Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2012
08/14/2012US8242003 Defect removal in Ge grown on Si
08/14/2012US8242002 Method for manufacturing semiconductor device
08/14/2012US8242001 Apparatus and methods for improving parallel conduction in a quantum well device
08/14/2012US8242000 Method for making nanowire element
08/14/2012US8241999 Semiconductor device having a protection pattern with two element separation regions
08/14/2012US8241998 Method of producing an SOI structure with an insulating layer of controlled thickness
08/14/2012US8241997 Method of manufacturing a semiconductor device having a gate electrode formed over a silicon oxide insulating layer
08/14/2012US8241996 Substrate stiffness method and resulting devices for layer transfer process
08/14/2012US8241995 Bonding of substrates including metal-dielectric patterns with metal raised above dielectric
08/14/2012US8241994 Method for fabricating isolation layer in semiconductor device
08/14/2012US8241993 Method for shallow trench isolation
08/14/2012US8241992 Method for air gap interconnect integration using photo-patternable low k material
08/14/2012US8241991 Method for forming interconnect structure having airgap
08/14/2012US8241990 Air gap fabricating method
08/14/2012US8241989 Integrated circuit with stacked devices
08/14/2012US8241988 Photo key and method of fabricating semiconductor device using the photo key
08/14/2012US8241987 Methods of forming capacitors
08/14/2012US8241986 Semiconductor device and process for reducing damaging breakdown in gate dielectrics
08/14/2012US8241985 Semiconductor device having gate electrode with lower impurity concentration at edge portions than above channel and method of manufacturing the same
08/14/2012US8241984 Semiconductor device and method for manufacturing the same
08/14/2012US8241983 Method of making a hetero tunnel field effect transistor
08/14/2012US8241982 Semiconductor device manufacturing method
08/14/2012US8241981 Method of fabricating a deep trench (DT) metal-insulator-metal (MIM) capacitor
08/14/2012US8241980 Semiconductor device and manufacturing method thereof
08/14/2012US8241979 Method of forming a vertical diode and method of manufacturing a semiconductor device using the same
08/14/2012US8241978 Method of manufacturing semiconductor device having integrated MOSFET and Schottky diode
08/14/2012US8241977 Short channel transistor with reduced length variation by using amorphous electrode material during implantation
08/14/2012US8241976 Semiconductor surrounding gate transistor device and production method therefor
08/14/2012US8241975 System and method for providing low voltage high density multi-bit storage flash memory
08/14/2012US8241974 Nonvolatile memory device with multiple blocking layers and method of fabricating the same
08/14/2012US8241973 Method for increasing penetration depth of drain and source implantation species for a given gate height
08/14/2012US8241972 Method for manufacturing flexible semiconductor device
08/14/2012US8241971 MOSFET with a nanowire channel and fully silicided (FUSI) wrapped around gate
08/14/2012US8241970 CMOS with channel P-FinFET and channel N-FinFET having different crystalline orientations and parallel fins
08/14/2012US8241969 Patterning method for high density pillar structures
08/14/2012US8241968 Printed circuit board (PCB) including a wire pattern, semiconductor package including the PCB, electrical and electronic apparatus including the semiconductor package, method of fabricating the PCB, and method of fabricating the semiconductor package
08/14/2012US8241967 Semiconductor package with a support structure and fabrication method thereof
08/14/2012US8241966 Methods of making an electronic component package and semiconductor chip packages
08/14/2012US8241965 Integrated circuit packaging system with pad connection and method of manufacture thereof
08/14/2012US8241963 Recessed pillar structure
08/14/2012US8241962 Method of making a semiconductor chip assembly with a post/base heat spreader, a signal post and a cavity
08/14/2012US8241961 Method for manufacturing hetero-bonded wafer
08/14/2012US8241960 Semiconductor device manufacturing equipment and semiconductor device manufacturing method
08/14/2012US8241959 Microelectronic packages fabricated at the wafer level and methods therefor
08/14/2012US8241958 Semiconductor device, semiconductor module, method for manufacturing semiconductor device, and lead frame
08/14/2012US8241957 Negative thermal expansion system (NTES) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging
08/14/2012US8241956 Semiconductor device and method of forming wafer level multi-row etched lead package
08/14/2012US8241955 Integrated circuit packaging system with mountable inward and outward interconnects and method of manufacture thereof
08/14/2012US8241954 Wafer level die integration and method
08/14/2012US8241953 Method of fabricating stacked wire bonded semiconductor package with low profile bond line
08/14/2012US8241952 Semiconductor device and method of forming IPD in fan-out level chip scale package
08/14/2012US8241951 Method of manufacturing solid-state image pickup device and solid-state image pickup device
08/14/2012US8241950 System and method to manufacture an implantable electrode
08/14/2012US8241949 Method of manufacturing semiconductor device
08/14/2012US8241948 Semiconductor device and manufacturing method of the same
08/14/2012US8241944 Resistive RAM devices and methods
08/14/2012US8241943 Sodium doping method and system for shaped CIGS/CIS based thin film solar cells
08/14/2012US8241942 Method of fabricating a back-illuminated image sensor
08/14/2012US8241941 Method of purifying a crystalline silicon substrate and process for producing a photovoltaic cell
08/14/2012US8241940 Double-sided reusable template for fabrication of semiconductor substrates for photovoltaic cell and microelectronics device manufacturing
08/14/2012US8241939 Semiconductor nanowire sensor device and method for manufacturing the same
08/14/2012US8241938 Methods of forming a conductive transparent oxide film layer for use in a cadmium telluride based thin film photovoltaic device
08/14/2012US8241937 Optical semiconductor device and method of manufacturing optical semiconductor device
08/14/2012US8241935 Method of fabricating liquid crystal display device having concave reflector
08/14/2012US8241934 Display substrate and method of manufacturing the same
08/14/2012US8241932 Methods of fabricating light emitting diode packages
08/14/2012US8241931 Method of forming MEMS device with weakened substrate
08/14/2012US8241930 Methods of forming a window layer in a cadmium telluride based thin film photovoltaic device
08/14/2012US8241929 Contactor, contact structure, probe card, and test apparatus
08/14/2012US8241928 Test structure and method for detecting charge effects during semiconductor processing
08/14/2012US8241927 Methods relating to capacitive monitoring of layer characteristics during back end-of the-line processing
08/14/2012US8241926 Semiconductor integrated circuit test method
08/14/2012US8241925 Calibration of temperature sensitive circuits with heater elements
08/14/2012US8241924 Method and system for controlling an implantation process
08/14/2012US8241923 Method for correcting mask pattern and method for manufacturing acceleration sensor and angular velocity sensor by using the method for correcting the mask pattern
08/14/2012US8241829 Resist polymer, resist composition, process for pattern formation, and starting compounds for production of the resist polymer
08/14/2012US8241823 Method of fabrication of a semiconductor device having reduced pitch
08/14/2012US8241457 Plasma processing system, plasma measurement system, plasma measurement method, and plasma control system
08/14/2012US8241438 Hafnium alloy target
08/14/2012US8241426 CMP polishing method, CMP polishing apparatus, and process for producing semiconductor device
08/14/2012US8241421 Epitaxial wafer and production method thereof
08/14/2012US8240648 Distributed load edge clamp
08/14/2012US8240543 Electronic component mounting system, electronic component placing apparatus, and electronic component mounting method
08/14/2012US8240032 Method for manufacturing an electronics module comprising a component electrically connected to a conductor-pattern layer
08/14/2012CA2433734C Method for fabricating a semiconductor component having a t-shaped contact electrode
08/13/2012DE202012101142U1 Vorrichtung zum Entfernen einer Beschichtung von einem Substrat An apparatus for removing a coating from a substrate
08/10/2012DE202012004434U1 Metallformkörper zur Schaffung einer Verbindung eines Leistungshalbleiterchips mit oberseitigen Potentialflächen zu Dickdrähten Metal molding for creating a connection of a power semiconductor chip with top-side potential areas to thick wires
08/09/2012WO2012106720A1 High density metal-insulator-metal trench capacitor with concave surfaces
08/09/2012WO2012106612A2 In-situ hydroxylation system
08/09/2012WO2012106600A2 In situ vapor phase surface activation of sio2
08/09/2012WO2012106572A1 Trench mos barrier schottky (tmbs) having multiple floating gates
08/09/2012WO2012106439A2 Memory devices with a connecting region having a band gap lower than a band gap of a body region
08/09/2012WO2012106292A1 Stacked semiconductor chips packaging
08/09/2012WO2012106253A1 Iii-n device structures and methods
08/09/2012WO2012106223A2 Pre-cut wafer applied underfill film on dicing tape
08/09/2012WO2012106210A2 Methods for reducing the metal content in the device layer of soi structures and soi structures produced by such methods
08/09/2012WO2012106191A2 Pre- cut wafer applied underfill film
08/09/2012WO2012106184A2 Vapor-deposited coating for barrier films and methods of making and using the same
08/09/2012WO2012106183A1 Multichip packages
08/09/2012WO2012106147A2 Process condition measuring device (pcmd) and method for measuring process conditions in a workpi ece processing tool configured to process production workpieces
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