Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2012
08/15/2012CN102637647A Forming method for memory cell of flash memory
08/15/2012CN102637646A Preparation method of memory
08/15/2012CN102637645A Preparation method of memory
08/15/2012CN102637644A Method for improving write margin of static random access memory
08/15/2012CN102637643A Method for improving read redundancy of static random access memory
08/15/2012CN102637642A Manufacture method of complementary metal-oxide-semiconductor transistor (CMOS) device
08/15/2012CN102637641A Method for integrating phase-change random memory array and peripheral circuit chip
08/15/2012CN102637640A Method and system for minimizing edge defects of chips
08/15/2012CN102637639A Splitting method of semiconductor chip or package substrate thereof
08/15/2012CN102637638A Thin-film transistor array substrate and manufacturing method thereof
08/15/2012CN102637637A Array substrate of thin film transistor and manufacturing method thereof
08/15/2012CN102637636A Organic thin-film transistor array substrate, method for manufacturing same and display device
08/15/2012CN102637635A Display device, liquid crystal display panel, array substrate and manufacturing method of array substrate
08/15/2012CN102637634A Array substrate, manufacturing method of array substrate and display device
08/15/2012CN102637633A Array substrate manufacturing method and system
08/15/2012CN102637632A Thin-film transistor array and method for manufacturing same
08/15/2012CN102637631A TFT (thin film transistor)-LCD (liquid crystal display) array substrate and manufacturing method thereof
08/15/2012CN102637630A Array substrate and manufacturing method thereof
08/15/2012CN102637629A Mask assembly of IC (integrated circuit) device with laminated contact layers for reducing number, as well as method thereof
08/15/2012CN102637628A Reduction method of dielectric capacitance
08/15/2012CN102637627A Manufacture process of hole metallization of thick-film mixed integrated circuit
08/15/2012CN102637626A Production of a new structure incorporating superficial , buried and support layers, for micro- electronic and micro-system applications
08/15/2012CN102637625A End-to-end gap fill using dielectric film
08/15/2012CN102637624A Adjustable fixture used for clamping surface plate base plate
08/15/2012CN102637623A LED (light-emitting diode) chip carrier positioning and absorbing device
08/15/2012CN102637622A Substrate processing apparatus and substrate processing method
08/15/2012CN102637621A Assembly jig for a semiconductor device and assembly method for a semiconductor device
08/15/2012CN102637620A Integrated circuit case chip feeder and grip thereof
08/15/2012CN102637619A Adjusting roll device
08/15/2012CN102637618A Thermal treatment apparatus and thermal treatment method
08/15/2012CN102637617A Wafer quality detection system and wafer quality detection method
08/15/2012CN102637616A Wafer detection device and wafer detection method
08/15/2012CN102637615A Sample preparation method for wafer-level back failure positioning in failure analysis
08/15/2012CN102637614A Systems and methods eliminating false defect detections
08/15/2012CN102637613A Realization method for lead bonding thick aluminum wire
08/15/2012CN102637612A Method for fixedly arranging semiconductor chip on circuit substrate and structure of semiconductor chip
08/15/2012CN102637611A Preparation method of AAP power module
08/15/2012CN102637610A Method for mounting a semiconductor chip on a carrier
08/15/2012CN102637609A Method of protection treatment on millimeter-wave circuit component by use of vacuum vapor deposition membrane
08/15/2012CN102637608A Semiconductor device and method of forming a vertical interconnect structure for 3-d fo-wlcsp
08/15/2012CN102637607A Three-dimensional encapsulation method
08/15/2012CN102637606A Preparation method of back grid type accumulated mode Si-nanometer wire field effect transistor (NWFET) based on silicon on insulator (SOI)
08/15/2012CN102637605A Method for preparing rear-grid type cumulative-mode Si-NWFET (nanowire field effect transistor) based on SOI (silicon on insulator)
08/15/2012CN102637604A Side wall and method for forming side wall and semiconductor
08/15/2012CN102637603A Method for improving stress memory effect by removable jamb wall integrating process
08/15/2012CN102637602A Method for reducing grid-induction drain leakage of semiconductor device
08/15/2012CN102637601A Forming method of MOS (metal oxide semiconductor) transistor with buried channel
08/15/2012CN102637600A Preparation method of MOS (metal oxide semiconductor) device
08/15/2012CN102637599A Manufacturing method of multilayer metal-multilayer insulator-metal capacitor
08/15/2012CN102637598A Method for manufacturing high-power semiconductor device die
08/15/2012CN102637597A Vertical PNP (precision navigation processor) preparation method
08/15/2012CN102637596A Method for manufacturing high-frequency high-voltage diode by use of czochralski silicon wafer
08/15/2012CN102637595A Trench schottky diode and manufacturing method thereof
08/15/2012CN102637594A Device and method for annealing and alloying epitaxial wafers
08/15/2012CN102637593A Method and equipment for quickly annealing and alloying epitaxial wafers
08/15/2012CN102637592A Manufacturing method of semiconductor structure
08/15/2012CN102637591A Method for etching electrode layer on oxide semiconductor
08/15/2012CN102637590A Method for preparing double-stress thin film
08/15/2012CN102637589A Method of manufacturing semiconductor device
08/15/2012CN102637588A Grid electrode compensation isolation area etching method
08/15/2012CN102637587A Cleaning apparatus for semiconductor manufacturing apparatus and method for manufacturing semiconductor device using the same
08/15/2012CN102637586A Forming method of metal grid electrode
08/15/2012CN102637585A Method for preparing aluminium-oxide passivation films through atomic layer deposition
08/15/2012CN102637584A Transfer preparation method of patterned graphene
08/15/2012CN102637583A Preparation method of multilayer metal-monox-metal capacitor
08/15/2012CN102637582A Method for preventing phosphosilicate glass or boron phosphosilicate glass film from absorbing water
08/15/2012CN102637581A Method for preventing outgassing of boron doped layer
08/15/2012CN102637580A Method for preventing aluminium pad from being corroded
08/15/2012CN102637579A Cleaning process for removing flower basket imprints on solar battery
08/15/2012CN102637578A Passivation layer for semiconductor device packaging
08/15/2012CN102637577A Preparation method of display device
08/15/2012CN102637576A Semiconductor structure and preparation method thereof
08/15/2012CN102637575A Manufacturing method of component baseplate
08/15/2012CN102637573A Semiconductor processing device and manufacture method thereof
08/15/2012CN102637022A Recipe report card framework and methods thereof
08/15/2012CN102636962A Aerial image overlay test method and array base plate
08/15/2012CN102636960A Unit for supplying treating liquid, and apparatus and method for treating substrate using the same
08/15/2012CN102636929A Liquid crystal display panel, liquid crystal display device and manufacturing method for array substrate
08/15/2012CN102636927A Array substrate and method for manufacturing same
08/15/2012CN102636890A Structure with adjustable parallelism
08/15/2012CN102634849A Method for growth of gan single crystal, method for preparation of gan substrate, process for producing gan-based element, and gan-based element
08/15/2012CN102634773A Film-forming apparatus
08/15/2012CN102634249A Preparation method of carbon nanotube ink and preparation method of transistor device
08/15/2012CN102633288A Method of producing oxide particles, slurry, polishing slurry, and mehod of polishing substrate
08/15/2012CN102194671B Method for growing varied buffer layer on substrate
08/15/2012CN102184881B Sorting method before silicon wafer dry etching
08/15/2012CN102157413B On-line measuring device for frictional force generated during polishing of small-sized wafer
08/15/2012CN102148163B Methods for manufacturing superjunction structure and superjunction semiconductor device
08/15/2012CN102122608B Chemical preparation treating system
08/15/2012CN102097345B Method for directly depositing metal line patterns on surface of insulating base material
08/15/2012CN102082108B Method and device for rapidly measuring sidewall appearance of micro-nano deep groove structure
08/15/2012CN102065644B Method for making and packaging printed circuit board (PCB) and crystal oscillator
08/15/2012CN102037550B Substrate matrix to decouple tool and process effects
08/15/2012CN102033379B 液晶显示器与其制造方法 LCD monitors its manufacturing method
08/15/2012CN102028357B Brush cleaning device and using method thereof
08/15/2012CN102023432B FFS type TFT-LCD array substrate and manufacturing method thereof
08/15/2012CN101996958B Chip package and fabrication method thereof
08/15/2012CN101963802B Virtual measurement method in batch manufacture procedure and system therefor
08/15/2012CN101920477B Methods for producing and processing semiconductor wafers
08/15/2012CN101916778B High-voltage semiconductor device and manufacturing method thereof
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