Patents for C25D 3 - Electroplating; Baths therefor (11,896)
01/2010
01/27/2010CN100585019C Cyanogens-free electroplating solution for plating silver
01/21/2010WO2010009225A1 Cyanide free electrolyte composition for the galvanic deposition of a copper layer
01/20/2010CN101629313A Double-pulse plating silver solution and technique thereof
01/20/2010CN101629312A Method for electrodepositing lead by ionic liquid system
01/20/2010CN101629311A Trivalent chromeplating process and plating solution thereof
01/20/2010CN100582316C Method for preparing stable and dispersed composite plating solution used for carbon nanotube electro brush plating
01/19/2010US7648621 Copper electroplating method, pure copper anode for copper electroplating, and semiconductor wafer plated thereby with little particle adhesion
01/14/2010WO2010006045A1 Electrolyte and method for deposition of matte metal layer
01/14/2010WO2010005983A2 Property modulated materials and methods of making the same
01/14/2010WO2010005773A1 Underpotential deposition-mediated layer-by-layer growth of thin films
01/14/2010WO2010005168A2 Composite of cobalt-nickel-iron ternary alloy thin film for magnet-inductive nondestructive sensor
01/14/2010WO2010005088A1 Electronic component and method for manufacturing the same
01/14/2010WO2010003621A1 Improved copper-tin electrolyte and process for the deposition of bronze layers
01/14/2010WO2009077146A3 Galvanic bath, method for galvanic deposition, and use of a bipolar membrane for separating in a galvanic bath
01/14/2010US20100006445 Electroplating method and apparatus
01/14/2010US20100006442 Process for application of a metal layer on a substrate
01/14/2010DE102008032398A1 Verbesserter Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten Improved copper-tin electrolyte and process for the deposition of bronze layers
01/14/2010CA2730229A1 Property modulated materials and methods of making the same
01/13/2010EP2143828A1 Electrolyte and method for the deposition of a matt metal layer
01/13/2010EP2142685A1 Barrier layer and method for making the same
01/13/2010EP2142678A1 AMORPHOUS Fe100-a-bPaMb ALLOY FOIL AND METHOD FOR ITS PREPARATION
01/13/2010CN101627150A Cyanide-free electrolyte composition, and method for the deposition of silver or silver alloy layers on substrates
01/13/2010CN101624714A Cu-Sn-Zn plating solution containing organic addition agent and electroplating technique utilizing same
01/13/2010CN101624713A Aluminum electrolysis visual production information system
01/13/2010CN100580151C Sn crystal flower induced electrodeposition plaque-imitating copper crystal flower surface finishing process
01/13/2010CN100580142C Method for electrically plating Ti-Cu-Zn ternary alloy meeting three-prevention demand
01/12/2010US7645371 Process of ceramic coating for silver or silver plated
01/07/2010WO2010001208A2 Plated member and method of forming plating layer
01/07/2010US20100003475 Metal Films, Methods for Production Thereof, Methods for Production of Laminated Electronic Components, and Laminated Electronic Components
01/07/2010US20100000873 Electrolytic tin plating solution and electrolytic tin plating method
01/07/2010US20100000871 Copper anode with a purity of 99.9-99.9999 wt % excluding gas components, and a crystal grain diameter of 100-2000 mu m.; generation of sludge in a copper sulfate bath is inhibited
01/06/2010EP2141261A2 Electrolytic Tin Plating Solution and Electrolytic Tin Plating Method
01/06/2010EP2141125A1 Chromium hydroxide, method for producing the same, trivalent chromium-containing solution using the same, and chromium plating method
01/06/2010CN101622379A Copper-tin electrolyte and method for depositing bronze layers
01/06/2010CN101619471A Method for producing copper clad aluminum busbar by electrolysis process
01/06/2010CN101619470A 电解锡镀液及电解锡电镀法 Electrolytic tin plating and electrolytic tin plating
01/06/2010CN101619469A Crust-hitting hammer head for aluminum reduction cell and casting technique thereof
01/06/2010CN100577891C Anodic oxidation method for raising rigidity and corrosion resistance of plated aluminum on surface of metal base
01/06/2010CN100577889C Thin belt continuous casting crystal roller surface electroplating method and electroplate liquid thereof
01/06/2010CN100577284C Method for processing foamed aluminium load nano-titanium dioxide photocatalysis body
01/05/2010US7641783 Process for electroplating for producing an iron platinum magnetic material having an especially strong coercive force and excellent properties by using electroplating solution containing ionic iron, ionic platinum, and a complexing agent
01/05/2010US7641782 Method and apparatus for improving corrosion resistance of chrome plated material
01/05/2010US7641781 External currentless and electrolytic deposition of one of nickel, cobalt and platinum in a deposition bath in which metallic particles including at least one of magnesium, titanium, and zinc are suspended, the metallic particles becoming occluded in coating; bath includes suspended particles of silicon
12/2009
12/31/2009US20090321269 Silver and silver alloy plating bath
12/30/2009WO2009157768A2 Process for preparing a flexible substrate carrying a film of a transparent conductive oxide
12/30/2009WO2009156386A1 Component with a layer into which cnt (carbon nanotubes) are incorporated and a method for the manufacture of said component
12/30/2009WO2009135572A3 Modified copper-tin electrolyte and process for the deposition of bronze layers
12/30/2009EP2138607A1 Process for preparing a flexible substrate carrying a film of a transparent conductive oxide
12/30/2009CN101613865A Method of replenishing indium ions in indium electroplating compositions
12/30/2009CN100575561C Electroplating preparation method for copper cladded aluminum wire or copper cladded magnesium alloy wire
12/30/2009CN100575559C Nickel-phosphorus alloy electro-plating solution adding ytterbium and its use method
12/30/2009CA2729310A1 Component with a layer into which cnt (carbon nanotubes) are incorporated and a method for the manufacture of said component
12/23/2009WO2009152915A2 Copper electroplating method and device for carrying out a method of this type
12/23/2009CN201369325Y Flip chip component for the bonding process of gold-to-gold interconnection
12/23/2009CN201369324Y Flip chip component for the bonding process of gold-to-gold interconnection
12/23/2009CN101611176A Electroforming method and part or layer obtained using said method
12/23/2009CN101608326A Method for directly electroplating lead on surface of aluminium and aluminium alloy
12/23/2009CN101608324A Electroplating liquid and electroplating method using electroplating liquid
12/23/2009CN101608071A Polymer red dye and application of polymer red dye in acid copper plating process
12/23/2009CN101608070A Polymer blue dye and application of polymer blue dye in acid copper plating process
12/23/2009CN100572608C Surface coarsening method and surface coarsening liquid for copper foil
12/17/2009WO2009151124A1 Electrolytic copper coating and method of manufacture therefor, and copper electrolyte for manufacturing electrolytic copper coatings
12/17/2009WO2009150915A1 Electrolytic gold plating solution and gold film obtained using same
12/17/2009WO2009112714A3 Process for fabricating a silicon-based electrode, silicon-based electrode and lithium battery comprising such an electrode
12/17/2009US20090308756 Probe structure coaxial elongated electrical conductor projecting from a support surface, apparatus for use thereof and methods of fabrication thereof
12/17/2009US20090308435 Process for manufacturing solar cells
12/17/2009DE102009003778A1 Verfahren und Systeme zum In-Situ-Galvanisieren von Elektroden Methods and systems for in-situ plating of electrodes
12/16/2009CN101603186A Preparation method of daisy-like structure consisting of silver nano bands
12/16/2009CN100570015C Method of preparing tin-copper-nickel-cobalt alloy cathode material by two-step plating
12/16/2009CN100570014C Chrome plating component
12/16/2009CN100570013C Gold plating solution, and method for plating gold
12/10/2009WO2009146865A1 Pyrophosphate-containing bath for cyanide-free deposition of copper-tin alloys
12/10/2009WO2009146473A1 Process for producing nanostructured chromium layers on a substrate
12/10/2009US20090301886 Aluminum plated film, metallic member, and its fabrication method
12/10/2009CA2724211A1 Pyrophosphate-containing bath for cyanide-free deposition of copper-tin alloys
12/09/2009EP2130949A1 ELECTRIC Al-Zr ALLOY PLATING BATH USING ROOM TEMPERATURE MOLTEN SALT BATH AND PLATING METHOD USING THE SAME
12/09/2009EP2130948A1 Pyrophosphate-containing bath for cyanide-free electroplating of copper- tin alloys
12/09/2009CN201357598Y Magnesium-based hydrogen storage alloy
12/09/2009CN101600813A Amorphous Fe100-a-bPaMb alloy foil and method for its preparation
12/09/2009CN100567585C Technological process of double zinc electroplating during coiled steel plate continuous production
12/09/2009CN100567583C Method of directly electrodepositing zinc-nickel alloy on magnesium alloy surface
12/09/2009CN100567572C Gray surface treatment process for electrolytic copper foil
12/09/2009CN100567000C Five layers composite metal round net for printing and dyeing and method of preparing the same
12/09/2009CN100566914C Solid copper plating welding wires with excellent arc stability
12/08/2009US7628903 a soluble salt, having a silver salt or a mixture of a silver salt and a salt of a metal such as tin, bismuth, indium, lead, and (B) a particular aliphatic sulfide compound, such as thiobis(diethyleneglycol), dithiobis(triglycerol), 3,3'-thiodipropanol, thiodiglycerin; cyanide-free
12/03/2009WO2009145207A1 Copper-foil roughening treatment and copper foil for printed circuit boards obtained using said treatment
12/03/2009WO2009144973A1 Sn or sn alloy plated film, composite material having same and composite material production method
12/03/2009WO2009144036A1 Electroplating additive for the deposition of metal, a binary, ternary, quaternary or pentanary alloy of elements of group 11 (ib)-group 13 (iiia) -group 16 (via)
12/03/2009DE19800922B4 Galvanisierverfahren unter Anwendung eines Nickel- oder Nickellegierungs-Galvanisierbads Electroplating using a nickel or nickel alloy electroplating bath-
12/03/2009DE102009023124A1 Verfahren zur galvanischen Kupferbeschichtung und Vorrichtung zur Durchführung eines solchen Verfahrens Process for the galvanic copper plating and apparatus for performing such a method
12/02/2009EP2128903A1 Electroplating additive for the deposition of a metal, a binary, ternary, quaternary or pentanary alloy of elements of group 11 (IB)-group 13 (IIIA)-group 16 (VIA)
12/02/2009EP2128506A1 Screw joint for steel pipe
12/02/2009EP2126159A1 Sn-b plating solution and plating method using it
12/02/2009CN101595248A Sn-B plating solution and plating method using it
12/02/2009CN101593523A Method for preparing L10 type ultrahigh density magnetic record metal thin film
12/02/2009CN101591793A Electroplating technology of aluminium alloy sedan rotating wheel
12/02/2009CN101591781A Magnesium alloy surface processing technology
12/02/2009CN100564607C Method for electroplating double-layer zinc-nickel alloy on Nd-Fe-B magnetic surface
12/01/2009CA2240239C Tin coated electrical connector
11/2009
11/26/2009WO2009141551A2 Electroplating composition and process for coating a semiconductor substrate using said composition
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