Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/1996
01/09/1996US5483349 Apparatus for detecting positions of marks in projection aligner wherein an auxiliary pattern is constructed to produce a signal level that is independent of the surface condition of a substrate
01/09/1996US5483343 Wavelength compensator in a helium ambience
01/09/1996US5483173 Current measuring structure for testing integrated circuits
01/09/1996US5483152 Wide range power supply for integrated circuits
01/09/1996US5483138 System and method for automated positioning of a substrate in a processing chamber
01/09/1996US5483106 Semiconductor device for sensing strain on a substrate
01/09/1996US5483104 Semiconductor structure
01/09/1996US5483100 Integrated circuit package with via interconnections formed in a substrate
01/09/1996US5483098 Semiconductor device
01/09/1996US5483097 Film made from hydrogen containing silicon nitride film with specified hydrogen bond concentration amd silicon/nitrogen ratio limits; transmits uv radiation
01/09/1996US5483095 Optical semiconductor device
01/09/1996US5483094 Electrically programmable read-only memory cell
01/09/1996US5483092 Semiconductor device having a via-hole with a void area for reduced cracking
01/09/1996US5483091 Charge-coupled device array for spectroscopic detection
01/09/1996US5483089 Electrically isolated MESFET
01/09/1996US5483084 Diamond covered member and process for producing the same
01/09/1996US5483083 Semiconductor integrated circuit device
01/09/1996US5483082 Thin film transistor matrix device
01/09/1996US5483077 System and method for magnetic scanning, accelerating, and implanting of an ion beam
01/09/1996US5483056 Method of projecting exposure with a focus detection mechanism for detecting first and second amounts of defocus
01/09/1996US5483041 For measuring thermal energy in a high temperature furnace
01/09/1996US5482903 Powder mixture of boria, calcia, and alumina; high density, thermoconductivity
01/09/1996US5482900 Method for forming a metallurgy system having a dielectric layer that is planar and void free
01/09/1996US5482899 Leveling block for semiconductor demounter
01/09/1996US5482898 Method for forming a semiconductor device having a thermal dissipator and electromagnetic shielding
01/09/1996US5482895 Method of manufacturing semiconductor devices having silicide electrodes
01/09/1996US5482894 Method of fabricating a self-aligned contact using organic dielectric materials
01/09/1996US5482890 Method of fabricating quantum dot structures
01/09/1996US5482889 Method for producing of semiconductor device having of channel stopper under field insulating layer
01/09/1996US5482888 Method of manufacturing a low resistance, high breakdown voltage, power MOSFET
01/09/1996US5482887 Method of manufacturing a semiconductor device with a passivated side
01/09/1996US5482886 Method for fabricating dynamic random access memory capacitor
01/09/1996US5482885 Method for forming most capacitor using poly spacer technique
01/09/1996US5482883 Method for fabricating low leakage substrate plate trench DRAM cells and devices formed thereby
01/09/1996US5482882 Multilayer polysilicon electrodes for capacitors and heat treatment
01/09/1996US5482881 Method of making flash EEPROM memory with reduced column leakage current
01/09/1996US5482880 Non-volatile memory cell and fabrication method
01/09/1996US5482879 Process of fabricating split gate flash memory cell
01/09/1996US5482878 Method for fabricating insulated gate field effect transistor having subthreshold swing
01/09/1996US5482877 Method for making a semiconductor device having a silicon-on-insulator structure
01/09/1996US5482876 Field effect transistor without spacer mask edge defects
01/09/1996US5482875 Method for forming a linear heterojunction field effect transistor
01/09/1996US5482874 Inversion implant isolation process
01/09/1996US5482873 Method for fabricating a bipolar power transistor
01/09/1996US5482872 Method of forming isolation region in a compound semiconductor substrate
01/09/1996US5482871 Method for forming a mesa-isolated SOI transistor having a split-process polysilicon gate
01/09/1996US5482870 Methods for manufacturing low leakage current offset-gate thin film transistor
01/09/1996US5482869 Gettering of unwanted metal impurity introduced into semiconductor substrate during trench formation
01/09/1996US5482818 Printed and integrated circuits, using computer to generate master reticle
01/09/1996US5482817 Absorbers for photoresists for ultraviolet radiation
01/09/1996US5482799 Defect detection; homogenous monolayer and transmitting films
01/09/1996US5482748 Bbowl shape substrate coated with microwave plasma
01/09/1996US5482739 Silicon nitride deposition
01/09/1996US5482735 Method for making multi-layer ceramic packages
01/09/1996US5482611 Physical vapor deposition employing ion extraction from a plasma
01/09/1996US5482598 Micro channel element and method of manufacturing the same
01/09/1996US5482566 Mixed with alkanolamine and chelate compound
01/09/1996US5482559 Heat treatment boat
01/09/1996US5482558 Heat treatment boat support
01/09/1996US5482555 Liquid-phase epitaxy growth system and method for growing epitaxial layer
01/09/1996US5482524 Atmospheric pressure, elevated temperature gas desorption apparatus
01/09/1996US5482471 Socket apparatus for IC package testing
01/09/1996US5482174 Method for removing copper oxide on the surface of a copper film and a method for patterning a copper film
01/09/1996US5482161 Mechanical interface wafer container
01/09/1996US5482068 Cleaning apparatus
01/09/1996US5482059 Triple zone mascara brush
01/09/1996US5481899 Pressure differential downset apparatus
01/09/1996US5481798 Etching method for forming a lead frame
01/04/1996WO1996000494A1 Vertical interconnect process for silicon segments
01/04/1996WO1996000492A1 Method and device for coating printed-circuit boards, in particular for the manufacture of multi-chip-modules
01/04/1996WO1996000452A2 Charge coupled device, and imaging device comprising such a charge coupled device
01/04/1996DE4440000C1 Heat treatment system for semiconductor disc
01/04/1996DE4423326A1 Back etching silicon wafer structure
01/04/1996DE4423067A1 Insulated semiconductor substrate prodn. method
01/04/1996DE4422913A1 Prodn. of microstructures used in the construction of microsystems
01/04/1996DE4421843A1 Vorrichtung und Verfahren zum Ablösen von Partikeln auf Gegenständen Apparatus and method for peeling off of particles on objects
01/04/1996DE19524027A1 Semiconductor device
01/04/1996DE19524025A1 Substrate holder for esp. dry spinning wafer after cleaning process
01/04/1996DE19523969A1 Component transport system for integrated circuit testing unit
01/04/1996DE19523743A1 Prodn. of capacitor on semiconductor element
01/04/1996DE19522942A1 Multiple substrate conveyor for semiconductor device mfr. system
01/04/1996DE19519017A1 Method of improving structure with different component elements
01/04/1996DE19517002A1 Semiconductor field effect transistor for SRAM or DRAM
01/03/1996EP0690666A1 Structure and method for semiconductor processing
01/03/1996EP0690579A2 Field programmable gate arrays
01/03/1996EP0690575A1 Device for activating a source of bias voltage
01/03/1996EP0690514A2 SOI transistor having a self-aligned body contact
01/03/1996EP0690513A2 Step-cut insulated gate static induction transistors and method of manufacturing the same
01/03/1996EP0690511A1 Compound semiconductor device and its manufacturing method
01/03/1996EP0690509A1 Substrate contact for gate array base cell and method of forming same
01/03/1996EP0690508A2 Buried layer in a memory array
01/03/1996EP0690507A1 Semiconductor device and method of manufacturing the same
01/03/1996EP0690506A1 Method of fabrication of a semiconductor device comprising at least two field-effect transistors having a different pinch-off voltage
01/03/1996EP0690505A2 Sintered body for and manufacture of ceramic substrates
01/03/1996EP0690504A1 Solder terminal and method of fabricating it
01/03/1996EP0690503A1 Improved interconnect line structure and process therefor
01/03/1996EP0690501A2 Integrated circuit package with diamond heat sink
01/03/1996EP0690499A2 Paddleless molded plastic semiconductor chip package
01/03/1996EP0690496A2 DRAM cell with trench capacitor
01/03/1996EP0690495A1 Method for making circular diode chips through glass passivation