Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2012
08/22/2012CN102646577A Methods of depositing aluminium layers
08/22/2012CN102646576A Method for fabricating semiconductor devices with fine patterns
08/22/2012CN102646575A Silicon dioxide pattern processing method
08/22/2012CN102646574A Preparation method of gallium nitride self-supporting substrate
08/22/2012CN102646573A Semiconductor device and manufacturing method thereof
08/22/2012CN102646572A Die bonder and semiconductor manufacturing method
08/22/2012CN102645852A Lithographic apparatus and device manufacturing method
08/22/2012CN102645851A Illumination source and photomask optimization
08/22/2012CN102645811A Electronic-paper active substrate and manufacturing method thereof and electronic-paper display screen
08/22/2012CN102645808A Manufacture method of array substrate, array substrate and display device
08/22/2012CN102645807A Liquid crystal display panel array substrate and manufacturing method thereof
08/22/2012CN102645806A Array substrate and manufacturing method thereof
08/22/2012CN102645805A Array base plate, preparation method of array base plate and liquid crystal display
08/22/2012CN102645804A Array substrate and manufacturing method thereof and display device
08/22/2012CN102645803A Pixel unit, array substrate, liquid crystal panel, display device and manufacturing methods thereof
08/22/2012CN102645802A TFT-LCD (thin film transistor liquid crystal display) array substrate and manufacturing and repairing methods thereof
08/22/2012CN102645801A Thin-film transistor array substrate, color film substrate, manufacturing methods and display device
08/22/2012CN102645800A Thin-film transistor array substrate and manufacturing method thereof
08/22/2012CN102645799A Liquid crystal display device, array substrate and color-film substrate as well as manufacturing methods thereof
08/22/2012CN102645623A Test handler
08/22/2012CN102645359A Preparation method of copper-tin intermetallic compound micro-stretching sample for chip interconnection
08/22/2012CN102645102A Cooling system, thermal annealing furnace pipe with same and cooling method
08/22/2012CN102644061A Reaction chamber cleaning method having nitrogen trifluoride and based on fluoride
08/22/2012CN102644051A Film forming device
08/22/2012CN102642715A Telescopic load-bearing device
08/22/2012CN102642551A Transferring device for loading amorphous silicon solar cells
08/22/2012CN102642253A Silicon slice edge cutting method and device of silicon slice edge cutting method
08/22/2012CN102642095A Electroconductive bonding material comprising three types of metal particles with different melting points and its use for bonding an electronic component to a substrate
08/22/2012CN102641869A Wafer cleaning device and cleaning method
08/22/2012CN102292675B Positive-type photosensitive resin composition
08/22/2012CN102212877B MOCVD (Metal-organic Chemical Vapor Deposition) system with multiple extensional reaction cavities and operation method thereof
08/22/2012CN102194666B Electric control system of corrosion converting machine
08/22/2012CN102169833B Manufacturing process of low-power consumption diode
08/22/2012CN102169553B Method for encapsulating and manufacturing glue perfusion molded SIM (subscriber identity module) film card with flip naked chip
08/22/2012CN102157371B Method for producing monocrystalline silicon nanometer structure
08/22/2012CN102129169B Auxiliary pattern filling method and device
08/22/2012CN102129164B Method and system for judging mask defects
08/22/2012CN102122617B Manufacturing method of metal oxide semiconductor field effect transistor
08/22/2012CN102116982B 液晶显示面板及其制造方法 A liquid crystal display panel and manufacturing method thereof
08/22/2012CN102103647B I/O (input/output)pin allotting method for nano CMOS (Complementary Metal-Oxide-Semiconductor Transistor) circuit structure
08/22/2012CN102097307B Method for forming offset side wall and MOS transistor
08/22/2012CN102087964B Silicon oxide nitride oxide semiconductor (SONOS) structure and method for forming same
08/22/2012CN102074476B Forming method of N-channel metal oxide semiconductor (NMOS) transistor
08/22/2012CN102064121B Right claw of bonder
08/22/2012CN102061456B Cantilever-type push-pull boat system for plasma enhanced chemical vapor deposition (PECVD) device
08/22/2012CN102054818B Interconnection structure and manufacture method thereof
08/22/2012CN102054673B Method for fabricating III-nitride semiconductor material pn (phosphorus nitride) junction
08/22/2012CN102053434B Array substrate for liquid crystal display device, liquid crystal display device and method of fabricating the same
08/22/2012CN102044523B Semiconductor device structure and manufacturing method thereof
08/22/2012CN102044461B Detection method used for failure analysis of semiconductor device
08/22/2012CN102044419B Preparation method of Si-Ge film and manufacture method of semiconductor device
08/22/2012CN102034864B MOS (metal oxide semiconductor) transistor and preparation method thereof
08/22/2012CN102024821B Non-volatile memory device as well as non-volatile memory and manufacturing method thereof
08/22/2012CN102024790B Semiconductor device, manufacturing method, and integrated circuit and electronic equipment including the same
08/22/2012CN102024699B Quick thermal annealing method for semiconductor device
08/22/2012CN102024696B Opening and forming method thereof
08/22/2012CN102005373B Manufacture method of grid electrode and power MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor)
08/22/2012CN101996921B STI forming method
08/22/2012CN101995853B Automatic control method and system for particles
08/22/2012CN101989594B Test structure and test method of semiconductor device
08/22/2012CN101989548B Semiconductor device and manufacturing method thereof
08/22/2012CN101971315B Mounting apparatus
08/22/2012CN101960558B Method for manufacturing bonded wafer
08/22/2012CN101958262B Failure detection method and device
08/22/2012CN101952940B Apparatus and method for processing substrate
08/22/2012CN101950741B Method for producing chip electrode multilevel interconnection structure
08/22/2012CN101946306B Self-powered lithography method and apparatus using radioactive thin films
08/22/2012CN101944518B Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof
08/22/2012CN101939826B Method for cleaning semiconductor wafer and device for cleaning semiconductor wafer
08/22/2012CN101937850B 封装制造方法和半导体装置 Package manufacturing method and a semiconductor device
08/22/2012CN101931000B Semiconductor device and method for forming same
08/22/2012CN101930901B Soldering pin of wire jointing device for packaging semiconductor and wire jointing method
08/22/2012CN101930179B Method for passivating photoresist surface and photoetching method
08/22/2012CN101925992B Bonding wire for semiconductor
08/22/2012CN101924123B Organic light emitting device, display unit including the same, and illuminating device including the same
08/22/2012CN101924068B Resistance storage and manufacturing method of integrated circuit comprising same
08/22/2012CN101924037B Method for manufacturing coreless capsulation substrates
08/22/2012CN101919037B Coated copper wire for ball bonding
08/22/2012CN101916752B Multilayer printed wiring board
08/22/2012CN101911281B Apparatus and method for supporting, positioning and rotating a substrate in a processing chamber
08/22/2012CN101911253B Closed loop MOCVD deposition control
08/22/2012CN101910953B Cleaning composition for thick film resist
08/22/2012CN101908537B Array substrate for display equipment and method of fabricating the same
08/22/2012CN101905855B Method for encapsulating a wafer level microdevice
08/22/2012CN101905854B Electronic component and its manufacturing method, and an electronic system
08/22/2012CN101903995B Method for producing semiconductor chips and corresponding semiconductor chip
08/22/2012CN101903561B Liquid material vaporization apparatus
08/22/2012CN101894866B Collision ionization type field effect transistor of sinking channel and manufacture method thereof
08/22/2012CN101894831B Ultraviolet-infrared dual band detector and manufacturing method thereof
08/22/2012CN101894789B Method for fabricating an isolation structure
08/22/2012CN101893879B Method and system for carrier plate transmission control of plasma chemical vapor deposition equipment
08/22/2012CN101887467B Method for establishing copper interconnection chemical mechanically mechanical polishing process model
08/22/2012CN101882602B Manufacturing method of phase-changing random access memory
08/22/2012CN101882594B Forming method of conductive plug
08/22/2012CN101877312B Plasma processing apparatus
08/22/2012CN101866953B Low Schottky barrier semiconductor structure and formation method thereof
08/22/2012CN101866867B Manufacturing method for lead frame of semiconductor packaging structure with no outer lead
08/22/2012CN101862987B Adsorption gasket with discontinuous laminating points and manufacturing method thereof
08/22/2012CN101847586B Circuit substrate process and circuit substrate
08/22/2012CN101834152B Method for manufacturing three-dimensionally stacked resistance conversion memory
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