Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2012
07/18/2012CN102593079A Chip packaging structure and chip packaging method
07/18/2012CN102593078A Semiconductor device and manufacturing method thereof
07/18/2012CN102593077A Liquid crystal polymer (LCP) encapsulating structure and manufacturing method thereof
07/18/2012CN102593076A 半导体装置 Semiconductor device
07/18/2012CN102593075A Insulation substrate, insulation circuit substrate, production methods of insulation substrate and insulation circuit substrate, and semiconductor device
07/18/2012CN102593074A Substrate for power module, power module, and production method of substrate for power module
07/18/2012CN102593073A Manufacturing method for substrate for power module, substrate for power module and power module
07/18/2012CN102593068A Oblique-conic-shaped bump structure
07/18/2012CN102593067A Interconnection structure for LGA (Land grid array) packaging with controllable welding spot height and manufacturing method of interconnection structure
07/18/2012CN102593066A Laser hammering technique for aligning members of a constructed array of optoelectronic devices
07/18/2012CN102593065A Preparation method for backgate thin film transistor storage
07/18/2012CN102593064A Manufacturing method of gate-control diode semiconductor memory device
07/18/2012CN102593063A Manufacture method of bipolar stannous oxide phase inverter
07/18/2012CN102593062A Split-gate type flash memory structure and manufacturing method thereof
07/18/2012CN102593061A Split grid flash memory and manufacturing method thereof
07/18/2012CN102593060A Split-gate flash memory unit and manufacturing method thereof
07/18/2012CN102593059A Split gate flash memory unit and making method thereof
07/18/2012CN102593058A Manufacture method of SRAM (Static Random Access Memory) unit
07/18/2012CN102593057A Fully depleted SOI device with buried doped layer
07/18/2012CN102593056A Method capable of improving performance of PMOS device through two-step side wall etching method
07/18/2012CN102593055A Manufacturing method of high-voltage device integrated circuit
07/18/2012CN102593054A Semiconductor element and forming method of the same
07/18/2012CN102593053A Pixel structure and producing method thereof
07/18/2012CN102593052A Pixel structure and manufacture method thereof
07/18/2012CN102593051A Semiconductor device and method for manufacturing the same
07/18/2012CN102593050A Method for manufacturing liquid crystal display panel array substrate
07/18/2012CN102593049A Method and device for filling metal into micro blind holes of silicon wafer
07/18/2012CN102593048A Treatment method of aluminum wire corrosion defects
07/18/2012CN102593047A Preparation method of conductive film pattern layer based on oil-solubility nano-particle ink
07/18/2012CN102593046A Method for fabricating a semiconductor device package
07/18/2012CN102593045A Substrate processing method storage medium
07/18/2012CN102593044A Method of forming metal pillar
07/18/2012CN102593043A Increasing dielectric strength by optimizing dummy metal distribution
07/18/2012CN102593042A Chemical and mechanical grinding method and semiconductor chip cleaning method
07/18/2012CN102593041A Etching method
07/18/2012CN102593040A Integrated production method for local oxidation of silicon (LOCOS) multilayer oxide layer
07/18/2012CN102593039A Manufacturing method for mechanically actuated uniaxial strain GeOI wafer based on AlN embedded insulating layer
07/18/2012CN102593038A Shallow trench isolation manufacturing method
07/18/2012CN102593037A Semiconductor structure and making method thereof
07/18/2012CN102593036A Loading table structure and processing device
07/18/2012CN102593035A Apparatus for holding semiconductor wafers
07/18/2012CN102593034A Electronic part positioning jig
07/18/2012CN102593033A Cam-type disc clamping device
07/18/2012CN102593032A Chuck and fixation device thereof
07/18/2012CN102593031A Substrate support with electrostatic chuck having dual temperature zones
07/18/2012CN102593030A Apparatus for transporting substrates for bonding
07/18/2012CN102593029A Carrying device of semiconductor wafer
07/18/2012CN102593028A Fixation device of base plate with both surfaces mounted with devices
07/18/2012CN102593027A Die bonding pressing plate
07/18/2012CN102593026A Method for measuring coupling coefficients of floating-gate device
07/18/2012CN102593025A Multi-zone temperature control for semiconductor wafer
07/18/2012CN102593024A Method for measuring junction temperature of multi-chip embedded type packaging chip by using integrated resistor
07/18/2012CN102593023A Bulge encapsulating structure and bulge encapsulating method
07/18/2012CN102593022A Cross rolling needle guide pair
07/18/2012CN102593021A Heat conduction for chip stacks and 3-D circuits
07/18/2012CN102593020A Method of manufacturing semiconductor apparatus, the semiconductor apparatus, and ignitor using the semiconductor apparatus
07/18/2012CN102593019A Solder joint reflow process for reducing packaging failure rate
07/18/2012CN102593018A Packaging method for wafer-level semiconductor chip and semiconductor chip packaging body
07/18/2012CN102593017A Process for producing antioxidative metal layers on side surfaces of connecting parts on support plates
07/18/2012CN102593016A Method for mounting thin chip on flexible baseplate
07/18/2012CN102593015A Manufacturing method of semiconductor device
07/18/2012CN102593014A Multilayer encapsulating process and encapsulating structure of light-emitting diode (LED) driver
07/18/2012CN102593013A Charge pipe ejection device
07/18/2012CN102593012A Manufacturing method of semiconductor device
07/18/2012CN102593011A Optical identification system
07/18/2012CN102593010A Chip back side drape tin eutectic technology and loading method thereof
07/18/2012CN102593009A Method for producing substrate for power module, substrate for power module and power module
07/18/2012CN102593008A Method for preparing bottom gate self alignment zino oxide film transistor
07/18/2012CN102593007A Super junction device with multiple embedded P islands and N channels and preparation method thereof
07/18/2012CN102593006A Method for reducing contact resistance between metal and carbon material
07/18/2012CN102593005A Preparation method for silicon germanium mixed substrate on insulator
07/18/2012CN102593004A Method for forming short channel in double-injection region of silicon carbide semiconductor film
07/18/2012CN102593003A Method for reducing induction drain electrode leakage of semiconductor device gate
07/18/2012CN102593002A Vertical transistor manufacturing method and vertical transistor
07/18/2012CN102593001A Method for introducing strain to channel and device manufactured by the same
07/18/2012CN102593000A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
07/18/2012CN102592999A Method for optimizing thickness of channel layer of quantum well high electron mobility transistor (HEMT) appliance
07/18/2012CN102592998A SOI-based longitudinal SiGe bipolar transistor and a preparation method thereof
07/18/2012CN102592997A Manufacturing method of gate controlled diode semiconductor device
07/18/2012CN102592996A Preparation method for Schottky diode based on core/shell structure silicon nanowire set
07/18/2012CN102592995A Manufacture method of Zener diode
07/18/2012CN102592994A Selective etching and formation of xenon difluoride
07/18/2012CN102592993A Method for improving uniformity of chemical and mechanical planarization process for metal plug in post-gate engineering
07/18/2012CN102592992A Preparation method for highly-doped phosphorosilicate glass film
07/18/2012CN102592991A Photoresist removing method, metal wire etching method and production method of integrated circuit
07/18/2012CN102592990A Second side wall etching process of 65/55nm product
07/18/2012CN102592989A Near interface flattening back etching method of interlaminar dielectric (ILD)
07/18/2012CN102592988A Method for improving uniformity of poly opening polish nitride chemical-mechanical planarization process
07/18/2012CN102592987A Metal front dielectric layer manufacturing method
07/18/2012CN102592986A Method for forming through hole
07/18/2012CN102592985A Method for etching silicon oxide gate compensation isolation area
07/18/2012CN102592984A Image sensor and top etching method thereof
07/18/2012CN102592983A Wet etching method of Mn-Co-Ni-O thermosensitive thin film
07/18/2012CN102592982A Method for forming chip package
07/18/2012CN102592981A Self-assembly preparation method for floating gate layer of silicon nitride dielectric film with embedded metal tungsten quantum dots
07/18/2012CN102592980A Forming method for platinum metal silicide
07/18/2012CN102592979A High-k dielectric coefficient metal gate device
07/18/2012CN102592978A Photoresists and methods for use thereof
07/18/2012CN102592977A Method of manufacturing semiconductor device
07/18/2012CN102592976A P-type heavily-doped silicon carbide film extension preparation method
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