Patents
Patents for H01L 29 - Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having at least one potential-jump barrier or surface barrier; Capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. pn-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof (218,143)
01/2014
01/15/2014EP2685505A1 Thin-film transistor, manufacturing method therefor, and display device
01/15/2014EP2685504A1 Tunnel-effect transistor
01/15/2014EP2685502A1 SOI integrated circuit comprising a bipolar transistor with insulating trenches of different depths
01/15/2014EP2685501A1 SOI integrated circuit comprising an underlying protection transistor
01/15/2014EP2685499A1 SOI integrated circuit comprising a triac for protection against electrostatic discharges
01/15/2014EP2685497A1 SOI integrated circuit comprising a lateral diode for protection against electrostatic discharges
01/15/2014EP2685489A1 Device for estimating and simulating shape worked by plasma process, and simulation method and program
01/15/2014EP2685488A1 Production method for semiconductor device
01/15/2014EP2685251A2 Field-effect transistor, single-electron transistor and sensor using the same
01/15/2014EP2684217A1 Semiconductor element
01/15/2014EP2684216A2 Insulated-gate bipolar transistor
01/15/2014CN203398119U 半导体器件 Semiconductor devices
01/15/2014CN203398118U 半导体器件和集成降压转换器 Semiconductor devices and integrated buck converter
01/15/2014CN103518263A Thin-film transistor
01/15/2014CN103518254A Semiconductor device production method and semiconductor device
01/15/2014CN103518253A Local interconnect structure self-aligned to gate structure
01/15/2014CN103518252A Bipolar punch-through semiconductor device and method for manufacturing such a semiconductor device
01/15/2014CN103518003A In2O3-ZnO sputtering target
01/15/2014CN103515940A Transient voltage suppressor circuit, and diode element used in transient voltage suppressor circuit and manufacturing method of diode element
01/15/2014CN103515453A Metal-oxide-metal capacitor
01/15/2014CN103515452A Power rectification device, manufacturing method thereof and related semiconductor product
01/15/2014CN103515451A Double-recessed trench Schottky barrier device
01/15/2014CN103515450A Groove charge compensation Schottky semiconductor device and manufacturing method thereof
01/15/2014CN103515449A Schottky semiconductor device with charge compensation groove and preparing method thereof
01/15/2014CN103515448A Electrical device and method for manufacturing same
01/15/2014CN103515447A Electronic device and method of manufacturing such device
01/15/2014CN103515446A Semiconductor device and fabrication method thereof
01/15/2014CN103515445A Thin film transistor and preparation method thereof
01/15/2014CN103515444A Groove gate power MOS device
01/15/2014CN103515443A Super-junction power device and manufacturing method thereof
01/15/2014CN103515442A Single poly MOSFET device integrated with snubber
01/15/2014CN103515441A Semiconductor device having embedded strain-inducing pattern
01/15/2014CN103515440A Dummy gate electrode of semiconductor device
01/15/2014CN103515439A Trench MOSFET (metal oxide semiconductor field-effect transistor)
01/15/2014CN103515438A Semiconductor device
01/15/2014CN103515437A Structure and method for a field effect transistor
01/15/2014CN103515436A Super junction power device and manufacturing method thereof
01/15/2014CN103515435A MOS transistor and formation method thereof, and SRAM memory cell circuit
01/15/2014CN103515434A MOS transistor and formation method thereof, and SRAM memory cell circuit
01/15/2014CN103515433A NMOS transistor and formation method thereof, and SRAM memory cell circuit
01/15/2014CN103515432A P-type super node lateral double diffusion MOSFET device
01/15/2014CN103515431A Double diffusion drain metal oxide semiconductor element and manufacturing method thereof
01/15/2014CN103515430A 鳍式场效应晶体管及其制造方法 Fin field effect transistor and manufacturing method thereof
01/15/2014CN103515429A Compound semiconductor device and method for manufacturing the same
01/15/2014CN103515428A PSOI transverse high-voltage power semiconductor device
01/15/2014CN103515427A 反向导通igbt Reverse conduction igbt
01/15/2014CN103515426A Spin transistor based on multiferroic or ferroelectric material
01/15/2014CN103515425A Semiconductor device, transistor and integrated circuit device
01/15/2014CN103515424A Semiconductor device and fabricating method thereof
01/15/2014CN103515423A Semiconductor devices, transistors and methods of manufacture thereof
01/15/2014CN103515422A FinFET with high mobility and strain channel
01/15/2014CN103515421A Semiconductor structure and manufacturing process thereof
01/15/2014CN103515420A Semiconductor device and formation method thereof
01/15/2014CN103515419A Graded aluminum-gallium-nitride and superlattice buffer layer for III-V nitride layer on silicon substrate
01/15/2014CN103515418A High inverse-voltage punch through type GPP rectification chip and process
01/15/2014CN103515417A Passivation scheme
01/15/2014CN103515416A Chip structure and manufacturing method thereof
01/15/2014CN103515415A Lamination structure and manufacturing method thereof, and electronic device containing lamination structure
01/15/2014CN103515414A 晶体管装置及其制造方法 Transistor device and manufacturing method
01/15/2014CN103515395A Display device and manufacturing method for same
01/15/2014CN103515394A Thin film transistor substrate having metal oxide semiconductor and method for manufacturing the same
01/15/2014CN103515390A Integrated circuit having FINFETs with different fin profiles
01/15/2014CN103515383A Integrated power semiconductor component, production method and chopper circuit
01/15/2014CN103515373A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
01/15/2014CN103515365A Large power crimping type IGBT device
01/15/2014CN103515282A Fin field-effect transistor and forming method thereof
01/15/2014CN103515245A Channel voltage dividing field effect tube and production method based on high-energy ion implantation mode
01/15/2014CN103515244A Replacement metal gate processing with reduced interlevel dielectric layer etch rate
01/15/2014CN103515243A Transistor with recess gate and method for fabricating the same
01/15/2014CN103515242A Power transistor and manufacturing method thereof
01/15/2014CN103515240A Transverse diffusion field effect transistor structure and manufacturing method
01/15/2014CN103515239A Method for manufacturing ultra-thin SOI semiconductor device and ultra-thin SOI semiconductor device
01/15/2014CN103515238A NMOS transistor and formation method, CMOS structure and formation method thereof
01/15/2014CN103515233A Semiconductor device and method of manufacturing the same
01/15/2014CN103515232A Semiconductor structure and manufacturing method thereof
01/15/2014CN103515231A FinFET manufacturing method
01/15/2014CN103515230A Semiconductor structure and formation method thereof
01/15/2014CN103515229A Method for forming fin portion and fin field effect transistor
01/15/2014CN103515227A Method of manufacturing a semiconductor device and a semiconductor device
01/15/2014CN103515226A Buried polycrystal stripe inner transparent collector region insulated gate bipolar transistor and manufacturing method
01/15/2014CN103515225A Method for manufacturing a diode, and a diode
01/15/2014CN103515210A Gate-last process transistor and forming method thereof
01/15/2014CN103515209A Fin field effect transistor and formation method thereof
01/15/2014CN103515207A Oxide layer, interface layer in HKMG structure, MOS transistor formation method and MOS transistor
01/15/2014CN103515202A Semiconductor device and method of manufacturing semiconductor device
01/15/2014CN103515201A Method and epitaxial product for forming compound epitaxial layer through chemical bonding
01/15/2014CN103515191A 半导体结构及其形成方法 And method of forming a semiconductor structure
01/15/2014CN103510086A Zinc tin oxide thin film and preparation method thereof, and thin film transistor and preparation method thereof
01/15/2014CN103510056A Zinc oxide-based sputtering target, method of fabricating thereof and thin film transistor
01/15/2014CN102544114B Accumulation type grooved-gate diode
01/15/2014CN102544068B Bidirectional controllable silicon device based on assistant triggering of PNP-type triodes
01/15/2014CN102437191B Low grid-drain capacitance grooved metal oxide silicon (MOS) device and manufacturing method thereof
01/15/2014CN102315171B Integrated circuit device and method of manufacturing same
01/15/2014CN102214678B 3D-RESURF junction terminal structure of power semiconductor
01/15/2014CN102201344B Gate metal routing for transistor with checkerboarded layout
01/15/2014CN102171829B Multi-layer reconfigurable switches
01/15/2014CN101847605B Methods for normalizing strain in semiconductor devices and strain normalized semiconductor devices
01/15/2014CN101714550B Recessed channel array transistors, and semiconductor devices including a recessed channel array transistor
01/14/2014US8630807 Methods for the electronic, homogeneous assembly and fabrication of devices
01/14/2014US8629865 Organic light-emitting device with adjustable charge carrier injection