Patents for C25D 7 - Electroplating characterised by the article coated (12,170) |
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12/29/2011 | US20110315624 Method of making nanoporous oxide ceramic membranes of tubular and hollow fiber shape |
12/28/2011 | EP2399281A1 Process for electrodeposition of copper chip to chip, chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv) |
12/28/2011 | CN202090087U 一种钢带连续镀铜雾化清洗装置 One kind of continuous copper strip atomizer cleaning device |
12/28/2011 | CN202090086U 一种钢带连续镀铜的自动放氢装置 One kind of continuous copper strip automatic desorption device |
12/28/2011 | CN202090077U 晶圆处理装置 Wafer processing equipment |
12/28/2011 | CN202090076U 微型孔电镀装置 Micro-hole plating device |
12/28/2011 | CN202088562U 一种具有高耐腐蚀性能的可锡焊铝带 A high corrosion resistance of aluminum can be soldered |
12/28/2011 | CN1914359B 封孔处理剂、封孔处理方法、及用该处理剂处理的印刷基板 Sealing treatment agent, sealing treatment method, and with the treating agent of the printed circuit board |
12/28/2011 | CN102301039A 碳铝复合材料的提高的热性质 Thermal properties of carbon-aluminum composite material improvement |
12/28/2011 | CN102299198A 一种带硅太阳电池的制备工艺 Preparation of a silicon solar cell with |
12/28/2011 | CN102296348A 在宽幅面金属基带表面形成光选择性吸收涂层的装置 Device selectively absorbing light in a wide surface coating formed on the surface of metal baseband |
12/28/2011 | CN102296345A 一种长轴工件电镀系统 One kind of the long axis of the workpiece plating system |
12/28/2011 | CN102296344A 改善电镀均匀性的太阳能电池片电镀设备 Improving plating uniformity of solar cells plating equipment |
12/28/2011 | CN102296336A 一种改善电镀均匀性的太阳能电池片电镀设备 A method for improving the uniformity of the plating film solar cells plating equipment |
12/28/2011 | CN102296335A 一种钢带镀锌生产线的定位装置 Positioning device for steel galvanizing line |
12/28/2011 | CN102296334A 高效自动化钢带镀锌装置 Galvanized steel efficient automation equipment |
12/28/2011 | CN102296333A 一种拉镀机阴极输送装置 One kind of pull-plated machine cathode delivery device |
12/28/2011 | CN101724876B 用于多缸汽缸体电镀预处理设备和方法 Multi-cylinder cylinder block apparatus and method for plating pretreatment |
12/28/2011 | CN101363127B 电解镀铜方法 Electrolytic copper plating method |
12/27/2011 | US8082932 Single side workpiece processing |
12/22/2011 | WO2011158698A1 Process for production of semiconductor device, and semiconductor device |
12/21/2011 | EP2398304A2 Copper clad laminate with copper-plated circuit layer, and method for manufacturing printed wiring board using the copper clad laminate with copper-plated circuit layer |
12/21/2011 | EP2397577A1 Metallization of textile structures |
12/21/2011 | CN202081188U 一种钢带连续镀铜恒温装置 One kind of continuous copper strip thermostat |
12/21/2011 | CN202081187U 表面处理机挤压辊装置 Surface processor squeeze roller device |
12/21/2011 | CN202081186U 具有张力控制机制的卷对卷电镀设备 Roll plating device with tension control mechanism |
12/21/2011 | CN202081184U 一种钢带连续镀铜中导电辊清洗水的循环利用装置 Recycling means a continuous copper strip in a conductive roller washing water |
12/21/2011 | CN202081183U 太阳能硅片线切割钢线的制备装置 Solar wafer cutting wire steel wire preparation device |
12/21/2011 | CN102286762A 一种镀银的铜合金线 One kind of silver-plated copper alloy wire |
12/21/2011 | CN102286760A 用金属电化学填充高纵横比的大型凹入特征的方法、水溶液电镀槽溶液、电镀设备以及系统 Electrochemical filled with a metal of high aspect ratio features large recessed methods aqueous solution plating tank, plating equipment and systems |
12/21/2011 | CN101892418B 耐腐蚀软质冷轧镀锡板及其生产方法 Corrosion-resistant soft cold-rolled tin plate and its production method |
12/15/2011 | WO2011154493A1 Copper-electroplating composition and process for filling a cavity in a semiconductor substrate using this composition |
12/15/2011 | US20110303546 Process for fabricating a monolayer or multilayer metal structure in liga technology, and structure obtained |
12/15/2011 | US20110303341 Method for the miniaturizable contacting of insulated wires |
12/15/2011 | US20110302761 Process for manufacturing an anodized aluminum disc seal shell |
12/15/2011 | CA2801875A1 Copper-electroplating composition and process for filling a cavity in a semiconductor substrate using this composition |
12/14/2011 | EP2393965A2 Die for continuous casting |
12/14/2011 | EP2393964A1 Electroplating methods and chemistries for deposition of copper-indium-gallium containing thin films |
12/14/2011 | CN202072785U 晶圆电镀夹具 Wafer plated fixtures |
12/14/2011 | CN202072780U 一种电镀系统及其喷流装置 One kind of plating system and the jet device |
12/14/2011 | CN1944716B 凸点形成用非氰系电解镀金浴 Bump forming system with a non-cyanide electroless gold plating bath |
12/14/2011 | CN102280388A 基于单晶铜键合丝的制备方法 Based on the preparation method of single crystal copper bonding wire |
12/14/2011 | CN102277613A 电镀装置 Plating equipment |
12/14/2011 | CN102277605A 光面粗化电解铜箔的制造工艺 Smooth roughened electrolytic copper foil manufacturing process |
12/14/2011 | CN102277599A 低温治疗探针真空绝热隔层金属组件表面处理工艺 Hypothermia probe vacuum insulation barrier metal component surface treatment processes |
12/14/2011 | CN102029307B 一种电缆自承线用锌包钢的生产工艺 A self-supporting cable wire clad with zinc production process |
12/13/2011 | US8075791 Chemical treatment method |
12/13/2011 | US8075756 Semiconductor wafer holder and electroplating system for plating a semiconductor wafer |
12/07/2011 | EP2393171A1 Spark plug and process for producing same |
12/07/2011 | EP1579463B1 Method for increasing the copper to superconductor ratio in a superconductor wire |
12/07/2011 | CN202064018U 一种改进的半导体引线框架中圆盘电镀结构 An improved semiconductor lead frame plating disc structure |
12/07/2011 | CN102272416A 不粘设备 Non-stick device |
12/07/2011 | CN102268719A 直立式电镀设备及其电镀方法 Vertical plating and electroplating equipment |
12/07/2011 | CN102268717A 一种金刚石丝锯的上砂方法 A line of diamond wire saw on the sand method |
12/07/2011 | CN102268706A 制备ZnO/Cu<sub>2</sub>O异质结材料及ZnO/Cu<sub>2</sub>O三维结构异质结太阳电池的方法 Preparation of ZnO / Cu <sub> 2 </ sub> O heterojunction materials and ZnO / Cu <sub> 2 </ sub> O three-dimensional structure of heterojunction solar cell method |
12/07/2011 | CN101942685B 芯棒工件电镀轨道拖车 Electroplating track piece mandrel trailer |
12/07/2011 | CN101316960B 金属帘线、橡胶帘线的复合物及使用该复合物的充气轮胎 Metal cords, rubber cords compound and use of the composite pneumatic tire |
12/01/2011 | US20110293926 Lead frame for optical semiconductor devices, method of producing the same, and optical semiconductor device |
11/30/2011 | CN202054913U 可焊性镀锡铝合金带 Weldability of aluminum alloy with tin |
11/30/2011 | CN202054912U 一种全自动凹版电镀生产线系统 A fully automated electroplating production line gravure system |
11/30/2011 | CN102265712A 电子电路的形成方法 The method of forming an electronic circuit |
11/30/2011 | CN102265711A 电子电路用的压延铜箔或电解铜箔及使用它们形成电子电路的方法 Rolled copper foil or an electrolytic copper foil using an electronic circuit and a method which form an electronic circuit |
11/30/2011 | CN102265710A 电子电路用的压延铜箔或电解铜箔及使用它们形成电子电路的方法 Rolled copper foil or an electrolytic copper foil and the use of electronic circuits forming an electronic circuit are a method |
11/30/2011 | CN102264951A 电子电路用的压延铜箔或电解铜箔及使用它们形成电子电路的方法 Rolled copper foil or an electrolytic copper foil using an electronic circuit and a method which form an electronic circuit |
11/30/2011 | CN101871110B 电镀铜方法 Copper plating method |
11/30/2011 | CN101570876B 用于钻头电镀的电镀设备、电镀方法 Plating equipment for drill electroplating, plating method |
11/24/2011 | WO2011145647A1 Electrolytically silver plated and/or electrolytically silver alloy plated article having oxide layer on surface |
11/24/2011 | WO2011145033A1 A method and a system for anodising a profiled section made of aluminium or alloys thereof |
11/24/2011 | US20110287339 Fuel cell and method of manufacturing the same |
11/24/2011 | US20110287318 Multidimensional electrochemically active structures for battery electrodes |
11/24/2011 | US20110284383 Sealed anodic coatings |
11/24/2011 | US20110284382 Printed circuit board and method of manufacturing the same |
11/23/2011 | CN202047164U Herringbone cover plate of processor |
11/23/2011 | CN202047162U Piston rod electroplating connection shielding sleeve |
11/23/2011 | CN202047156U Liquid feeding device for coarse foil machine |
11/23/2011 | CN202047155U Device for moisturizing strip steel in electroplating tank through gravity method |
11/23/2011 | CN202047154U Monomer spray plating device for power battery housing |
11/23/2011 | CN102256440A Aluminum based circuit board, manufacturing method thereof and electroplate liquid used by method |
11/23/2011 | CN102254842A Activation treatments in plating processes |
11/22/2011 | US8062765 Silver layer formed by electrosilvering substrate material |
11/22/2011 | US8062496 Electroplating method and apparatus |
11/22/2011 | US8062471 Proximity head heating method and apparatus |
11/17/2011 | WO2011142338A1 Method of manufacturing aluminum structure, and aluminum structure |
11/17/2011 | US20110278770 Mold, mold manufacturing method and method for manufacturing anti-reflection film using the mold |
11/17/2011 | CA2784182A1 Method for producing aluminum structural body and aluminum stuctural body |
11/16/2011 | EP2229470B1 Method for obtaining a metal microstructure and microstructure obtained according to said method |
11/16/2011 | CN202039147U Tool clamp of electroplated flat plate with handle |
11/16/2011 | CN202039146U Tool fixture for electroplating bowl-shaped grinding wheel |
11/16/2011 | CN202039145U Steel wire electroplating residual liquid removing device |
11/16/2011 | CN202039144U Improved electroplating line for circuit boards |
11/16/2011 | CN202039143U Tool fixture for automatically manufacturing grinding head |
11/16/2011 | CN202039142U Working fixture for electroplating perforated gear disc |
11/16/2011 | CN202039140U Coating film for electrolytic coating of surrounding area on surface of cylindrical body |
11/16/2011 | CN102245805A Two-layer flexible copper-clad laminate substrate and process for producing same |
11/16/2011 | CN102242385A Clean and environment-friendly iron wires galvanizing apparatus and its technology |
11/16/2011 | CN102242383A Post-processing method for electroplating of solar welding strip |
11/16/2011 | CN101812711B Plating apparatus |
11/16/2011 | CN101796223B Web treatment method, treatment bath, continuous electrolytic plating apparatus and method for manufacturing plastic film having plated film |
11/15/2011 | US8057654 Electrodeposition of dielectric coatings on semiconductive substrates |
11/10/2011 | WO2011138876A1 Copper foil for printed circuit |