Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2012
08/16/2012WO2012108320A1 Encapsulating resin composition for pre-application purposes, semiconductor chip, and semiconductor device
08/16/2012WO2012108301A1 Active matrix substrate, display panel, and display device
08/16/2012WO2012108263A1 Substrate holding device and exposure device
08/16/2012WO2012108167A1 Silicon carbide semiconductor device and method for manufacturing the same
08/16/2012WO2012108166A1 Silicon carbide semiconductor device and method for manufacturing the same
08/16/2012WO2012108151A1 Nonvolatile latch circuit, nonvolatile flip-flop circuit and nonvolatile signal processing device
08/16/2012WO2012108121A1 Laminated substrate and method of manufacturing thereof
08/16/2012WO2012108098A1 Guided transfer car system
08/16/2012WO2012108082A1 Ag-Au-Pd TERNARY ALLOY-BASED BONDING WIRE
08/16/2012WO2012108080A1 Silicon carbide semiconductor device and method for manufacturing same
08/16/2012WO2012108056A1 Monocrystalline member with stress layer formed in interior and monocrystalline substrate production method
08/16/2012WO2012108055A1 Monocrystalline substrate production method and monocrystalline member with modified layer formed therein
08/16/2012WO2012108054A1 Production method for monocrystalline substrate and production method for monocrystalline member with modified layer formed therein
08/16/2012WO2012108052A1 Monocrystalline substrate production method and monocrystalline member with modified layer formed therein
08/16/2012WO2012107998A1 Semiconductor device
08/16/2012WO2012107979A1 Laser annealing method and laser annealing apparatus
08/16/2012WO2012107978A1 Semiconductor device
08/16/2012WO2012107971A1 Semiconductor device and method for manufacturing same
08/16/2012WO2012107970A1 Semiconductor device
08/16/2012WO2012107482A2 Power semiconductor module
08/16/2012WO2012107256A1 Process for producing light absorbing chalcogenide films
08/16/2012WO2012107214A1 Semiconductor layer system having a semipolar or m-planar group iii nitride layer and semiconductor component based thereon
08/16/2012WO2012107138A1 METHOD OF DEPOSITION OF Al2O3/SiO2 STACKS, FROM ALUMINIUM AND SILICON PRECURSORS
08/16/2012WO2012106851A1 Method of cleaving semiconductor wafer or package substrate
08/16/2012WO2012106834A1 Semiconductor device and related fabrication methods
08/16/2012WO2012106833A1 Semiconductor device and related fabrication methods
08/16/2012WO2012106814A1 High efficiency broadband semiconductor nanowire devices and methods of fabricating without foreign metal catalysis
08/16/2012WO2012088371A4 Workpiece handling module
08/16/2012WO2012087820A3 Nand devices having a floating gate comprising a fin portion interdigitated with the control gate and method of manufacturing the same
08/16/2012WO2012087613A3 Fabrication of through-silicon vias on silicon wafers
08/16/2012WO2012087578A3 Liner layers for metal interconnects
08/16/2012WO2012082788A3 Gallium nitride-based led fabrication with pvd-formed aluminum nitride buffer layer
08/16/2012WO2012082501A3 Wafer inspection
08/16/2012WO2012082403A3 Write current reduction in spin transfer torque memory devices
08/16/2012WO2012075351A3 Asymmetric slotted waveguide and method for fabricating the same
08/16/2012WO2012071130A3 Dual-bulb lamphead control methodology
08/16/2012WO2012070821A9 Layout library of flip-flop circuit
08/16/2012WO2012068428A3 Polishing pad comprising transmissive region
08/16/2012WO2012068201A3 Mos field -effect transistor and method of making the same
08/16/2012WO2012067883A3 An adhesive material used for joining chamber components
08/16/2012WO2012065149A3 High damage threshold frequency conversion system
08/16/2012WO2012064491A3 Process for lowering adhesion layer thickness and improving damage resistance for thin ultra low-k dielectric film
08/16/2012WO2012054814A3 Parallellism conservation mechanism for nanopositioner
08/16/2012WO2012054416A3 System and method of forming sealed packages for electronic devices using a solder jet
08/16/2012WO2012054181A3 Controlling microelectronic substrate bowing
08/16/2012WO2012040688A3 High-throughput batch porous silicon manufacturing equipment design and processing methods
08/16/2012WO2012040468A3 Low impedance transmission line
08/16/2012WO2012036856A3 Multiple section showerhead assembly
08/16/2012WO2012030846A3 Apparatus and methods for vacuum-compatible substrate thermal management
08/16/2012WO2012030475A4 Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishing
08/16/2012WO2011159397A3 Solar cell structure and composition and method for forming the same
08/16/2012US20120209100 Biocompatible packaging
08/16/2012US20120208439 Method for polishing semiconductor wafer
08/16/2012US20120208437 Polishing apparatus and polishing method
08/16/2012US20120208377 Rapid thermal processing using energy transfer layers
08/16/2012US20120208376 Method of forming silicon nitride film and method of manufacturing semiconductor memory device
08/16/2012US20120208375 Semiconductor device and method of manufacturing the same
08/16/2012US20120208374 Amorphous carbon deposition method for improved stack defectivity
08/16/2012US20120208373 Method for depositing an amorphous carbon film with improved density and step coverage
08/16/2012US20120208372 Process gas delivery for semiconductor process chambers
08/16/2012US20120208371 Method and apparatus for multizone plasma generation
08/16/2012US20120208370 Method for etching of silicon surfaces
08/16/2012US20120208369 Method of Etching Features in Silicon Nitride Films
08/16/2012US20120208368 Method and apparatus for manufacturing silicon carbide semiconductor device
08/16/2012US20120208367 Method for fabricating carbon hard mask and method for fabricating patterns of semiconductor device using the same
08/16/2012US20120208366 Prevention and reduction of solvent and solution penetration into porous dielectrics using a thin barrier layer
08/16/2012US20120208365 Method of manufacturing semiconductor device
08/16/2012US20120208364 Method for opening one-side contact region of vertical transistor and method for fabricating one-side junction region using the same
08/16/2012US20120208363 Methods of depositing aluminium layers
08/16/2012US20120208362 Structure and process for metallization in high aspect ratio features
08/16/2012US20120208361 Method for forming fine patterns of a semiconductor device
08/16/2012US20120208360 Method for forming semiconductor film and method for manufacturing semiconductor device
08/16/2012US20120208359 Structure And Method For Fabrication Of Field Effect Transistor Gates With Or Without Field Plates
08/16/2012US20120208358 Method for producing a multilayer film including at least one ultrathin layer of crystalline silicon, and devices obtained by means of said method
08/16/2012US20120208357 Methods and systems for forming thin films
08/16/2012US20120208356 Device component forming method with a trim step prior to sidewall image transfer (SIT) processing
08/16/2012US20120208355 Gallium nitride substrate
08/16/2012US20120208354 Semiconductor device and method for making the same
08/16/2012US20120208353 Method for Manufacturing a Semiconductor Component
08/16/2012US20120208352 Methods and systems for forming thin films
08/16/2012US20120208351 Cleaning apparatus for semiconductor manufacturing apparatus and method for manufacturing semiconductor device using the same
08/16/2012US20120208350 Method of manufacturing semiconductor device
08/16/2012US20120208349 Support for Wafer Singulation
08/16/2012US20120208348 Method of manufacturing soi substrate
08/16/2012US20120208347 Three-dimensional semiconductor memory devices and methods of fabricating the same
08/16/2012US20120208346 Method of manufacturing semiconductor device
08/16/2012US20120208345 Method for forming a self-aligned isolation structure utilizing sidewall spacers as an etch mask and remaining as a portion of the isolation structure
08/16/2012US20120208344 Chemical mechanical polishing (cmp) composition comprising inorganic particles and polymer particles
08/16/2012US20120208343 Method for manufacturing a micro-electro-mechanical device, in particular an optical microswitch, and micro-electro-mechanical device thus obtained
08/16/2012US20120208342 Method of manufacturing semiconductor device
08/16/2012US20120208341 Alignment Marks for Polarized Light Lithography and Method for Use Thereof
08/16/2012US20120208340 Methods of fabricating a storage node in a semiconductor device and methods of fabricating a capacitor using the same
08/16/2012US20120208339 Passivating glue layer to improve amorphous carbon to metal adhesion
08/16/2012US20120208338 Self aligned impact-ionization mos (i-mos) device and methods of manufacture
08/16/2012US20120208337 SELF-ALIGNED EMBEDDED SiGe STRUCTURE AND METHOD OF MANUFACTURING THE SAME
08/16/2012US20120208336 Semiconductor device and method for manufacturing semiconductor device
08/16/2012US20120208335 Methods of fabricating a semiconductor device having low contact resistance
08/16/2012US20120208334 Methods of fabricating a dual polysilicon gate and methods of fabricating a semiconductor device using the same
08/16/2012US20120208333 Method for fabricating semiconductor device
08/16/2012US20120208332 Semiconductor structures having improved contact resistance