C25D 7 - Electroplating characterised by the article coated

Patents for C25D 7 - Electroplating characterised by the article coated (12,170)
11/2011
11/10/2011	US20110272286 Method of manufacturing multilayer printed wiring board
11/09/2011	CN202030844U Vertical type electroplating production line of tungsten-alloy oil sleeve and drilling rod
11/09/2011	CN102239280A Conductive member and method for producing the same
11/09/2011	CN102234748A Galvanizing carbon fiber foamed light metal and preparation method thereof
11/09/2011	CN101871112B Electrochemical preparation method for synthesizing high temperature phase cuprous iodide at room temperature
11/09/2011	CN101845646B Preparation method of gold nano-wire of monocrystalline and polycrystalline structure
11/09/2011	CN101636527B Copper electrolyte solution and two-layer flexible substrate obtained by using the same
11/08/2011	US8052857 Process for anodizing a robotic device
11/08/2011	CA2503675C Process for in-situ electroforming a structural layer of metallic material to an outside wall of a metal tube
11/03/2011	WO2011136061A1 Laminate for flexible wiring
11/03/2011	WO2011135716A1 Novel compound and use thereof
11/03/2011	WO2011135673A1 Novel compound and use thereof
11/03/2011	US20110266156 Method of forming solid blind vias through the dielectric coating on high density interconnect (hdi) substrate materials
11/03/2011	US20110266155 Electrodeposition paint composition
11/03/2011	US20110266153 Electrochemical deposition process for composite structures
11/03/2011	US20110265564 Micromachined piezoelectric x-axis gyroscope
11/02/2011	CN202023648U Oil ring and electroplating system for oil ring
11/02/2011	CN202022988U Micropore coppering device of HDI (High Density Interconnect) circuit board
11/02/2011	CN1738929B Metal plating coating film having sliding function and article coated therewith
11/02/2011	CN102230208A Special anode of plating chromium on cavity of slender pipe and chromium plating method thereof
11/02/2011	CN102230202A Copper-plating method of MB2 magnesium alloy wires
11/02/2011	CN101565844B Sealing jig and plating treatment apparatus
11/02/2011	CN101555610B Method for local electroplating sheltering and hanging aluminium alloy cavity of communication filter
11/01/2011	US8048283 Method and apparatus for plating semiconductor wafers
11/01/2011	US8048282 Apparatus and method for plating a substrate
11/01/2011	US8048280 Process for electroplating metals into microscopic recessed features
11/01/2011	CA2621036C Threaded joint for steel pipes
11/01/2011	CA2462849C Nickel coated copper as electrodes for embedded passive devices
10/2011
10/27/2011	WO2011132538A1 Method for producing aluminum structure and aluminum structure
10/27/2011	US20110259752 Method for substantially uniform copper deposition onto semiconductor wafer
10/27/2011	US20110259751 Method and device for controlling uplink power
10/27/2011	US20110259734 Apparatus for Electrochemical Plating Semiconductor Wafers
10/27/2011	CA2781169A1 Method for producing aluminum structural body and aluminum structural body
10/26/2011	EP2381015A1 Compositionally modulated composite materials and methods for making the same
10/26/2011	CN202017060U 20-row small-shape transistor baffle
10/26/2011	CN202017057U Wire-break automatic stop device used in wire plating production
10/26/2011	CN102226991A Copper palladium alloy monocrystal bonding wire and manufacturing method thereof
10/26/2011	CN101717979B Control method of transverse uniformity of plating of strip steel of horizontal electroplating bath
10/26/2011	CN101255587B Bulb holder annularly plating method
10/26/2011	CN101255586B Bulb holder plating method
10/25/2011	US8043741 Surface-treated steel plate for battery case and battery case
10/20/2011	WO2011127513A1 Multi-layer plain bearing having an anti-fretting layer
10/20/2011	WO2011127511A1 Anti-fretting layer
10/20/2011	US20110255165 Retroreflective sheeting
10/20/2011	US20110253547 Alkaline Electrochemical Cell with Reduced Gassing
10/20/2011	US20110253545 Method of direct electrodeposition on semiconductors
10/19/2011	CN202011915U Electroplating device
10/19/2011	CN102224281A Copper foil for printed circuit
10/19/2011	CN102222729A Method for improving electroplating quality of front electrode of solar cell
10/19/2011	CN102220611A Prevention mechanism for flying target falling off in printed circuit board plating production line
10/18/2011	US8038856 Method and apparatus for fluid processing a workpiece
10/18/2011	CA2502717C Mixture of oligomeric phenazinium compounds and acid bath for electrolytically depositing a copper deposit
10/13/2011	WO2011125555A1 Cu-zn alloy strip for tab material for connecting cells
10/13/2011	US20110247941 Method for Electrochemical Fabrication
10/13/2011	US20110247939 Wear resistant ceramic coated aluminum alloy article
10/12/2011	EP2167223B1 Unit and method for the electrolytic tinning of steel strips
10/12/2011	EP1646746B1 Water-permeable drum for the hydrodynamic needling of webs of textile materials, and method for the production of said drum
10/12/2011	CN202007279U Multifunctional electroplating device
10/12/2011	CN202007277U Press roll pressure balance measuring device
10/12/2011	CN102212856A Roll-welded pipe spiral electroplating equipment and electroplating method thereof
10/06/2011	US20110242778 Electrical Connections for Anodized Thin Film Structures
10/06/2011	US20110240358 Wiring board and method for manufacturing the same
10/06/2011	DE102010014555A1 Continuous hot dip galvanizing of electrolytic cells and for processing finished solar cell, comprises partially adjoining electrical contact factor of an electrical conductor for feeding electroplating current at a surface of cells
10/05/2011	EP2373134A1 Rolled copper foil or electrolytic copper foil for electronic circuit, and method for forming electronic circuit using the rolled copper foil or electrolytic copper foil
10/05/2011	EP2373133A1 Rolled copper foil or electrolytic copper foil for electronic circuit, and method for forming electronic circuit using the rolled copper foil or electrolytic copper foil
10/05/2011	EP2373132A1 Method for forming electronic circuit
10/05/2011	EP2371995A1 Rolled copper foil or electrolytic copper foil for electronic circuit and method of forming electronic circuit using same
10/05/2011	EP2371984A1 Method for producing a coated metal wire
10/05/2011	CN202000011U Hook for galvanizing hanging device on a circuit board
10/05/2011	CN102206844A Consolidation method for tile die tip with electroplated diamond
10/05/2011	CN102206842A Manufacturing method of zinc/tin double-layer electroplated steel plate
10/05/2011	CN101949050B Electroplating support system for mandrel workpieces
10/05/2011	CN101927274B Production technology of hyperfine steel wire
10/04/2011	US8029660 Manufacturing method of semiconductor integrated device with inverting plating cup
09/2011
09/29/2011	WO2011118650A1 Copper alloy for electronic material and method of manufacture for same
09/29/2011	WO2011118537A1 Cyanide based electrolytic gold plating solution and plating method using same
09/29/2011	US20110234365 Chip resistor having low resistance and method for manufacturing the same
09/29/2011	US20110233064 Electrolytic treatment method and apparatus, and method and apparatus for manufacturing planographic printing plate
09/29/2011	DE102010012573A1 Verfahren und Vorrichtung zur Herstellung einer hochselektiv absorbierenden Beschichtung auf einem Solarabsorberbauteil und Solarabsorber mit einer solchen Beschichtung Method and apparatus for producing a high-selectively absorbing coating on a solar absorber component and solar absorber with such a coating
09/28/2011	EP2369629A1 Method of manufacturing electrical contacts of a silicon solar cell structure.
09/28/2011	CN201990750U 一种半导体封装产品电镀挂架系统 A semiconductor package products Plating Rack System
09/28/2011	CN201990746U 引线框架高速电镀生产线用驱动轮 Leadframe plating production lines with a high-speed wheels
09/28/2011	CN201990743U 整流线连接结构以及印刷电路板电镀装置 The rectified line connection structure and a printed circuit board plating apparatus
09/28/2011	CN201990740U 电沉积金属波纹管成形装置 Electrodeposited metal bellows forming device
09/28/2011	CN102203326A Ultrathin copper foil with carrier, and copper laminated board or printed wiring board
09/28/2011	CN102201531A Solution for surface metallization pretreatment of semiconductor P/N type refrigerating sheet and application method of same
09/28/2011	CN101922030B Electroplating cathode vibration device
09/22/2011	WO2011113908A1 Composition for metal electroplating comprising leveling agent
09/22/2011	WO2011064154A3 Composition for metal electroplating comprising leveling agent
09/22/2011	US20110226628 Conical graphite electrode with raised edge
09/21/2011	EP2229688B1 Device and method for the wet processing of different substrates
09/21/2011	CN201981283U 环形活塞电镀用夹具 Annular piston plating jig
09/21/2011	CN201981280U 印制电路板沉铜用装置 Heavy copper printed circuit board with a device
09/21/2011	CN201981277U 垂直折叠式电镀生产线 Vertical folding electroplating production line
09/21/2011	CN201981276U 一种新型带材镀铬装置 A new chrome strip device
09/21/2011	CN102191533A Novel full-automatic gravure electroplating clamping device
09/21/2011	CN102191532A Pickling-free production method capable of phosphorizing steel strand on line
09/21/2011	CN102191525A Production process for electroplated abrasive material on surface of metal wire
09/21/2011	CN102191524A Plating apparatus and wire inspection method of the same
09/21/2011	CN102191521A Electroplating device for lead wire framework

1 ... 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 ... 122