Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2012
10/11/2012WO2012136888A1 Method for depositing one or more polycrystalline silicon layers on substrate
10/11/2012WO2012136848A1 Bipolar punch-through semiconductor device and method for manufacturing such a semiconductor device
10/11/2012WO2012136665A1 Process for catalyst-free selective growth on a semiconductor structure
10/11/2012WO2012136586A1 Substrate carrier
10/11/2012WO2012136435A1 Electronic memory device
10/11/2012WO2012136268A1 Method for permanently bonding wafers
10/11/2012WO2012136267A1 Method for permanently bonding wafers
10/11/2012WO2012136266A1 Method for permanently bonding wafers
10/11/2012WO2012136176A1 Method for producing a iii/v si template
10/11/2012WO2012136166A2 Chip pad glue feeder apparatus
10/11/2012WO2012136066A1 Complementary tunneling field effect transistor and method for forming the same
10/11/2012WO2012136055A1 Method for inhibiting flash memory programming interference
10/11/2012WO2012136027A1 Sonos flash memory device, manufacturing method and operation method therefor
10/11/2012WO2012136000A1 Glue filling method and device in the semiconductor package
10/11/2012WO2012135997A1 Method for forming microelectrode-pair arrays on silicon substrate surface with hydrophobic silicon pillars
10/11/2012WO2012135986A1 Method for manufacturing transistor and semiconductor device
10/11/2012WO2012135915A1 Hybrid solar cell contact
10/11/2012WO2012108758A3 Silicon diaphragm formation with embedded oxide support
10/11/2012WO2012106612A3 In-situ hydroxylation system
10/11/2012WO2012106439A3 Memory devices with a connecting region having a band gap lower than a band gap of a body region
10/11/2012WO2012103928A8 Arrangement of carriers for optoelectronic chips
10/11/2012WO2012096638A3 Support structures and clamping systems for semiconductor devices during wire and ribbon bonding operations
10/11/2012WO2012092026A3 A method and apparatus for forming a thin lamina
10/11/2012WO2012086997A9 Plasma particle photographing apparatus
10/11/2012WO2012086974A3 Processing method of tray for transporting substrate of chemical vapor deposition apparatus for solar cell
10/11/2012WO2012082956A3 Methods for metal plating and related devices
10/11/2012WO2012082955A3 Etched wafers and methods of forming the same
10/11/2012WO2012075438A3 Processing assembly for semiconductor workpiece and mehtods of processing same
10/11/2012WO2012075431A3 Processing assembly for semiconductor workpiece and methods of processing same
10/11/2012WO2012060222A9 Semiconductor device and manufacturing method therefor
10/11/2012WO2012028728A3 Method for the wet-chemical etching back of a solar cell emitter
10/11/2012WO2011073937A9 System and method for doping semiconductor materials
10/11/2012US20120260222 Mask fabrication supporting method, mask blank providing method, and mask blank dealing system
10/11/2012US20120258607 E-Beam Enhanced Decoupled Source for Semiconductor Processing
10/11/2012US20120258606 E-Beam Enhanced Decoupled Source for Semiconductor Processing
10/11/2012US20120258605 Device for a laser lift-off method and laser lift-off method
10/11/2012US20120258604 Deposition Method
10/11/2012US20120258603 Clamped monolithic showerhead electrode
10/11/2012US20120258602 Method for Metal Deposition Using Hydrogen Plasma
10/11/2012US20120258601 E-Beam Enhanced Decoupled Source for Semiconductor Processing
10/11/2012US20120258600 Method and system for post-etch treatment of patterned substrate features
10/11/2012US20120258599 Spacer process for on pitch contacts and related structures
10/11/2012US20120258598 Stabilized Chemical Mechanical Polishing Composition and Method of Polishing a Substrate
10/11/2012US20120258597 Method of manufacturing semiconductor device
10/11/2012US20120258596 Process of planarizing a wafer with a large step height and/or surface area features
10/11/2012US20120258595 Formation of a Masking Layer on a Dielectric Region to Facilitate Formation of a Capping Layer on Electrically Conductive Regions Separated by the Dielectric Region
10/11/2012US20120258594 On-Chip RF Shields with Backside Redistribution Lines
10/11/2012US20120258593 Sram cell with t-shaped contact
10/11/2012US20120258592 Layouts of POLY Cut Openings Overlapping Active Regions
10/11/2012US20120258591 N-Type Contact Electrode Comprising a Group III Nitride Semiconductor, and Method Forming Same
10/11/2012US20120258590 Chemical mechanical polishing (cmp) processing of through-silicon via (tsv) and contact plug simultaneously
10/11/2012US20120258589 Method of fabricating coaxial through-silicon via
10/11/2012US20120258588 Self forming metal fluoride barriers for fluorinated low-k dielectrics
10/11/2012US20120258587 Method of Forming Graphene on a Surface
10/11/2012US20120258586 Semiconductor device and method of manufacturing the same
10/11/2012US20120258585 Incorporating impurities using a discontinuous mask
10/11/2012US20120258584 Glass substrate comprising an edge web portion
10/11/2012US20120258583 Method for epitaxial layer overgrowth
10/11/2012US20120258582 Method and apparatus for selectively growing doped epitaxial film
10/11/2012US20120258581 Mocvd fabrication of group iii-nitride materials using in-situ generated hydrazine or fragments there from
10/11/2012US20120258580 Plasma-assisted mocvd fabrication of p-type group iii-nitride materials
10/11/2012US20120258579 Design, layout, and manufacturing techniques for multivariant integrated circuits
10/11/2012US20120258578 Semiconductor device and manufacturing method thereof
10/11/2012US20120258577 Capacitor-less memory cell, device, system and method of making same
10/11/2012US20120258576 Manufacturing method of semiconductor device
10/11/2012US20120258575 Manufacturing method of semiconductor device
10/11/2012US20120258574 Couplings within memory devices
10/11/2012US20120258573 Fabrication method of substrate
10/11/2012US20120258572 Adhesive sheet and production method for electronic component
10/11/2012US20120258571 Method for fabricating a semiconductor and semiconductor package
10/11/2012US20120258570 Substrate processing apparatus, program for controlling the same, and method for fabricating semiconductor device
10/11/2012US20120258566 Substrate processing apparatus, method for manufacturing solar battery, and method for manufacturing substrate
10/11/2012US20120258564 Method to avoid fixed pattern noise within backside illuminated (bsi) complementary metal-oxide-semiconductor (cmos) sensor array
10/11/2012US20120258560 Method and system for fabricating ion-selective field-effect transistor (isfet)
10/11/2012US20120258558 Method of manufacturing a semiconductor laser
10/11/2012US20120258556 Method for manufacturing liquid ejecting head
10/11/2012US20120258555 Multi-Frequency Hollow Cathode and Systems Implementing the Same
10/11/2012US20120258414 Substrate support instrument, and vertical heat treatment apparatus and driving method thereof
10/11/2012US20120258289 Method of fabricating nanostructure array and device including nanostructure array
10/11/2012US20120257952 Substrate handler
10/11/2012US20120257948 Loading unit and processing system
10/11/2012US20120257443 Semiconductor integrated circuit device with reduced leakage current
10/11/2012US20120257435 Non-salicide polysilicon fuse
10/11/2012US20120257178 Lithographic apparatus and device manufacturing method
10/11/2012US20120257176 Substrate transport method, substrate transport apparatus, and coating and developing system
10/11/2012US20120257135 Fan-out design, method of forming fan-out design, and lcd adopting the fan-out design
10/11/2012US20120256435 Robotic device for substrate transfer applications
10/11/2012US20120256346 Mold structures, and method of transfer of fine structures
10/11/2012US20120256327 Semiconductor device and manufacturing method therefor
10/11/2012US20120256326 Adhesive composition, semiconductor device making use thereof, and production method thereof
10/11/2012US20120256324 Method for Improving Performance of Etch Stop Layer
10/11/2012US20120256323 Method for processing a semiconductor wafer or die, and particle deposition device
10/11/2012US20120256321 Layered chip package and method of manufacturing same
10/11/2012US20120256317 Barrier Layer for Integrated Circuit Contacts
10/11/2012US20120256314 Short and low loop wire bonding
10/11/2012US20120256313 Solder ball contact susceptible to lower stress
10/11/2012US20120256312 Semiconductor device and method for fabricating the same
10/11/2012US20120256311 Semiconductor device and method of manufacturing the same
10/11/2012US20120256308 Method for Sealing a Micro-Cavity
10/11/2012US20120256307 Sensor module, sensor device, manufacturing method of sensor device, and electronic apparatus