Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2012
08/15/2012CN101901797B Power electronics power module with imbedded gate circuitry
08/15/2012CN101901794B Plastic lead frame structure with reflective and conductor metal layer and preparation method thereof
08/15/2012CN101847663B Transient voltage suppressor (TVS) and method for forming same
08/15/2012CN101783310B Method and apparatus for repairing an electrostatic chuck device, and the electrostatic chuck device
08/15/2012CN101754569B Plasma processing apparatus and operation method of the same
08/15/2012CN101728396B Array substrate of thin film transistor and manufacturing method thereof
08/15/2012CN101728319B Circuit structure of metal line modified through silicon/germanium soaking
08/15/2012CN101710228B Imprint lithography processes and systems
08/15/2012CN101664899B Chemical mechanical polishing method
08/15/2012CN101663744B Supporting member, carrier and supporting method
08/15/2012CN101657908B Conductive reflecting film and method for manufacturing the same
08/15/2012CN101652831B Proximity head with angled vacuum conduit system, apparatus and method
08/15/2012CN101640178B Semiconductor device, method for manufacturing semiconductor device, and lead frame
08/15/2012CN101615602B Semiconductor device, test mould and test method
08/15/2012CN101512622B Display device
08/15/2012CN101506964B Semiconductor devices, assemblies and constructions, and methods of forming semiconductor devices, assemblies and constructions
08/15/2012CN101499418B Substrate treatment apparatus, and substrate support member used thereby
08/15/2012CN101488479B Thin-film transistor array substrate and manufacturing method thereof
08/15/2012CN101471318B LGA substrate and method of making same
08/15/2012CN101471270B Low profile wire bonded USB device
08/15/2012CN101470168B Test handler, method for loading and manufacturing packaged chips
08/15/2012CN101459060B Method for manufacturing semiconductor device
08/15/2012CN101362926B Adhesive sheet, dicing tape integrated type adhesive sheet, and semiconductor device producing method
08/15/2012CN101303969B Radiation apparatus, semiconductor manufacturing apparatus and method, and manufacturing method of display device
08/15/2012CN101299410B Semiconductor wafer processing to increase the usable planar surface area
08/15/2012CN101273446B Method for connecting layers, corresponding component and organic light-emitting diode
08/15/2012CN101273357B Design method of the semiconductor circuit device and CAD device
08/15/2012CN101221958B Thin film transistor array panel having a means for visual inspection and a method of performing visual inspection
08/15/2012CN101146874B Precursor composition for porous membrane and process for preparation thereof, porous membrane and process for production thereof, and semiconductor device
08/15/2012CN101127314B Mounting method for semiconductor element and manufacturing method for semiconductor element
08/15/2012CN101061075B Holder made from quartz glass for the processing of semiconductor wafers and method for production of the holder
08/14/2012US8244482 Photometrically modulated delivery of reagents
08/14/2012US8244399 Transport method and transport apparatus
08/14/2012US8243964 Piezo speaker pressure sensor
08/14/2012US8243524 Semiconductor storage device
08/14/2012US8243509 Nonvolatile memory cell operating by increasing order in polycrystalline semiconductor material
08/14/2012US8243492 One time programmable memory device and manufacturing method of one time programmable memory device
08/14/2012US8243400 Tunneling magnetoresistive effect element and spin MOS field-effect transistor
08/14/2012US8243268 Substrate processing apparatus, optical constant obtaining method, and storage medium storing program executing same
08/14/2012US8243263 Optical inspection method and optical inspection apparatus
08/14/2012US8243177 Wafer-scale cluster image sensor chip and method with replicated gapless pixel line and signal readout circuit segments
08/14/2012US8242988 Device substrate, light emitting device and driving method of light emitting device
08/14/2012US8242807 Scalable non-blocking switching network for programmable logic
08/14/2012US8242616 Method for manufacturing semiconductor device and molded structure
08/14/2012US8242613 Bond pad for semiconductor die
08/14/2012US8242594 Chip package structure and manufacturing method thereof for effectively lowering manufacturing costs and improving yield and reliability of the chip package structure
08/14/2012US8242585 Semiconductor device and method for manufacturing the same
08/14/2012US8242583 Semiconductor device having CMP dummy pattern
08/14/2012US8242577 Fuse of semiconductor device and method for forming the same
08/14/2012US8242574 Method for forming isolation layer of semiconductor device
08/14/2012US8242573 Semiconductor device with isolation formed between digital circuit and analog circuit
08/14/2012US8242567 Semiconductor device and manufacturing method thereof
08/14/2012US8242566 Stacked ESD protection
08/14/2012US8242560 FinFET with thin gate dielectric layer
08/14/2012US8242552 Storage element, method of manufacturing same, and semiconductor storage device
08/14/2012US8242544 Semiconductor structure having reduced amine-based contaminants
08/14/2012US8242543 Semiconductor wafer-to-wafer bonding for dissimilar semiconductor dies and/or wafers
08/14/2012US8242540 Epitaxial growth of III-V compound semiconductors on silicon surfaces
08/14/2012US8242537 IGBT with fast reverse recovery time rectifier and manufacturing method thereof
08/14/2012US8242529 Light emitting chip and method for manufacturing the same
08/14/2012US8242523 III-Nitride light-emitting diode and method of producing the same
08/14/2012US8242516 Organic EL display panel and method of manufacturing the same
08/14/2012US8242508 Method of manufacturing a semiconductor device
08/14/2012US8242506 Array substrate and method of manufacturing the same
08/14/2012US8242499 Method of producing semiconductor device and SOQ (Silicon On Quartz) substrate used in the method
08/14/2012US8242498 Compound semiconductor substrate, semiconductor device, and processes for producing them
08/14/2012US8242494 Method for manufacturing thin film transistor using multi-tone mask
08/14/2012US8242485 Source/drain technology for the carbon nano-tube/graphene CMOS with a single self-aligned metal silicide process
08/14/2012US8242481 Nanowhiskers with PN junctions, doped nanowhiskers, and methods for preparing them
08/14/2012US8242355 Photoelectric conversion element and solar cell
08/14/2012US8242033 High throughput recrystallization of semiconducting materials
08/14/2012US8242032 Monosilane or disilane derivatives and method for low temperature deposition of silicon-containing films using the same
08/14/2012US8242031 High quality silicon oxide films by remote plasma CVD from disilane precursors
08/14/2012US8242030 Activation of graphene buffer layers on silicon carbide by ultra low temperature oxidation
08/14/2012US8242029 Method for forming a silicon dioxide/metal oxide-nanolaminate with a desired wet etch rate
08/14/2012US8242028 UV treatment of etch stop and hard mask films for selectivity and hermeticity enhancement
08/14/2012US8242027 Semiconductor device manufacturing method
08/14/2012US8242026 Semiconductor device manufacturing method, semiconductor manufacturing apparatus and storage medium
08/14/2012US8242025 Method for producing semiconductor chip, and field effect transistor and method for manufacturing same
08/14/2012US8242024 Method of forming metal interconnection on thick polyimide film
08/14/2012US8242023 Method of producing a semiconductor device having a trench filled with an epitaxially grown semiconductor layer
08/14/2012US8242022 Method for forming fine pattern using quadruple patterning in semiconductor device
08/14/2012US8242021 Method for manufacturing semiconductor device
08/14/2012US8242020 Method for producing a semiconductor wafer
08/14/2012US8242019 Selective deposition of metal-containing cap layers for semiconductor devices
08/14/2012US8242018 Semiconductor device having fine contacts and method of fabricating the same
08/14/2012US8242017 Method and structure for copper gap fill plating of interconnect structures for semiconductor integrated circuits
08/14/2012US8242016 Approach for reducing copper line resistivity
08/14/2012US8242015 Film forming method and film forming apparatus
08/14/2012US8242014 Method for manufacturing a semiconductor device having an interconnect structure and a reinforcing insulating film
08/14/2012US8242013 Virtually substrate-less composite power semiconductor device and method
08/14/2012US8242012 Integrated circuit structure incorporating a conductor layer with both top surface and sidewall passivation and a method of forming the integrated circuit structure
08/14/2012US8242011 Method of forming metal pillar
08/14/2012US8242010 Electrical interconnect forming method
08/14/2012US8242009 Nanophotovoltaic devices
08/14/2012US8242008 Methods of removing noble metal-containing nanoparticles, methods of forming NAND string gates, and methods of forming integrated circuitry
08/14/2012US8242007 Semiconductor device formed using single polysilicon process and method of fabricating the same
08/14/2012US8242006 Smooth electrode and method of fabricating same
08/14/2012US8242005 Using multiple masks to form independent features on a workpiece
08/14/2012US8242004 Semiconductor device and method of fabricating the same