Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2012
08/07/2012US8236709 Method of fabricating a device using low temperature anneal processes, a device and design structure
08/07/2012US8236708 Reduced pattern loading using bis(diethylamino)silane (C8H22N2Si) as silicon precursor
08/07/2012US8236707 Method of manufacturing a semiconductor device
08/07/2012US8236706 Method and apparatus for growing thin oxide films on silicon while minimizing impact on existing structures
08/07/2012US8236705 Deposition of viscous material
08/07/2012US8236704 Etchant and array substrate having copper lines etched by the etchant
08/07/2012US8236703 Methods for removing contaminants from aluminum-comprising bond pads and integrated circuits therefrom
08/07/2012US8236702 Method of fabricating openings and contact holes
08/07/2012US8236701 Plasma processing apparatus and plasma processing method
08/07/2012US8236700 Method for patterning an ARC layer using SF6 and a hydrocarbon gas
08/07/2012US8236699 Contact patterning method with transition etch feedback
08/07/2012US8236698 Method for forming non-aligned microcavities of different depths
08/07/2012US8236697 Method for manufacturing semiconductor device
08/07/2012US8236696 Transistor and method for fabricating the same
08/07/2012US8236695 Method of passivating chemical mechanical polishing compositions for copper film planarization processes
08/07/2012US8236694 Method for manufacturing micromechanical components
08/07/2012US8236693 Methods of forming silicides of different thicknesses on different structures
08/07/2012US8236692 Method of manufacturing semiconductor device, cleaning method and cleaning control apparatus
08/07/2012US8236691 Method of high aspect ratio plug fill
08/07/2012US8236690 Method for fabricating semiconductor package substrate having different thicknesses between wire bonding pad and ball pad
08/07/2012US8236689 Method for applying a structure to a semiconductor element
08/07/2012US8236688 Integrated circuit system with through silicon via and method of manufacture thereof
08/07/2012US8236687 Die-bonding method of LED chip and LED manufactured by the same
08/07/2012US8236686 Dual metal gates using one metal to alter work function of another metal
08/07/2012US8236684 Prevention and reduction of solvent and solution penetration into porous dielectrics using a thin barrier layer
08/07/2012US8236683 Conductor structure including manganese oxide capping layer
08/07/2012US8236682 Method of forming contact structure
08/07/2012US8236681 Manufacturing method of semiconductor integrated circuit device
08/07/2012US8236680 Nanoscale, spatially-controlled Ga doping of undoped transparent conducting oxide films
08/07/2012US8236679 Manufacturing method of semiconductor memory device using insulating film as charge storage layer
08/07/2012US8236678 Tunable spacers for improved gapfill
08/07/2012US8236677 RTA for fabrication of solar cells
08/07/2012US8236676 Integrated circuit having doped semiconductor body and method
08/07/2012US8236675 Semiconductor device and method of fabricating a semiconductor device
08/07/2012US8236674 Substrate processing method and semiconductor device manufacturing method including a proton injection step and a laser irradiation step
08/07/2012US8236673 Methods of fabricating vertical semiconductor device utilizing phase changes in semiconductor materials
08/07/2012US8236672 Semiconductor device and method for manufacturing semiconductor device
08/07/2012US8236671 Method of manufacturing semiconductor device
08/07/2012US8236670 Method of applying a pattern of metal, metal oxide and/or semiconductor material on a substrate
08/07/2012US8236669 High-temperature spin-on temporary bonding compositions
08/07/2012US8236668 Method for manufacturing SOI substrate
08/07/2012US8236667 Silicon on insulator (SOI) wafer and process for producing same
08/07/2012US8236666 Semiconductor device and process for producing same
08/07/2012US8236665 Method for manufacturing semiconductor device with SEG film active region
08/07/2012US8236664 Phase change memory device accounting for volume change of phase change material and method for manufacturing the same
08/07/2012US8236663 Dual-damascene process to fabricate thick wire structure
08/07/2012US8236662 Bipolar transistor with raised extrinsic self-aligned base using selective epitaxial growth for BiCMOS integration
08/07/2012US8236661 Self-aligned well implant for improving short channel effects control, parasitic capacitance, and junction leakage
08/07/2012US8236660 Monolayer dopant embedded stressor for advanced CMOS
08/07/2012US8236659 Source and drain feature profile for improving device performance and method of manufacturing same
08/07/2012US8236658 Methods for forming a transistor with a strained channel
08/07/2012US8236657 Replacing symmetric transistors with asymmetric transistors
08/07/2012US8236656 Method and apparatus for controlling a circuit with a high voltage sense device
08/07/2012US8236655 Fuse link structures using film stress for programming and methods of manufacture
08/07/2012US8236654 Reduction of threshold voltage variation in transistors comprising a channel semiconductor alloy by reducing deposition non-uniformities
08/07/2012US8236653 Configuration and method to form MOSFET devices with low resistance silicide gate and mesa contact regions
08/07/2012US8236652 Semiconductor device with buried bit lines and method for fabricating the same
08/07/2012US8236651 Shielded gate trench MOSFET device and fabrication
08/07/2012US8236650 Vertical-type non-volatile memory devices and methods of manufacturing the same
08/07/2012US8236649 Semiconductor memory device with spacer shape floating gate and manufacturing method of the semiconductor memory device
08/07/2012US8236648 Trench MOS transistor and method of manufacturing the same
08/07/2012US8236647 Method for fabricating nonvolatile memory device
08/07/2012US8236646 Non-volatile memory manufacturing method using STI trench implantation
08/07/2012US8236645 Integrated circuits having place-efficient capacitors and methods for fabricating the same
08/07/2012US8236644 Trench structure and method of forming the trench structure
08/07/2012US8236643 Method of manufacturing semiconductor device including ferroelectric capacitor
08/07/2012US8236642 Fully isolated high-voltage MOS device
08/07/2012US8236641 Semiconductor device with extension structure and method for fabricating the same
08/07/2012US8236640 Method of fabricating a semiconductor device having gate finger elements extended over a plurality of isolation regions formed in the source and drain regions
08/07/2012US8236639 Semiconductor device manufacturing method
08/07/2012US8236638 Shallow trench isolation for SOI structures combining sidewall spacer and bottom liner
08/07/2012US8236637 Planar silicide semiconductor structure
08/07/2012US8236636 Hybrid orientation semiconductor structure with reduced boundary defects and method of forming same
08/07/2012US8236635 Method for manufacturing semiconductor device
08/07/2012US8236633 Semiconductor device and method for manufacturing the same
08/07/2012US8236632 FET structures with trench implantation to improve back channel leakage and body resistance
08/07/2012US8236631 Four-transistor Schmitt trigger inverter with hysteresis
08/07/2012US8236630 Manufacturing method of semiconductor device, semiconductor device, and electronic device
08/07/2012US8236629 Method for manufacturing thin film integrated circuit, and element substrate
08/07/2012US8236628 Array substrate and manufacturing method
08/07/2012US8236627 Manufacturing method of semiconductor device
08/07/2012US8236626 Narrow graphene nanoribbons from carbon nanotubes
08/07/2012US8236625 Method of forming a multi-channel ESD device
08/07/2012US8236624 Method for producing a thyristor
08/07/2012US8236623 Memory cell that employs a selectively fabricated carbon nano-tube reversible resistance-switching element and methods of forming the same
08/07/2012US8236621 Mold resin sealing device and molding method
08/07/2012US8236620 Method of manufacturing a semiconductor device
08/07/2012US8236619 Method of making a semiconductor chip assembly with a post/base heat spreader and a mulitlevel conductive trace
08/07/2012US8236618 Method of making a semiconductor chip assembly with a post/base/post heat spreader
08/07/2012US8236617 Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure
08/07/2012US8236615 Passivation layer surface topography modifications for improved integrity in packaged assemblies
08/07/2012US8236614 Semiconductor device manufacturing method
08/07/2012US8236613 Wafer level chip scale package method using clip array
08/07/2012US8236612 Partially patterned lead frames and methods of making and using the same in semiconductor packaging
08/07/2012US8236611 Die singulation method and package formed thereby
08/07/2012US8236610 Forming semiconductor chip connections
08/07/2012US8236609 Packaging an integrated circuit die with backside metallization
08/07/2012US8236608 Stacking package structure with chip embedded inside and die having through silicon via and method of the same
08/07/2012US8236607 Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof
08/07/2012US8236606 Method and system for providing a low-profile semiconductor assembly