Patents for C25D 7 - Electroplating characterised by the article coated (12,170)
12/2011
12/29/2011US20110315624 Method of making nanoporous oxide ceramic membranes of tubular and hollow fiber shape
12/28/2011EP2399281A1 Process for electrodeposition of copper chip to chip, chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv)
12/28/2011CN202090087U 一种钢带连续镀铜雾化清洗装置 One kind of continuous copper strip atomizer cleaning device
12/28/2011CN202090086U 一种钢带连续镀铜的自动放氢装置 One kind of continuous copper strip automatic desorption device
12/28/2011CN202090077U 晶圆处理装置 Wafer processing equipment
12/28/2011CN202090076U 微型孔电镀装置 Micro-hole plating device
12/28/2011CN202088562U 一种具有高耐腐蚀性能的可锡焊铝带 A high corrosion resistance of aluminum can be soldered
12/28/2011CN1914359B 封孔处理剂、封孔处理方法、及用该处理剂处理的印刷基板 Sealing treatment agent, sealing treatment method, and with the treating agent of the printed circuit board
12/28/2011CN102301039A 碳铝复合材料的提高的热性质 Thermal properties of carbon-aluminum composite material improvement
12/28/2011CN102299198A 一种带硅太阳电池的制备工艺 Preparation of a silicon solar cell with
12/28/2011CN102296348A 在宽幅面金属基带表面形成光选择性吸收涂层的装置 Device selectively absorbing light in a wide surface coating formed on the surface of metal baseband
12/28/2011CN102296345A 一种长轴工件电镀系统 One kind of the long axis of the workpiece plating system
12/28/2011CN102296344A 改善电镀均匀性的太阳能电池片电镀设备 Improving plating uniformity of solar cells plating equipment
12/28/2011CN102296336A 一种改善电镀均匀性的太阳能电池片电镀设备 A method for improving the uniformity of the plating film solar cells plating equipment
12/28/2011CN102296335A 一种钢带镀锌生产线的定位装置 Positioning device for steel galvanizing line
12/28/2011CN102296334A 高效自动化钢带镀锌装置 Galvanized steel efficient automation equipment
12/28/2011CN102296333A 一种拉镀机阴极输送装置 One kind of pull-plated machine cathode delivery device
12/28/2011CN101724876B 用于多缸汽缸体电镀预处理设备和方法 Multi-cylinder cylinder block apparatus and method for plating pretreatment
12/28/2011CN101363127B 电解镀铜方法 Electrolytic copper plating method
12/27/2011US8082932 Single side workpiece processing
12/22/2011WO2011158698A1 Process for production of semiconductor device, and semiconductor device
12/21/2011EP2398304A2 Copper clad laminate with copper-plated circuit layer, and method for manufacturing printed wiring board using the copper clad laminate with copper-plated circuit layer
12/21/2011EP2397577A1 Metallization of textile structures
12/21/2011CN202081188U 一种钢带连续镀铜恒温装置 One kind of continuous copper strip thermostat
12/21/2011CN202081187U 表面处理机挤压辊装置 Surface processor squeeze roller device
12/21/2011CN202081186U 具有张力控制机制的卷对卷电镀设备 Roll plating device with tension control mechanism
12/21/2011CN202081184U 一种钢带连续镀铜中导电辊清洗水的循环利用装置 Recycling means a continuous copper strip in a conductive roller washing water
12/21/2011CN202081183U 太阳能硅片线切割钢线的制备装置 Solar wafer cutting wire steel wire preparation device
12/21/2011CN102286762A 一种镀银的铜合金线 One kind of silver-plated copper alloy wire
12/21/2011CN102286760A 用金属电化学填充高纵横比的大型凹入特征的方法、水溶液电镀槽溶液、电镀设备以及系统 Electrochemical filled with a metal of high aspect ratio features large recessed methods aqueous solution plating tank, plating equipment and systems
12/21/2011CN101892418B 耐腐蚀软质冷轧镀锡板及其生产方法 Corrosion-resistant soft cold-rolled tin plate and its production method
12/15/2011WO2011154493A1 Copper-electroplating composition and process for filling a cavity in a semiconductor substrate using this composition
12/15/2011US20110303546 Process for fabricating a monolayer or multilayer metal structure in liga technology, and structure obtained
12/15/2011US20110303341 Method for the miniaturizable contacting of insulated wires
12/15/2011US20110302761 Process for manufacturing an anodized aluminum disc seal shell
12/15/2011CA2801875A1 Copper-electroplating composition and process for filling a cavity in a semiconductor substrate using this composition
12/14/2011EP2393965A2 Die for continuous casting
12/14/2011EP2393964A1 Electroplating methods and chemistries for deposition of copper-indium-gallium containing thin films
12/14/2011CN202072785U 晶圆电镀夹具 Wafer plated fixtures
12/14/2011CN202072780U 一种电镀系统及其喷流装置 One kind of plating system and the jet device
12/14/2011CN1944716B 凸点形成用非氰系电解镀金浴 Bump forming system with a non-cyanide electroless gold plating bath
12/14/2011CN102280388A 基于单晶铜键合丝的制备方法 Based on the preparation method of single crystal copper bonding wire
12/14/2011CN102277613A 电镀装置 Plating equipment
12/14/2011CN102277605A 光面粗化电解铜箔的制造工艺 Smooth roughened electrolytic copper foil manufacturing process
12/14/2011CN102277599A 低温治疗探针真空绝热隔层金属组件表面处理工艺 Hypothermia probe vacuum insulation barrier metal component surface treatment processes
12/14/2011CN102029307B 一种电缆自承线用锌包钢的生产工艺 A self-supporting cable wire clad with zinc production process
12/13/2011US8075791 Chemical treatment method
12/13/2011US8075756 Semiconductor wafer holder and electroplating system for plating a semiconductor wafer
12/07/2011EP2393171A1 Spark plug and process for producing same
12/07/2011EP1579463B1 Method for increasing the copper to superconductor ratio in a superconductor wire
12/07/2011CN202064018U 一种改进的半导体引线框架中圆盘电镀结构 An improved semiconductor lead frame plating disc structure
12/07/2011CN102272416A 不粘设备 Non-stick device
12/07/2011CN102268719A 直立式电镀设备及其电镀方法 Vertical plating and electroplating equipment
12/07/2011CN102268717A 一种金刚石丝锯的上砂方法 A line of diamond wire saw on the sand method
12/07/2011CN102268706A 制备ZnO/Cu<sub>2</sub>O异质结材料及ZnO/Cu<sub>2</sub>O三维结构异质结太阳电池的方法 Preparation of ZnO / Cu <sub> 2 </ sub> O heterojunction materials and ZnO / Cu <sub> 2 </ sub> O three-dimensional structure of heterojunction solar cell method
12/07/2011CN101942685B 芯棒工件电镀轨道拖车 Electroplating track piece mandrel trailer
12/07/2011CN101316960B 金属帘线、橡胶帘线的复合物及使用该复合物的充气轮胎 Metal cords, rubber cords compound and use of the composite pneumatic tire
12/01/2011US20110293926 Lead frame for optical semiconductor devices, method of producing the same, and optical semiconductor device
11/2011
11/30/2011CN202054913U 可焊性镀锡铝合金带 Weldability of aluminum alloy with tin
11/30/2011CN202054912U 一种全自动凹版电镀生产线系统 A fully automated electroplating production line gravure system
11/30/2011CN102265712A 电子电路的形成方法 The method of forming an electronic circuit
11/30/2011CN102265711A 电子电路用的压延铜箔或电解铜箔及使用它们形成电子电路的方法 Rolled copper foil or an electrolytic copper foil using an electronic circuit and a method which form an electronic circuit
11/30/2011CN102265710A 电子电路用的压延铜箔或电解铜箔及使用它们形成电子电路的方法 Rolled copper foil or an electrolytic copper foil and the use of electronic circuits forming an electronic circuit are a method
11/30/2011CN102264951A 电子电路用的压延铜箔或电解铜箔及使用它们形成电子电路的方法 Rolled copper foil or an electrolytic copper foil using an electronic circuit and a method which form an electronic circuit
11/30/2011CN101871110B 电镀铜方法 Copper plating method
11/30/2011CN101570876B 用于钻头电镀的电镀设备、电镀方法 Plating equipment for drill electroplating, plating method
11/24/2011WO2011145647A1 Electrolytically silver plated and/or electrolytically silver alloy plated article having oxide layer on surface
11/24/2011WO2011145033A1 A method and a system for anodising a profiled section made of aluminium or alloys thereof
11/24/2011US20110287339 Fuel cell and method of manufacturing the same
11/24/2011US20110287318 Multidimensional electrochemically active structures for battery electrodes
11/24/2011US20110284383 Sealed anodic coatings
11/24/2011US20110284382 Printed circuit board and method of manufacturing the same
11/23/2011CN202047164U Herringbone cover plate of processor
11/23/2011CN202047162U Piston rod electroplating connection shielding sleeve
11/23/2011CN202047156U Liquid feeding device for coarse foil machine
11/23/2011CN202047155U Device for moisturizing strip steel in electroplating tank through gravity method
11/23/2011CN202047154U Monomer spray plating device for power battery housing
11/23/2011CN102256440A Aluminum based circuit board, manufacturing method thereof and electroplate liquid used by method
11/23/2011CN102254842A Activation treatments in plating processes
11/22/2011US8062765 Silver layer formed by electrosilvering substrate material
11/22/2011US8062496 Electroplating method and apparatus
11/22/2011US8062471 Proximity head heating method and apparatus
11/17/2011WO2011142338A1 Method of manufacturing aluminum structure, and aluminum structure
11/17/2011US20110278770 Mold, mold manufacturing method and method for manufacturing anti-reflection film using the mold
11/17/2011CA2784182A1 Method for producing aluminum structural body and aluminum stuctural body
11/16/2011EP2229470B1 Method for obtaining a metal microstructure and microstructure obtained according to said method
11/16/2011CN202039147U Tool clamp of electroplated flat plate with handle
11/16/2011CN202039146U Tool fixture for electroplating bowl-shaped grinding wheel
11/16/2011CN202039145U Steel wire electroplating residual liquid removing device
11/16/2011CN202039144U Improved electroplating line for circuit boards
11/16/2011CN202039143U Tool fixture for automatically manufacturing grinding head
11/16/2011CN202039142U Working fixture for electroplating perforated gear disc
11/16/2011CN202039140U Coating film for electrolytic coating of surrounding area on surface of cylindrical body
11/16/2011CN102245805A Two-layer flexible copper-clad laminate substrate and process for producing same
11/16/2011CN102242385A Clean and environment-friendly iron wires galvanizing apparatus and its technology
11/16/2011CN102242383A Post-processing method for electroplating of solar welding strip
11/16/2011CN101812711B Plating apparatus
11/16/2011CN101796223B Web treatment method, treatment bath, continuous electrolytic plating apparatus and method for manufacturing plastic film having plated film
11/15/2011US8057654 Electrodeposition of dielectric coatings on semiconductive substrates
11/10/2011WO2011138876A1 Copper foil for printed circuit
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