Patents for C25D 7 - Electroplating characterised by the article coated (12,170)
02/2012
02/16/2012WO2012020947A2 Wire tool
02/16/2012US20120040246 Fiber Electrode for Lithium Secondary Battery, Fabrication Method Therefor, and Lithium Secondary Battery Including Fiber Electrode
02/16/2012US20120038439 Laminate Stack Comprising Individual Soft Magnetic Sheets, Electromagnetic Actuator, Process for Their Manufacture and Use of a Soft Magnetic Laminate Stack
02/16/2012US20120037509 Method of electrochemical machining of materials
02/15/2012EP2418495A1 Spring wire, contact probe, and probe unit
02/15/2012EP2417285A1 Composition for metal plating comprising suppressing agent for void free submicron feature filling
02/15/2012EP2417284A1 Composition for metal plating comprising suppressing agent for void free submicron feature filling
02/15/2012EP2417283A1 Composition for metal plating comprising suppressing agent for void free submicron feature filling
02/15/2012CN202144521U 电镀电路板用的电镀治具 Plated circuit board plating fixture
02/15/2012CN102354577A Method for making aluminum alloy wire
02/15/2012CN101821431B 连接器制造方法和通过该方法制造的连接器 Connector manufacturing methods and connectors manufactured by the method of
02/15/2012CN101353810B 用于对半导体晶片执行清洗的方法及装置 The method of implementation of the semiconductor wafer cleaning and apparatus for
02/09/2012WO2012016937A1 Bearing arrangement and method for producing a bearing outer ring or bearing inner ring with a friction-increasing coating
02/09/2012WO2011047875A3 Method for the light-induced, galvanic pulsed deposition for forming a seed layer for a metal contact of a solar cell and for the subsequent reinforcement of said seed layer or said metal contact and arrangement for carrying out the method
02/09/2012US20120031768 Process for through silicon via filling
02/09/2012US20120031765 Process for the enhanced corrosion protection of valve metals
02/09/2012US20120031764 Microcrystalline-to-amorphous gold alloy and plated film, and plating solution for those, and plated film formation method
02/09/2012US20120031656 Substrate for printed wiring board, printed wiring board, and methods for producing same
02/09/2012DE102011109295A1 Providing semiconductor chip package with solder wettable plating, comprises separating chip package, immersing in bath, contacting connecting contact pad with conductive contact material connected to cathode electrical, and plating
02/09/2012DE102009038674B4 Trägervorrichtung, Anordnung mit einer solchen Trägervorrichtung sowie Verfahren zur Herstellung eines mindestens eine keramische Schicht umfassenden struktururierten Schichtstapels A carrier device, carrier device comprising such a device and method for producing a ceramic layer at least comprising a layer stack struktururierten
02/08/2012EP2415908A1 Connection assembly and method for producing a connection element in the form of a casing
02/08/2012CN202139317U 连续电镀的挤压式悬挂定位及导电装置 Continuous plating squeeze suspension positioning and conductive means
02/08/2012CN202139312U 连续电镀的挡水装置 Continuous plating retaining device
02/08/2012CN202139308U 挠性覆铜板电镀装置 FCCL plating apparatus
02/08/2012CN202139307U 连续电镀的立式吸水装置 Vertical suction device for continuous electroplating
02/08/2012CN202139290U 一种用于沉没辊系的加热装置 A sinking heating device for roll system
02/08/2012CN102348835A Two-layered flexible substrate, and copper electrolyte for producing same
02/08/2012CN102345147A Rotary support chrome-plating device on surface of roller
02/08/2012CN102345146A Novel cold-rolled steel sheet
02/08/2012CN102041546B 一种半导体封装产品电镀挂架系统 A semiconductor package products Plating Rack System
02/07/2012US8110076 Apparatus and foam electroplating process
02/02/2012WO2012015139A1 Production method for a plate heat exchanger
02/02/2012WO2012014029A1 Process for electrodeposition of copper chip to chip, chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv) with heated substrate and cooled electrolyte
02/02/2012US20120029585 Implantable Electrode
02/02/2012US20120027926 Reference electrode, its manufacturing method, and an electrochemical cell
02/02/2012US20120024710 Metal Treatment to Form a Surface Layer
02/01/2012EP2412848A1 Method for producing a sheet metal part from a high tensile sheet metal material with a zinc-nickel coating applied by means of electrolysis
02/01/2012EP2412520A1 Metal foil with electric resistance film and production method therefor
02/01/2012EP2411568A1 Device and method to conduct an electrochemical reaction on a surface of a semiconductor substrate
02/01/2012CN202131275U 抛光磨料 Polishing abrasive
02/01/2012CN101899692B 一种行波管用螺旋线化学镀铜方法 An effective method for electroless copper helix traveling wave
02/01/2012CN101787556B 一种电解池 An electrolytic cell
01/2012
01/31/2012US8105692 Process equipment wear surfaces of extended resistance and methods for their manufacture
01/26/2012US20120021248 Synthesis of nanopeapods by galvanic displacement of segmented nanowires
01/26/2012US20120021218 Electrically conductive metal-coated fibers, continuous process for preparation thereof, and use thereof
01/25/2012EP1461815B1 Material deposition from a liquefied gas solution
01/25/2012CN202124669U Electroplating bath for producing diamond wire saws
01/25/2012CN202124667U Brass electroplating production line
01/25/2012CN102332439A Copper-based bonding wire with anti-oxidation coating and processing technology thereof
01/25/2012CN102330129A Tin plating process of aluminum base bearing bush
01/25/2012CN102326997A Electric mirror
01/25/2012CN101061259B Device and method for electrolytically treating work pieces
01/24/2012US8102014 Proximity head heating method and apparatus
01/24/2012US8101285 Metallic material for a connecting part and a method of producing the same
01/24/2012US8101050 System, method, and apparatus for continuous electroplating of elongated workpieces
01/19/2012WO2012008120A1 Method for manufacturing metal grid, and metal grid
01/19/2012WO2012008119A1 Manufacturing method for metal lattice, and metal lattice
01/19/2012WO2012008118A1 Manufacturing method for metallic lattice, and metallic lattice
01/19/2012WO2012007525A1 Method for rinsing and/or drying an ecpr chamber, and chucks and chuck assemblies therefore
01/19/2012WO2012007524A1 Filling of a printing chamber and a chuck therefore
01/19/2012WO2012007523A1 Leveling of master electrode and substrate in ecpr, and a chuck therefor
01/19/2012WO2012007521A1 A contact sheet for arrangement between a chuck and a master electrode in an ecpr process
01/19/2012WO2012007520A1 A chuck, and a method for bringing a first and a second substrate together
01/19/2012WO2012007191A1 System for automated handling of masters and substrate
01/19/2012WO2011012462A3 Composition for metal plating comprising suppressing agent for void free submicron feature filling
01/19/2012US20120015205 Surface Finishing Process for Indirect or Offset Printing Components
01/19/2012US20120015138 Modified surface material, method for preparing same and uses thereof
01/18/2012CN202116682U Circulating system of push-in type plating electrolyte cell for long shafts
01/18/2012CN102321899A Device for plating nickel and gold on crystal grains
01/18/2012CN102321898A Equipment for solving problem of too small thickness of galvanized coating in in-line type light-emitting diode (LED) support cup
01/17/2012US8097143 Plating method, light-transmitting electrically-conductive film and light-transmitting electromagnetic wave shield film
01/12/2012WO2012005355A1 Copper-clad steel foil, anode collector, method for producing same, and battery
01/12/2012WO2012005112A1 Separator material for fuel cell, and separator for fuel cell and fuel cell stack each comprising same
01/12/2012US20120006687 Method of forming cigs thin film
01/12/2012CA2804774A1 Fuel cell separator material, and fuel cell stack using the same
01/11/2012EP1975309B1 Rubber/cord composite and pneumatic tire using the same
01/11/2012EP1967645B1 Metallic cord, rubber/cord composite object, and pneumatic tire obtained using the same
01/11/2012CN202107788U Rotary drum of electroplating device for chip diode
01/11/2012CN202107785U Clean and environment-friendly iron wire galvanizing device
01/11/2012CN202107784U Steel wire copper plating production line for electronic element
01/11/2012CN1764745B Composite chromium plating film and sliding member having the same and method for manufacture thereof
01/11/2012CN102318041A Process for electrodeposition of copper chip to chip, chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv)
01/11/2012CN102317510A Metal foil, method for producing same, insulating substrate, and wiring board
01/11/2012CN102317509A Continuous electrolytic surface finishing of bars
01/11/2012CN102317508A Microcrystalline-to-amorphous gold alloy and plated film, and plating solution for those, and plated film formation method
01/11/2012CN102317483A Cu-Zn-Sn alloy plate and tin-plated Cu-Zn-Sn alloy strip
01/11/2012CN101845651B Preparation method of cadmium oxide micro-nanometer ordered structural material
01/11/2012CN101817128B Preparation method of aluminum-based brazing filler metal with low melting point
01/10/2012CA2417852C A plating method and apparatus
01/05/2012US20120003839 Chemical treatment method
01/05/2012US20120000785 Device and method to conduct an electrochemical reaction on a surface of a semi-conductor substrate
01/04/2012CN202099401U Anode device for electroplating copper covered steel
01/04/2012CN202099396U Copper-clad steel wire electroplating and manufacturing device
01/04/2012CN1894442B Method and apparatus for fluid processing a workpiece
01/04/2012CN102304747A Process for producing high-power light emitting diode (LED) substrate
01/04/2012CN102304736A Galvanized bath for steel band galvanizing production line
01/04/2012CN101871113B Electrochemical preparation method of electrodeposited silver iodide semiconductor film
01/03/2012CA2662464C Magnetic alloy plating apparatus
12/2011
12/29/2011WO2011162126A1 Electrode for electric storage device, method for manufacturing the electrode, and method for connecting the electrode
12/29/2011US20110318497 Hoistway sheave resurfacing
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