| Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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| 12/26/2013 | US20130341590 Quantum Dot Narrow-Band Downconverters for High Efficiency LEDs |
| 12/26/2013 | US20130341589 Light emitting diode and method for manufacturing the same |
| 12/26/2013 | US20130341588 Quantum rod light-emitting display device |
| 12/25/2013 | EP2677557A1 Method for bonding LED wafer, method for manufacturing LED chip and bonding structure |
| 12/25/2013 | EP2677556A2 Lighting device |
| 12/25/2013 | EP2677233A1 Light-emitting diode source of white light with a remote phosphor converter |
| 12/25/2013 | EP2677232A1 Light emitting module and lighting device for vehicle |
| 12/25/2013 | EP2676525A1 Light source and light-source band |
| 12/25/2013 | EP2676289A2 Method and apparatus for improved laser scribing of opto-electric devices |
| 12/25/2013 | EP2443465B1 Cmos moems sensor device |
| 12/25/2013 | CN203367366U Power type direct insertion white light LED |
| 12/25/2013 | CN203367365U LED back light source with high heat dissipation |
| 12/25/2013 | CN203367364U LED lamp bead for enhancing binding force between LED chip and lead wire |
| 12/25/2013 | CN203367363U Novel LED light source |
| 12/25/2013 | CN203367362U LED light source module with high luminous efficiency and based on gold thread binding |
| 12/25/2013 | CN203367361U No-light-spot high-power LED |
| 12/25/2013 | CN203367360U Wafer-level-chip packaging structure of silicon-based BGA |
| 12/25/2013 | CN203367359U A light emitting diode apparatus |
| 12/25/2013 | CN203367358U Novel-type direct-embedded white-light LED of side light extraction |
| 12/25/2013 | CN203367357U Array type combined LED module |
| 12/25/2013 | CN203367356U Metal material strip for producing LEDs and LED base structure comprising the metal material strip |
| 12/25/2013 | CN203367355U Composite substrate packed LED based on AlSiC |
| 12/25/2013 | CN203367354U Package structure of thin wafer level LED |
| 12/25/2013 | CN203367353U Box dam clamp of universal surface light source COB substrate |
| 12/25/2013 | CN203367352U Anti-glare atomization LED lamp |
| 12/25/2013 | CN203367351U SMD (surface mounted device) LED support group |
| 12/25/2013 | CN203367350U Interlayer diffusant white-light LED of direct-embedded type |
| 12/25/2013 | CN203367349U High-luminous efficiency gallium nitride-based light emitting diode chip |
| 12/25/2013 | CN203367348U Contact layer of light emitting diode epitaxial wafer |
| 12/25/2013 | CN203367347U Gallium nitride-based light emitting diode chip |
| 12/25/2013 | CN203367346U LED chip with side-surface electrodes and packaging structure for same |
| 12/25/2013 | CN203367345U Graphite base |
| 12/25/2013 | CN203367344U Light emitting diode epitaxial wafer provided with low-temperature uGaN layer |
| 12/25/2013 | CN203367343U Light-emitting layer of light emitting diode epitaxial wafer |
| 12/25/2013 | CN203367342U Nitride-based light emitting diode |
| 12/25/2013 | CN203367341U InN/AlN glass structure |
| 12/25/2013 | CN203367340U GaN-based light-emitting diode epitaxial wafer with N-SLS layer |
| 12/25/2013 | CN203367339U MQS light-emitting layer of GaN-based LED epitaxial wafer |
| 12/25/2013 | CN203367338U A light emitting diode epitaxial wafer provided with silicon-doped GaN layers |
| 12/25/2013 | CN203367337U Silicon substrate GaN epitaxial growth structure |
| 12/25/2013 | CN203367336U Full-automatic LED chip die counter chip adsorbing table |
| 12/25/2013 | CN203367279U LED line light source |
| 12/25/2013 | CN203367278U White light LED light source device |
| 12/25/2013 | CN203367277U A cylindrical LED filament |
| 12/25/2013 | CN203367276U Combined packaging structure of LED lamp beads |
| 12/25/2013 | CN203367275U Single-sided light emitting LED light source and double-sided light emitting LED light source |
| 12/25/2013 | CN203367274U LED packaging structure |
| 12/25/2013 | CN203367263U A rail-locomotive-used high efficiency heat pipe radiator |
| 12/25/2013 | CN203367256U Feeding device for direct insertion type LED lamp bead die bonder |
| 12/25/2013 | CN203366215U Industrial personnel computer hard disk constant temperature protection system |
| 12/25/2013 | CN103477708A Light source and light-source band |
| 12/25/2013 | CN103477458A Reflective substrate for light-emitting element and method for producing same |
| 12/25/2013 | CN103477457A Optical semiconductor device with lens and method for manufacturing same |
| 12/25/2013 | CN103477456A Light emitting device having wavelength converting layer |
| 12/25/2013 | CN103477455A Optoelectronic semiconductor chip |
| 12/25/2013 | CN103477454A Solid state optoelectronic device with plated support substrate |
| 12/25/2013 | CN103477453A Method for producing a semiconductor body |
| 12/25/2013 | CN103477452A 光电子半导体芯片 Optoelectronic semiconductor chip |
| 12/25/2013 | CN103477451A Method for producing at least one optoelectronic semiconductor component |
| 12/25/2013 | CN103477447A Optoelectronic devices and coatings therefore, and methods for making and using the same |
| 12/25/2013 | CN103477149A Solid state lighting device with elongated heatsink |
| 12/25/2013 | CN103476826A Polycarboxylic acid resin and composition thereof |
| 12/25/2013 | CN103474566A LED radiator |
| 12/25/2013 | CN103474565A Connection of light emitting diode unit and insulation heat conduction substrate |
| 12/25/2013 | CN103474564A COB packaging structure and COB packaging method |
| 12/25/2013 | CN103474563A Light reflecting member for optical semiconductor, and substrate for mounting optical semiconductor and optical semiconductor device using the light reflecting member |
| 12/25/2013 | CN103474562A Manufacturing method of light emitting diode |
| 12/25/2013 | CN103474561A OLED device encapsulation structure |
| 12/25/2013 | CN103474560A Light emitting device |
| 12/25/2013 | CN103474559A Fluorescent plate and preparation method thereof |
| 12/25/2013 | CN103474558A LED packaging adhesive dispensing technology and LED chip packaging structure thereof |
| 12/25/2013 | CN103474557A Method for manufacturing light-emitting diode array |
| 12/25/2013 | CN103474556A Mechanical packaging LED device and mechanical packaging method |
| 12/25/2013 | CN103474555A LED lamp bead |
| 12/25/2013 | CN103474554A LED chip encapsulation method |
| 12/25/2013 | CN103474553A High-power LED packaging film layer and preparing and packaging method thereof |
| 12/25/2013 | CN103474552A LED (light-emitting diode) lamp bead substrate fixing device |
| 12/25/2013 | CN103474551A High-power light-emitting diode (LED) substrate and packaging method thereof |
| 12/25/2013 | CN103474550A LED packaging structure and manufacture method thereof |
| 12/25/2013 | CN103474549A 半导体结构 Semiconductor structure |
| 12/25/2013 | CN103474548A 半导体结构 Semiconductor structure |
| 12/25/2013 | CN103474547A Light emitting diode |
| 12/25/2013 | CN103474546A Semiconductor structure |
| 12/25/2013 | CN103474545A Light emitting diode |
| 12/25/2013 | CN103474544A Semiconductor structure |
| 12/25/2013 | CN103474543A Light emitting diode |
| 12/25/2013 | CN103474542A Light emitting diode and manufacturing method thereof |
| 12/25/2013 | CN103474541A Device for improving luminous efficiency of silicon nitride-based thin-film light-emitting diode and preparation method of device |
| 12/25/2013 | CN103474540A Epitaxial growth method and structure of LED structure with gradually-varied potential difference thickness |
| 12/25/2013 | CN103474539A Method for epitaxial growth of LED structure containing superlattice layers and LED structure |
| 12/25/2013 | CN103474538A Light-emitting diode (LED) epitaxial wafer, manufacturing method of LED epitaxial wafer and LED chip including LED epitaxial wafer |
| 12/25/2013 | CN103474537A Epitaxial growth method and structure of light-emitting diode (LED) structure including potential barrier with gradually-varied thickness |
| 12/25/2013 | CN103474536A Gallium nitride-based broad-spectrum light-emitting diode and preparation method thereof |
| 12/25/2013 | CN103474535A 发光二极管 Led |
| 12/25/2013 | CN103474534A 发光二极管 Led |
| 12/25/2013 | CN103474533A 发光二极管 Led |
| 12/25/2013 | CN103474532A Preparation method of light emitting diode |
| 12/25/2013 | CN103474531A 发光二极管 Led |
| 12/25/2013 | CN103474530A Light emitting diode |
| 12/25/2013 | CN103474529A Method for manufacturing vertical light-emitting diode (LED) chip and vertical LED chip |