Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2012
08/01/2012CN102623355A Method for manufacturing N-trench lateral dual-diffusion metal oxide semiconductor (N-LDMOS)
08/01/2012CN102623354A Manufacturing method of P-LDMOS (P-Laterally Diffused Metal Oxide Semiconductor)
08/01/2012CN102623353A Manufacturing method of N-LDMOS (N-Laterally Diffused Metal Oxide Semiconductor)
08/01/2012CN102623352A P-LDMOS (P-Type Laterally Diffused Metal Oxide Semiconductor) manufacturing method
08/01/2012CN102623351A Transistor capable of improving tunnel penetration field effect
08/01/2012CN102623350A Manufacturing method for semiconductor devices with super junction structures
08/01/2012CN102623349A Semiconductor device having super junction structure and method for manufacturing the same
08/01/2012CN102623348A Semiconductor device and manufacturing method of the same
08/01/2012CN102623347A Manufacturing method of three-dimensional array SiNWFET (Silicon-Nanowire Field Effect Transistor) based on bulk silicon
08/01/2012CN102623346A Transistor manufacturing method
08/01/2012CN102623345A Embedded multi-N-island P-channel hyperconjugation device and preparation method thereof
08/01/2012CN102623344A Bottom gate type thin film transistor, method of manufacturing the same, and display apparatus
08/01/2012CN102623343A Side wall hollow layer structure for semiconductor device and preparation method for side wall hollow layer structure
08/01/2012CN102623342A Semiconductor devices having encapsulated stressor regions and related fabrication methods
08/01/2012CN102623341A Preparation method of MOS transistor
08/01/2012CN102623340A Method for preparing groove-type double-layer grid MOS device
08/01/2012CN102623339A Method for improving thickness uniformity of intermediate oxide layer of double-layer grid MOS structure
08/01/2012CN102623338A Manufacturing method of longitudinal stacking grid-last type silicon-nanowire field effect transistor based on SOI (Silicon On Insulator)
08/01/2012CN102623337A Transistor and making method thereof
08/01/2012CN102623336A Manufacturing method of gallium-arsenide-based microwave monolithic integrated circuit power device
08/01/2012CN102623335A Method for improving power density of electric energy conversion device
08/01/2012CN102623334A Method for forming silicon nitride film with double stress layers
08/01/2012CN102623333A Method for forming silicon nitride film with double stress layers
08/01/2012CN102623332A Device for peeling silica thin films off silicon crystal wafers and method thereof
08/01/2012CN102623331A Method for preparing automatic alignment contact hole in PSG interlayer film
08/01/2012CN102623330A Method for forming front metal dielectric layer
08/01/2012CN102623329A Method for forming front metal dielectric layer
08/01/2012CN102623328A Process for treatment of substrates with water vapor or steam
08/01/2012CN102623327A Chemical mechanical lapping method
08/01/2012CN102623326A Method for fabricating dielectric layer with improved insulating properties
08/01/2012CN102623325A Method for treating high aspect ratio process (HARP) film and method for manufacturing pre-metal dielectric (PMD) layer
08/01/2012CN102623324A Electrochemical etching of semiconductors
08/01/2012CN102623323A Semiconductor wafer liquid-spraying etching system and method
08/01/2012CN102623322A Preparation method of bulk silicon-based longitudinal stack-type silicon nanowire field effect transistor (SiNWFET)
08/01/2012CN102623321A Manufacture method of longitudinal stacking type rear-grid type SiNWFET (Silicon-Nanowire Field Effect Transistor) based on bulk silicon
08/01/2012CN102623320A Method for characterizing polycrystalline silicon resistor in multilayer grid electrode
08/01/2012CN102623319A Floating gate preparation method
08/01/2012CN102623318A Semiconductor device and manufacturing method thereof
08/01/2012CN102623317A Semiconductor device including an epitaxy region
08/01/2012CN102623316A Methods for preparing groove bottom auxiliary gate dielectric layer and groove DMOS pipe
08/01/2012CN102623315A Doping oxide for forming shallow trench isolation
08/01/2012CN102623314A Source-drain lightly-doping method, semiconductor device and manufacturing method thereof
08/01/2012CN102623313A Ring ion injection method, semiconductor device and manufacture method thereof
08/01/2012CN102623312A Method and structure for increasing solar battery pn junction depletion region
08/01/2012CN102623311A Apparatus for preparing metal nitride barrier layer and application method thereof
08/01/2012CN102623310A Preparation method of ohmic contact of metal with graphene
08/01/2012CN102623309A Manufacturing method of end terminal of high voltage power semiconductor device and special cutting tool for the same
08/01/2012CN102623308A Post chemical-mechanical polishing (CMP) cleaning method and CMP method
08/01/2012CN102623307A Universal self-aligned preparation method for full-limited quantum dots between varieties of materials
08/01/2012CN102623306A Metal-multilayer insulator-metal capacitor, manufacture method for same and integrated circuit thereof
08/01/2012CN102623305A Metal-multilayer insulator-metal capacitor as well as preparation method and integrated circuit thereof
08/01/2012CN102623304A Wafer suitable for nanometer technology and method for manufacturing the same
08/01/2012CN102623303A SOI wafer and preparation method thereof
08/01/2012CN102623302A Reworking control method and control system thereof
08/01/2012CN102623301A Silicon chip bench particle removing apparatus and particle removing method thereof
08/01/2012CN102623300A Apparatus for forming protection film on chip-scale package and formation method thereof
08/01/2012CN102623299A Grain process method of wafer bonding
08/01/2012CN102623298A Cleaning method of reaction chamber
08/01/2012CN102622960A Brightness adjustment device for light emitting diode (LED) display device, LED display system and manufacturing method for LED display system
08/01/2012CN102621752A 像素结构及其制作方法 Pixel structure and manufacturing method thereof
08/01/2012CN102621732A System for treating web
08/01/2012CN102621188A Electromagnetic biosensor device and manufacturing method thereof
08/01/2012CN102620624A Semiconductor wire-bonding machine-table adjustment measuring tool and adjusting method therefor
08/01/2012CN102618843A Method for producing amorphous indium gallium zinc oxide thin film by atomic layer deposition
08/01/2012CN102618213A Resin composition and semiconductor devices made by using the same
08/01/2012CN102618178A Adhesive compositions for a semiconductor, an adhesive sheet for a semiconductor and a production method of a semiconductor device
08/01/2012CN102618172A Slurry and method for chemical mechanical polishing
08/01/2012CN102615585A Grinding apparatus
08/01/2012CN102615584A Chemical mechanical grinding method
08/01/2012CN102615571A Polishing device and polishing method
08/01/2012CN102614977A Automatic separation method for solar silicon wafers or other flaky objects in water
08/01/2012CN102136438B Method for quickly detecting segment difference height between stacked frames of chip
08/01/2012CN102130122B Domain structure of silicon germanium heterojunction triode
08/01/2012CN102129998B Method for forming polysilicon P type column in N type super-junction VDMOS (Vertical Double Diffused Metal Oxide Semiconductor)
08/01/2012CN102129961B Manufacturing method of chip label
08/01/2012CN102110709B Parasitic vertical PNP triode in bipolar complementary metal oxide semiconductor (BiCMOS) process and manufacturing method thereof
08/01/2012CN102110621B Insulated pull rod and pressing device for power semiconductor, and assembly method of pressing device
08/01/2012CN102110588B Semiconductor wafer transfer and process pretreatment equipment
08/01/2012CN102104062B Bipolar transistor
08/01/2012CN102087970B Process for etching polycrystalline silicon layer and method for forming metal oxide semiconductor (MOS) transistor
08/01/2012CN102046840B Processing apparatus and processing method
08/01/2012CN102044462B Method for testing wafer
08/01/2012CN102034685B Method for using post-epitaxial photoetching to align zero-level marks
08/01/2012CN102030308B Method for assembling particle ordered array in polarized way based on ferroelectric film electric domain
08/01/2012CN101995713B TFT-LCD array substrate and manufacturing method thereof
08/01/2012CN101964309B Manufacturing method of thin film transistor
08/01/2012CN101952950B Transfer apparatus, vacuum processing apparatus and transfer method
08/01/2012CN101924121B Manufacturing method of active matrix/organic light emitting display
08/01/2012CN101924093B Semiconductor device and method of manufacturing semiconductor device
08/01/2012CN101916739B Wafer carrying device
08/01/2012CN101908512B Twist-secured assembly of a power semiconductor module mountable on a heat sink
08/01/2012CN101901813B Semiconductor memory with vertical structure and manufacturing method thereof
08/01/2012CN101887852B Method for filling deep trench
08/01/2012CN101872529B Wafer bumping alarm system for wafer processing equipment
08/01/2012CN101866873B Slot filling method in multilayer integrated circuit
08/01/2012CN101740549B Test structure and test method for precisely evaluating reliability performance of gate oxide
08/01/2012CN101740494B Transfer method of functional region, led array, led printer head, and led printer
08/01/2012CN101673668B Method for polishing gallium nitride crystals
08/01/2012CN101645396B Film automatic stripper
08/01/2012CN101568998B Ashing system