white light source system using same |
| 01/01/2014 | CN103493225A Nitride semiconductor light-emitting element and method of manufacturing thereof |
| 01/01/2014 | CN103493224A Nitride semiconductor light-emitting chip, nitride semiconductor light-emitting device, and method for manufacturing nitride semiconductor chip |
| 01/01/2014 | CN103493223A Carbonitride and carbidonitride phosphors and lighting devices using the same |
| 01/01/2014 | CN103493144A 透明电导体 Transparent electrical conductor |
| 01/01/2014 | CN103492911A Led (light-emitting diode) luminous source module |
| 01/01/2014 | CN103492803A 直管灯 Straight tube lights |
| 01/01/2014 | CN103492796A Device and method for manipulating an emission characteristic of a light-emitting diode |
| 01/01/2014 | CN103492482A Curable resin composition for reflection of light, and optical semiconductor device |
| 01/01/2014 | CN103490003A High-reliability LED light source and LED module light source |
| 01/01/2014 | CN103490002A Manufacturing method of light emitting diodes |
| 01/01/2014 | CN103490001A Discrete type EMC packaged LED lead frame |
| 01/01/2014 | CN103490000A Semiconductor light emitting element, and light emitting device |
| 01/01/2014 | CN103489999A III-nitride semiconductor light-emitting device and method for manufacturing same |
| 01/01/2014 | CN103489998A Light-emitting assembly and manufacturing method thereof, as well as LED (light-emitting diode) lighting device with light-emitting assembly |
| 01/01/2014 | CN103489997A LED and LED manufacturing method |
| 01/01/2014 | CN103489996A White light LED packing process |
| 01/01/2014 | CN103489995A Flexible LED (light-emitting diode) light source filament |
| 01/01/2014 | CN103489994A High-adhesion and high-reliability white LED (light-emitting diode) chip |
| 01/01/2014 | CN103489993A High-reliability flip LED light source and LED module light source |
| 01/01/2014 | CN103489992A Patterned substrate and LED chip used for LED forwardly-installed structure |
| 01/01/2014 | CN103489991A Partitioned COB LED fluorescent film with high color rendering |
| 01/01/2014 | CN103489990A LED high-speed chip mounter |
| 01/01/2014 | CN103489989A Die bonding procedure of in-line LED bead packaging technology |
| 01/01/2014 | CN103489988A Encapsulating sheet, light emitting diode device, and producing method thereof |
| 01/01/2014 | CN103489987A Manufacturing method of light-emitting device |
| 01/01/2014 | CN103489986A Small-size led packaging structure for enhancing light emitting angle |
| 01/01/2014 | CN103489985A Novel LED stand and packaging structure |
| 01/01/2014 | CN103489984A Light-emitting diode packaging structure and manufacturing method thereof |
| 01/01/2014 | CN103489983A Flip-chip light emitting diode and manufacturing method and application thereof |
| 01/01/2014 | CN103489982A LED based on photonic crystal-single-layer graphene structure |
| 01/01/2014 | CN103489981A Light-emitting diode and method for manufacturing the same |
| 01/01/2014 | CN103489980A Light-emitting component and manufacturing method thereof |
| 01/01/2014 | CN103489979A Method for manufacturing semiconductor light emitting devices |
| 01/01/2014 | CN103489978A Light emitting diode and method of fabricating the same |
| 01/01/2014 | CN103489977A Light-emitting diode with all-dimensional reflecting mirror and corresponding method of light-emitting diode |
| 01/01/2014 | CN103489976A Method for improving luminance of AlGaInP quaternary single-face dual-electrode light-emitting diode with GaAs substrate |
| 01/01/2014 | CN103489975A Nitrogen polar surface light emitting diode with tunnel junction structure |