Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2012
08/01/2012CN102623587A Manufacturing method for light emitting diode (LED) chip
08/01/2012CN102623561A Dynamic solar cell clamping device
08/01/2012CN102623546A Silicon chip texturing method and solar cell manufactured through using the method
08/01/2012CN102623515A Mos varactor structure and methods
08/01/2012CN102623513A Diode structures with controlled injection efficiency for fast switching
08/01/2012CN102623512A Fast soft recovery diode and method for producing same
08/01/2012CN102623510A Thin film transistor with tantalum oxide insulation layer and preparation method of thin film transistor
08/01/2012CN102623509A High-voltage switch device and manufacturing method thereof
08/01/2012CN102623508A Graphene field effect transistor and preparation method thereof
08/01/2012CN102623505A Vertical dual-gate-based anti-radiation transistor and manufacturing method thereof
08/01/2012CN102623504A Super junction semiconductor device with novel terminal structure and manufacture method thereof
08/01/2012CN102623502A Common-source operational amplifier and manufacture method for same
08/01/2012CN102623501A Shielded gate trench MOSFET with increased source-metal contact
08/01/2012CN102623500A Trench power MOSFET with reduced on-resistance
08/01/2012CN102623497A Double diffused metal oxide semiconductor device and manufacturing method thereof
08/01/2012CN102623495A Tunneling field effect transistor with multi-doping pocket structure and manufacturing method for tunneling field effect transistor
08/01/2012CN102623494A Nitride semiconductor device and method for manufacturing same
08/01/2012CN102623491A High-voltage withstanding device in bipolar low-voltage process and manufacturing method thereof
08/01/2012CN102623490A Low gate-leakage structure and method for gallium nitride enhancement mode transistor
08/01/2012CN102623489A Semiconductor device and method of manufacturing the same
08/01/2012CN102623487A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
08/01/2012CN102623484A Gating diode array of phase-change memory and preparation method thereof
08/01/2012CN102623461A Thin film transistor array substrate and manufacturing method thereof
08/01/2012CN102623460A Thin-film transistor array substrate and method of fabricating the same
08/01/2012CN102623459A Thin-film transistor memory and preparation method thereof
08/01/2012CN102623457A Semiconductor structure, manufacturing method thereof and operating method
08/01/2012CN102623456A Vertical nonvolatile memory devices having reference features
08/01/2012CN102623455A Nonvolatile memory cell and method for manufacturing same
08/01/2012CN102623453A Power device, preparation method and energy-saving electronic lighting circuit using the same
08/01/2012CN102623448A Multiple patterning method
08/01/2012CN102623444A Integrated circuit device and method for preparing the same
08/01/2012CN102623441A Semiconductor device and method of fabricating the same
08/01/2012CN102623440A Semiconductor device, method of manufacturing semiconductor device, and electronic device
08/01/2012CN102623437A Through silicon via (TSV) structure and manufacturing method thereof
08/01/2012CN102623436A Distributed metal routing
08/01/2012CN102623435A Barrier layer and preparation method thereof
08/01/2012CN102623434A Diffusion barrier layer and preparation method thereof
08/01/2012CN102623430A Semiconductor device and manufacturing method therefor
08/01/2012CN102623427A Semiconductor packaging structure and packaging method thereof
08/01/2012CN102623426A Semiconductor packaging structure and method thereof
08/01/2012CN102623425A Device including two semiconductor chips and manufacturing thereof
08/01/2012CN102623424A Chip package and method for forming the same
08/01/2012CN102623423A Integrated circuit pattern and multiple patterning method
08/01/2012CN102623416A Unpacked structure for power device of radio frequency power amplification module and assembly method for unpacked structure
08/01/2012CN102623415A Semiconductor encapsulation structure and manufacturing method thereof
08/01/2012CN102623410A Dram cell based on conductive nanochannel plate
08/01/2012CN102623409A Method for forming silicon nitride film with double stress layers
08/01/2012CN102623408A Method for forming silicon nitride thin film with two stress layers
08/01/2012CN102623407A Method for forming double-stress-layer silicon nitride thin film
08/01/2012CN102623406A Method for producing two layers of semiconductor devices with half empty structure
08/01/2012CN102623405A Method for forming semiconductor structure
08/01/2012CN102623404A Manufacturing method for electrostatic discharge (ESD) device, ESD device and electronic equipment
08/01/2012CN102623403A Semiconductor element and manufacturing method thereof
08/01/2012CN102623402A Manufacturing method for semiconductor integrated device
08/01/2012CN102623401A Repairing and manufacturing process of pixel points of TFT (Thin Film Transistor) array substrate
08/01/2012CN102623400A Display device, method for manufacturing display device, and SOI substrate
08/01/2012CN102623399A Production method for array substrate of active-matrix organic light-emitting display (OLED)
08/01/2012CN102623398A Method for manufacturing junction-free thin film transistor
08/01/2012CN102623397A Array substrate structure for display panel and method of making the same
08/01/2012CN102623396A Method for forming connection holes
08/01/2012CN102623395A Method for treating surface of low dielectric constant film
08/01/2012CN102623394A Long-term heat-treated integrated circuit arrangements and methods for producing the same
08/01/2012CN102623393A Method for filling micropores by utilizing tin whisker growth
08/01/2012CN102623392A Manufacturing method of semiconductor device and semiconductor device
08/01/2012CN102623391A Semiconductor device and method of forming integrated passive device over semiconductor die with conductive bridge and fan-out redistribution layer
08/01/2012CN102623390A Methods for fabricating semiconductor devices having local contacts
08/01/2012CN102623389A Method for preparing metal nitride barrier layer
08/01/2012CN102623388A Formation method of metal interconnection
08/01/2012CN102623387A Method for preparing silicon on insulator (SOI) material based on buried-layer nitride ceramic backing base
08/01/2012CN102623386A Preparation method of germanium on insulator (GOI) thin film with tensile strain
08/01/2012CN102623385A Manufacturing method of three-dimensional array grid-last type Si-NWFET (Nanowire Field Effect Transistor) based on SOI (Silicon On Insulator)
08/01/2012CN102623384A Manufacturing method of longitudinal stacking grid-last type Si-NWFET (Silicon-Nanowire Field Effect Transistor) based on SOI (Silicon On Insulator)
08/01/2012CN102623383A Bulk-silicon-based manufacturing method for vertically stacked under-gate type silicon nano-wire metal oxide semiconductor field effect transistor (SiNWFET)
08/01/2012CN102623382A Silicon on insulator (SOI)-based manufacturing method for three-dimensional array type silicon nano-wire metal oxide semiconductor field effect transistor
08/01/2012CN102623381A Methods for fabricating integrated passive devices on glass substrates
08/01/2012CN102623380A Chip component clamping apparatus and clamping method thereof
08/01/2012CN102623379A Electrostatic holding device and semiconductor processing apparatus
08/01/2012CN102623378A Tube positioning device
08/01/2012CN102623377A Gripper device of automatic silicon wafer loading and unloading machine
08/01/2012CN102623376A Loading frame of plastic packaging materials in QFN (Quad Fiat Nolead) packaging process
08/01/2012CN102623375A Z-axis lifting mechanism with stress state balancing function
08/01/2012CN102623374A Pole identification and position correcting and sequencing device in plug-in mounting process of diode
08/01/2012CN102623373A Working method for cutting
08/01/2012CN102623372A Automatic wafer-separating device for wet silicon wafers
08/01/2012CN102623371A Chip scale package (CSP) chip mounting loading device and mounting method
08/01/2012CN102623370A High-concentrating photovoltaic-photoelectric conversion receiver test system device
08/01/2012CN102623369A Wafer test method
08/01/2012CN102623368A Wafer defect detection method
08/01/2012CN102623367A Process for testing later-stage reliability of nondestructive copper
08/01/2012CN102623366A Method for monitoring annealing process temperature
08/01/2012CN102623365A A spot measurement method and device thereof
08/01/2012CN102623364A Eutectic process for coating tin on substrate and chip mounting method thereof
08/01/2012CN102623363A Method for joining bonding wire, semiconductor device, and method for manufacturing semiconductor device
08/01/2012CN102623362A Three-dimensional packaging method and package
08/01/2012CN102623361A Thermal gradient reflow for forming columnar grain structures for solder bumps
08/01/2012CN102623360A Method for manufacturing semiconductor device
08/01/2012CN102623359A Semiconductor encapsulation structure and manufacturing method thereof
08/01/2012CN102623358A Rotationally decoupling two-degree freedom leveling mechanism
08/01/2012CN102623357A Manufacture method of triode lead frame
08/01/2012CN102623356A Preparation method of chip-scale weldable ceramic heat sink
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