Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2012
08/29/2012CN102097483B GaN-base heterostructure enhancement type insulated gate field effect transistor and preparation method thereof
08/29/2012CN102097312B Process for growing ONO (oxide-nitride-oxide) capacitor structure
08/29/2012CN102097311B Planarization method
08/29/2012CN102087987B Positioning device and positioning control method for vertical lifting plate bank
08/29/2012CN102074562B NAND (Not AND) structure and forming method thereof
08/29/2012CN102074479B Semiconductor device and production method thereof
08/29/2012CN102054738B Control method for shallow groove isolation step height
08/29/2012CN102049737B Polishing pad conditioner
08/29/2012CN102024710B Method for manufacturing photoelectric element, encapsulation structure and encapsulation device thereof
08/29/2012CN102013415B Substrate structure applied to flexible electronic component and manufacture method thereof
08/29/2012CN102009385B Chemical mechanical polishing method for semiconductor wafer
08/29/2012CN102007577B Polishing liquid for cmp and polishing method
08/29/2012CN101997035B 薄膜晶体管 The thin film transistor
08/29/2012CN101989554B Packaging structure and packaging process
08/29/2012CN101989546B Method for improving defects of edge of active area
08/29/2012CN101976652B Semiconductor packaging structure and manufacture process thereof
08/29/2012CN101970713B Rotary magnet sputtering apparatus
08/29/2012CN101964361B Metal oxide semiconductor transistor and manufacturing method thereof
08/29/2012CN101960557B Cold joining device
08/29/2012CN101958306B Embedded circuit substrate and manufacturing method thereof
08/29/2012CN101958251B Method for manufacturing patterned substrate on lithium aluminate wafer
08/29/2012CN101933128B Component mounting apparatus and method
08/29/2012CN101930943B Semiconductor device manufacturing method and semiconductor device
08/29/2012CN101927447B Method of the double sided polishing of a semiconductor wafer
08/29/2012CN101925979B Method for manufacturing III nitride semiconductor, and method for manufacturing III nitride semiconductor light emitting element
08/29/2012CN101924299B One-touch popping device of memory module test socket
08/29/2012CN101916754B Through-hole, through-hole forming method and through-hole filling method
08/29/2012CN101910450B Process for producing thin film of a-IGZO oxide
08/29/2012CN101908562B Structure and method for forming a shielded gate trench FET
08/29/2012CN101884098B Apparatus and method for mounting electronic component
08/29/2012CN101874287B Through-wafer interconnections in electrostatic transducer and array
08/29/2012CN101866869B Wafer transmission set for special equipment of semiconductor
08/29/2012CN101853831B Semiconductor device and manufacturing method therefor
08/29/2012CN101849444B Flat antenna member and a plasma processing device provided with same
08/29/2012CN101847637B Semiconductor device with vertical transistor and method for fabricating the same
08/29/2012CN101842899B Method for integrating NVM circuitry with logic circuitry
08/29/2012CN101840972B Semiconductor photoelectric element structure of inverted chip type and making method thereof
08/29/2012CN101840921B Static random access memory (sram) cell and method for forming same
08/29/2012CN101836525B Component mounting apparatus, component mounting head, and component mounting method
08/29/2012CN101836515B Anisotropically conductive adhesive
08/29/2012CN101834159B Manufacturing process for realizing through silicon via packaging by adopting BCB (Benzocyclobutene) supplementary bonding
08/29/2012CN101834148B Semiconductor apparatus and method for manufacturing same
08/29/2012CN101826164B Chip card assembly and manufacturing method thereof
08/29/2012CN101819982B Multi-layer cross point resistive memory device and manufacturing method thereof
08/29/2012CN101819920B Substrate processing apparatus
08/29/2012CN101778882B 环氧树脂组合物 The epoxy resin composition
08/29/2012CN101777551B Polycrystalline light emitting diode
08/29/2012CN101772992B Abnormal discharge suppressing device for vacuum apparatus
08/29/2012CN101740587B Multispectral sensitization device and manufacturing method thereof
08/29/2012CN101728338B Light emitting display and method of manufacturing the same
08/29/2012CN101728279B Preparation method of high-performance diamond reinforced Al-matrix electronic packaging composite material
08/29/2012CN101720509B Method for forming gate structures
08/29/2012CN101704497B Structure of single-etch tank hermetically packaged by MEMS in wafer level and method thereof
08/29/2012CN101673677B Method for manufacturing semiconductor
08/29/2012CN101661958B Novel high-k metal gate structure and method of making
08/29/2012CN101647090B RF shutter
08/29/2012CN101646736B Coating solution for surface flat insulating formation, surface flat insulating film covering base material, and process for producing surface flat insulating film covering base material
08/29/2012CN101622698B Plasma processing apparatus, and plasma processing method
08/29/2012CN101617243B Sensor package
08/29/2012CN101562138B Method for producing semiconductor packaging part
08/29/2012CN101553907B Structures and methods for low-k or ultra low-k interlayer dielectric pattern transfer
08/29/2012CN101553903B Wafer via formation
08/29/2012CN101546985B Amplifying element and manufacturing method thereof
08/29/2012CN101536174B Substrate container
08/29/2012CN101533815B Semiconductor device and method of manufacturing the same
08/29/2012CN101525522B An oligosaprobic polishing composition
08/29/2012CN101517719B Method of manufacturing an integrated circuit
08/29/2012CN101501153B Film adhesive, adhesive sheet, and semiconductor device using the same
08/29/2012CN101483194B Vertical-type non-volatile memory device and its manufacturing method
08/29/2012CN101471355B Image sensor and method for manufacturing the sensor
08/29/2012CN101471255B Method of forming dielectric films
08/29/2012CN101466208B Wiring substrate and method of manufacturing the same
08/29/2012CN101465326B Method for manufacturing mask ROM
08/29/2012CN101459138B Manufacturing method for mask read only memory device
08/29/2012CN101443889B Power metal semiconductor field effect transistor contact metallization
08/29/2012CN101436527B Component supply device
08/29/2012CN101419905B Method for fabricating semiconductor device
08/29/2012CN101405837B Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
08/29/2012CN101359637B Power semiconductor device with metal contact layer and corresponding production method
08/29/2012CN101355090B Thin-film transistor array substrate and preparation method thereof
08/29/2012CN101335302B Thin film transistor and organic led display and method of fabricating the same
08/29/2012CN101330043B Method for manufacturing semiconductor device utilizing low dielectric layer filling gaps between metal lines
08/29/2012CN101308810B Semiconductor circuit construction and manufacturing process
08/29/2012CN101286516B Active matrix subtrate, liquid crystal display panel and method of manufacturing the same
08/29/2012CN101266946B Semiconductor device making method and backlighting type semiconductor device
08/29/2012CN101226887B Method for cutting chip
08/29/2012CN101165856B Oxidation apparatus and method for semiconductor process
08/29/2012CN101160140B 活性物质散发装置 Distributing means active substances
08/29/2012CN101151707B 杂质导入装置和杂质导入方法 Impurity introduction apparatus and method for introducing impurities
08/29/2012CN101150910B Device with adjustable electrode and method for adjusting adjustable electrode
08/29/2012CN101145564B Active matrix display base plate preparing method
08/29/2012CN101144973B Method of etching extreme ultraviolet light photomasks
08/29/2012CN101097854B Flexible display device having enhanced thin film semiconductive layer and method of manufacture
08/29/2012CN101084471B Support structure and lithographic apparatus
08/28/2012USRE43607 Method and apparatus for evaluating a known good die using both wire bond and flip-chip interconnects
08/28/2012US8255858 Method for adjusting capacitance of capacitors without affecting die area
08/28/2012US8255857 Routing methods for integrated circuit designs
08/28/2012US8255842 Thin-film transistor circuit, design method for thin-film transistor, design program for thin-film transistor circuit, design program recording medium, design library database, and display device
08/28/2012US8255082 Method for teaching carrier means, storage medium and substrate processing apparatus
08/28/2012US8254662 System for monitoring foreign particles, process processing apparatus and method of electronic commerce