Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2012
08/01/2012CN101540282B Semiconductor lamination and manufacturing method thereof
08/01/2012CN101295734B Semiconductor device and method for manufacturing the same
07/2012
07/31/2012USRE43560 Positive photosensitive compositions
07/31/2012US8234600 Computer readable storage medium storing program for generating reticle data, and method of generating reticle data
07/31/2012US8234595 Method of designing a mask layout
07/31/2012US8234528 Systems and methods for monitoring a memory system
07/31/2012US8234013 Semiconductor manufacturing system and method for waste liquid collection
07/31/2012US8234002 Closed container and control system for closed container
07/31/2012US8233120 Liquid crystal display device with light-shielding color filter pattern and method for fabricating the same
07/31/2012US8233065 Charge detection device and charge detection method, solid-state imaging device and driving method thereof, and imaging device
07/31/2012US8232858 Microelectromechanical (MEM) thermal actuator
07/31/2012US8232655 Bump pad metallurgy employing an electrolytic Cu / electorlytic Ni / electrolytic Cu stack
07/31/2012US8232643 Lead free solder interconnections for integrated circuits
07/31/2012US8232626 Via and method of via forming and method of via filling
07/31/2012US8232625 ESD network circuit with a through wafer via structure and a method of manufacture
07/31/2012US8232614 Package systems having a conductive element through a substrate thereof and manufacturing methods of the same
07/31/2012US8232612 Semiconductor transistors having high-K gate dielectric layers, metal gate electrode regions, and low fringing capacitances
07/31/2012US8232607 Borderless contact for replacement gate employing selective deposition
07/31/2012US8232603 Gated diode structure and method including relaxed liner
07/31/2012US8232599 Bulk substrate FET integrated on CMOS SOI
07/31/2012US8232598 Display device and method for manufacturing the same
07/31/2012US8232595 Semiconductor device including a power MISFET and method of manufacturing the same
07/31/2012US8232594 Semiconductor device and method of manufacturing the same
07/31/2012US8232589 Semiconductor integrated circuit device with reduced leakage current
07/31/2012US8232581 Method for manufacturing an III-V engineered substrate and the III-V engineered substrate thereof
07/31/2012US8232575 Organic light emitting diode display and method for manufacturing the same
07/31/2012US8232564 Wafer level phosphor coating technique for warm light emitting diodes
07/31/2012US8232538 Method and apparatus of halogen removal using optimal ozone and UV exposure
07/31/2012US8232264 Free of medium chain glycerides; topical delivery to skin; vehicle comprising at least two penetration enhancers such as propylene glycol, diisopropyl adipate, dimethyl isosorbide, 1,2,6-hexanetriol, and benzyl alcohol, as well as solvents and emulsifiers
07/31/2012US8232217 Film deposition apparatus, method of manufacturing a semiconductor device, and method of coating the film deposition apparatus
07/31/2012US8232216 Semiconductor manufacturing apparatus and method for manufacturing a semiconductor
07/31/2012US8232215 Spacer linewidth control
07/31/2012US8232214 Liquid crystal display device and method of fabricating the same
07/31/2012US8232213 Semiconductor device and manufacturing method thereof, and liquid crystal display device
07/31/2012US8232212 Within-sequence metrology based process tuning for adaptive self-aligned double patterning
07/31/2012US8232211 Methods for self-aligned self-assembled patterning enhancement
07/31/2012US8232210 Double patterning process for integrated circuit device manufacturing
07/31/2012US8232209 Processes for forming electronic devices including polishing metal-containing layers
07/31/2012US8232208 Stabilized chemical mechanical polishing composition and method of polishing a substrate
07/31/2012US8232207 Substrate processing method
07/31/2012US8232206 Methods of forming electrical contacts to structures that are at different heights over a substrate relative to one another
07/31/2012US8232205 Methods of manufacturing a honeycomb extrusion die
07/31/2012US8232204 Method of forming borderless contact for transistor
07/31/2012US8232203 Methods of manufacturing memory devices
07/31/2012US8232202 Image sensor package and fabrication method thereof
07/31/2012US8232201 Schemes for forming barrier layers for copper in interconnect structures
07/31/2012US8232200 Methods of forming integrated circuit devices having damascene interconnects therein with metal diffusion barrier layers and devices formed thereby
07/31/2012US8232199 Method of fabricating semiconductor device comprises a photoresist pattern having a desired critical dimension
07/31/2012US8232198 Self-aligned permanent on-chip interconnect structure formed by pitch splitting
07/31/2012US8232197 Method of manufacturing a semiconductor device from which damage layers and native oxide films in connection holes have been removed
07/31/2012US8232196 Interconnect structure having a via with a via gouging feature and dielectric liner sidewalls for BEOL integration
07/31/2012US8232195 Method for fabricating back end of the line structures with liner and seed materials
07/31/2012US8232194 Process for chip capacitive coupling
07/31/2012US8232193 Method of forming Cu pillar capped by barrier layer
07/31/2012US8232192 Process of bonding circuitry components
07/31/2012US8232191 Semiconductor device manufacturing method
07/31/2012US8232190 Three dimensional vertical E-fuse structures and methods of manufacturing the same
07/31/2012US8232189 Dielectric film manufacturing method
07/31/2012US8232188 High-K metal gate electrode structures formed by separate removal of placeholder materials using a masking regime prior to gate patterning
07/31/2012US8232187 Doping method for semiconductor device
07/31/2012US8232186 Methods of integrating reverse eSiGe on NFET and SiGe channel on PFET, and related structure
07/31/2012US8232185 Method for manufacturing semiconductor chip, adhesive film for semiconductor, and composite sheet using the film
07/31/2012US8232184 Method for manufacturing silicon carbide semiconductor device and the silicon carbide semiconductor device
07/31/2012US8232183 Process and apparatus for wafer-level flip-chip assembly
07/31/2012US8232182 Fabrication of electronic and photonic systems on flexible substrates by layer transfer method
07/31/2012US8232181 Manufacturing method of semiconductor device
07/31/2012US8232180 Manufacturing method of semiconductor device comprising active region divided by STI element isolation structure
07/31/2012US8232179 Method to improve wet etch budget in FEOL integration
07/31/2012US8232178 Method for forming a semiconductor device with stressed trench isolation
07/31/2012US8232177 Method of generating uniformly aligned well and isolation regions in a substrate and resulting structure
07/31/2012US8232176 Dielectric deposition and etch back processes for bottom up gapfill
07/31/2012US8232175 Damascene metal-insulator-metal (MIM) device with improved scaleability
07/31/2012US8232174 Method for controlled formation of the resistive switching material in a resistive switching device and device obtained thereof
07/31/2012US8232173 Structure and design structure for high-Q value inductor and method of manufacturing the same
07/31/2012US8232172 Stress enhanced transistor devices and methods of making
07/31/2012US8232171 Structure with isotropic silicon recess profile in nanoscale dimensions
07/31/2012US8232169 Resistor in an integrated circuit
07/31/2012US8232168 Method for making asymmetric double-gate transistors by which asymmetric and symmetric double-gate transistors can be made on the same substrate
07/31/2012US8232167 Applying epitaxial silicon in disposable spacer flow
07/31/2012US8232166 Method for fabricating semiconductor device with recess gate
07/31/2012US8232165 Film wrapped NFET nanowire
07/31/2012US8232164 Damascene method of forming a semiconductor structure and a semiconductor structure with multiple fin-shaped channel regions having different widths
07/31/2012US8232163 Lateral epitaxial grown SOI in deep trench structures and methods of manufacture
07/31/2012US8232162 Forming implanted plates for high aspect ratio trenches using staged sacrificial layer removal
07/31/2012US8232161 Semiconductor device and manufacturing method of the same
07/31/2012US8232160 Phase change memory device and method of manufacturing the same
07/31/2012US8232159 Phase change memory device having buried conduction lines directly underneath phase change memory cells and fabrication method thereof
07/31/2012US8232158 Compensated isolated p-well DENMOS devices
07/31/2012US8232157 Semiconductor device and method of manufacturing the same
07/31/2012US8232156 Vertical heterojunction bipolar transistors with reduced base-collector junction capacitance
07/31/2012US8232155 Structure and method for manufacturing device with a V-shape channel nMOSFET
07/31/2012US8232154 Method for fabricating semiconductor device
07/31/2012US8232153 Silicon device on Si:C-OI and SGOI and method of manufacture
07/31/2012US8232152 Removing method of a hard mask
07/31/2012US8232151 Structure and method for manufacturing asymmetric devices
07/31/2012US8232150 Structure and method of forming a transistor with asymmetric channel and source/drain regions
07/31/2012US8232149 SOI device having an increasing charge storage capacity of transistor bodies and method for manufacturing the same
07/31/2012US8232148 Structure and method to make replacement metal gate and contact metal
07/31/2012US8232146 Semiconductor device with resistor and fuse and method of manufacturing the same
07/31/2012US8232145 Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards
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