Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2012
07/19/2012WO2012094782A1 Method for improving uniformity of chemical mechanical planarization process for metal plug in post-gate process
07/19/2012WO2012071302A3 Interchangeable pumping rings to control path of process gas flow
07/19/2012WO2012071272A3 Layer structures for controlling stress of heteroepitaxially grown iii-nitride layers
07/19/2012WO2012070821A3 Layout library of flip-flop circuit
07/19/2012WO2012069606A3 Process for fabricating a field-effect transistor device implemented on a network of vertical nanowires, the resulting transistor device, an electronic device comprising such transistor devices and a processor comprising at least one such device
07/19/2012WO2012069208A9 Substrate holder for the surface treatment of substrates, and use of the substrate holder
07/19/2012WO2012066021A4 Electronic device for radiofrequency or power applications and process for manufacturing such a device
07/19/2012WO2012064912A3 Butted soi junction isolation structures and devices and method of fabrication
07/19/2012WO2012064791A3 Measuring crystal site lifetime in a non-linear optical crystal
07/19/2012WO2012064050A3 Method for manufacturing a group iii nitride substrate using a chemical lift-off process
07/19/2012WO2012058656A3 Stress regulated semiconductor and associated methods
07/19/2012WO2012057987A3 Deposition ring and electrostatic chuck for physical vapor deposition chamber
07/19/2012WO2012054305A3 Rf impedance matching network with secondary dc input
07/19/2012WO2012053782A3 Process for growing silicon carbide single crystal and device for the same
07/19/2012WO2012051133A3 Vertical semiconductor device with thinned substrate
07/19/2012WO2012047428A3 Etch-resistant coating on sensor wafers for in-situ measurement
07/19/2012WO2012040711A3 Self referencing pin
07/19/2012WO2012024114A3 Methods for forming a hydrogen free silicon containing dielectric film
07/19/2012WO2012018368A9 Parasitic plasma prevention in plasma processing chambers
07/19/2012US20120184113 Method and device for manufacturing silicon carbide substrate
07/19/2012US20120184112 Mask for crystallizing a semiconductor layer and method of crystallizing a semiconductor layer using the same
07/19/2012US20120184111 Selective plasma nitriding method and plasma nitriding apparatus
07/19/2012US20120184110 Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatus
07/19/2012US20120184109 Method of manufacturing semiconductor device and computer readable medium for storing pattern size setting program
07/19/2012US20120184108 Method of processing of nitride semiconductor wafer, nitride semiconductor wafer, method of producing nitride semiconductor device and nitride semiconductor device
07/19/2012US20120184107 Semiconductor device manufacturing method
07/19/2012US20120184106 Method and algorithm for random half pitched interconnect layout with constant spacing
07/19/2012US20120184105 Method of forming openings
07/19/2012US20120184104 Method for fabricating fine pattern in semiconductor device
07/19/2012US20120184103 Resist underlayer film composition and patterning process using the same
07/19/2012US20120184102 Method for smoothing group lll nitride semiconductor substrate
07/19/2012US20120184101 Chemically amplified positive resist composition and patterning process
07/19/2012US20120184100 Chemically amplified positive resist composition and patterning process
07/19/2012US20120184099 Laser removal of conductive seed layers
07/19/2012US20120184098 Electrochemical etching of semiconductors
07/19/2012US20120184097 Reduced Number of Masks for IC Device with Stacked Contact Levels
07/19/2012US20120184096 Semiconductor device and method for manufacturing the same
07/19/2012US20120184095 Method for Manufacturing a Semiconductor Device
07/19/2012US20120184094 Method of manufacturing silicon carbide semiconductor device
07/19/2012US20120184093 High-k/metal gate stack using capping layer methods, ic and related transistors
07/19/2012US20120184092 Method for manufacturing silicon carbide semiconductor device
07/19/2012US20120184091 Method for heat treating a silicon wafer
07/19/2012US20120184090 Method of fabricating single crystal gallium nitride semiconductor substrate, nitride gallium semiconductor substrate and nitride semiconductor epitaxial substrate
07/19/2012US20120184089 Organic Semiconductors
07/19/2012US20120184088 Method for Selective Deposition of a Semiconductor Material
07/19/2012US20120184087 Method of manufacturing lacquer using inkjet printing
07/19/2012US20120184086 Punch singulation system and method
07/19/2012US20120184085 Method for manufacturing soi substrate
07/19/2012US20120184084 Optical device wafer processing method
07/19/2012US20120184083 Semiconductor device and manufacturing method thereof
07/19/2012US20120184082 Manufacturing method of semiconductor device
07/19/2012US20120184081 Process for single and multiple level metal-insulator-metal integration with a single mask
07/19/2012US20120184080 Compact thermally controlled thin film resistors utilizing substrate contacts and methods of manufacture
07/19/2012US20120184079 Methods of manufacturing a semiconductor device
07/19/2012US20120184078 Method for manufacturing semiconductor memory device
07/19/2012US20120184077 Configuration and Fabrication of Semiconductor Structure in Which Source and Drain Extensions of Field-effect Transistor Are Defined with Different Dopants
07/19/2012US20120184076 Flash memory structure with enhanced capacitive coupling coefficient ratio (cccr) and method for fabrication thereof
07/19/2012US20120184075 Reducing dislocation formation in semiconductor devices through targeted carbon implantation
07/19/2012US20120184074 Method of manufacturing thin film transistor
07/19/2012US20120184073 Programmable high-k/metal gate memory device
07/19/2012US20120184072 Methods for manufacturing superjunction semiconductor device having a dielectric termination
07/19/2012US20120184071 Surface coating method, semiconductor device, and circuit board package
07/19/2012US20120184070 Method for forming chip package
07/19/2012US20120184069 Method for bonding of chips on wafers
07/19/2012US20120184068 Method of manufacturing semiconductor device
07/19/2012US20120184067 Releasing and post-releasing processes in fabrications for micromirror array devices
07/19/2012US20120184066 SINTERED In-Ga-Zn-O-TYPE OXIDE
07/19/2012US20120184062 Composition for forming n-type diffusion layer, method for forming n-type diffusion layer, and method for producing photovoltaic cell
07/19/2012US20120184057 Iii-nitride semiconductor laser device, and method of fabricating the iii-nitride semiconductor laser device
07/19/2012US20120184055 Making Method of Sample for Evaluation of Laser Irradiation Position and Making Apparatus Thereof and Evaluation Method of Stability of Laser Irradiation Position and Evaluation Apparatus Thereof
07/19/2012US20120184054 Manufacturing apparatus and method for semiconductor device
07/19/2012US20120184053 Method of manufacturing a magnetic read sensor having a low resistance cap structure
07/19/2012US20120183808 Method of room temperature covalent bonding
07/19/2012US20120183009 Horizontal cavity surface emitting laser diodes, vertical illuminated photodiodes, and methods of their fabrication
07/19/2012US20120183007 Surface-emitting semiconductor laser device in which an edge-emitting laser is integrated with a diffractive or refractive lens on the semiconductor laser device
07/19/2012US20120182816 Semiconductor device and manufacturing method thereof
07/19/2012US20120182808 Memory Device, Manufacturing Method and Operating Method of the Same
07/19/2012US20120182807 Three-Dimensional Stacked and-Type Flash Memory Structure and Methods of Manufacturing and Operating the Same Hydride
07/19/2012US20120182805 Strings of memory cells having string select gates, memory devices incorporating such strings, and methods of accessing and forming the same
07/19/2012US20120182703 Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices
07/19/2012US20120182702 Method of making an electronic device having a liquid crystal polymer solder mask and related devices
07/19/2012US20120182701 Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices
07/19/2012US20120182694 Lid Design for Reliability Enhancement in Flip Chip Package
07/19/2012US20120182650 Enhanced ESD Protection of Integrated Circuit in 3DIC package
07/19/2012US20120182595 Photonic mems and structures
07/19/2012US20120182355 Die attach composition for silicon chip placement on a flat substrate having improved thixotropic properties
07/19/2012US20120182066 Method of manufacturing a package for embedding one or more electronic components
07/19/2012US20120181874 Semiconductor Device and Method of Manufacture Thereof
07/19/2012US20120181710 Semiconductor Chip and Method for Fabricating the Same
07/19/2012US20120181708 Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor device
07/19/2012US20120181707 Distributed Metal Routing
07/19/2012US20120181706 Power semiconductor package structure and manufacturing method thereof
07/19/2012US20120181705 Pitch division patterning techniques
07/19/2012US20120181704 Semiconductor module with micro-buffers
07/19/2012US20120181703 Patternable adhesive composition, semiconductor package using the same, and method of manufacturing semiconductor package
07/19/2012US20120181701 Multilayer Connection Structure and Making Method
07/19/2012US20120181699 Semiconductor Structure and Manufacturing Method of the Same
07/19/2012US20120181698 Forming through-silicon-vias for multi-wafer integrated circuits
07/19/2012US20120181697 Method to control metal semiconductor micro-structure
07/19/2012US20120181696 Package carrier and manufacturing method thereof
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