Patents for C25D 3 - Electroplating; Baths therefor (11,896) |
---|
11/26/2009 | DE102004020058B4 Verfahren zum Abscheiden einer Schicht aus einer Formgedächtnislegierung A method of depositing a layer of a shape memory alloy |
11/26/2009 | DE10143076B4 Verfahren zur Herstellung eines Kupfergalvanisierungsmaterials und nach dem Verfahren erhältliches Kupfergalvanisierungsmaterial A method for producing a Kupfergalvanisierungsmaterials and obtainable by the method Kupfergalvanisierungsmaterial |
11/26/2009 | CA2721841A1 Electroplating composition and process for coating a semiconductor substrate using said composition |
11/25/2009 | EP2123799A2 Method of replenishing indium ions in indium electroplating compositions |
11/25/2009 | EP1446260B1 Method for manufacturing an article of manufacture for use in a fluxless brazing process. |
11/25/2009 | CN101586242A Pt-modified Ni3Al-based coating and preparation method thereof |
11/25/2009 | CN100562428C Thermal barrier coating and preparation method thereof |
11/24/2009 | US7622198 Decorative article having white coating and method for manufacture thereof |
11/19/2009 | WO2009139866A2 Coated articles and related methods |
11/19/2009 | WO2009139384A1 Copper‑zinc alloy electroplating bath and plating method using same |
11/19/2009 | WO2009118412A3 Method for electrochemical plating and marking of metals |
11/19/2009 | US20090283416 Method for treating the surface of an electrically conducting substrate surface |
11/19/2009 | US20090283415 Electroplating methods and chemistries for deposition of copper-indium-gallium containing thin films |
11/19/2009 | US20090283410 Coated articles and related methods |
11/19/2009 | DE112004001684B4 Kontaktlochmetallisierung und Herstellungsverfahren mit Seed-Reparatur tiefer Kontaktlöcher (Via) unter Verwendung stromloser Beschichtungschemie Kontaktlochmetallisierung and manufacturing processes with seed repair deep vias (Via) using electroless plating chemistry |
11/19/2009 | CA2725579A1 Coated articles and related methods |
11/18/2009 | EP2118343A2 Method of forming yttrium-modified platinum aluminide diffusion coating |
11/18/2009 | EP0839139B2 Hydrophobic ionic liquids |
11/18/2009 | CN101580955A Surface processing method for hydrogen storage alloy powder |
11/18/2009 | CN101580954A Composition used for plating rhenium and use method thereof |
11/18/2009 | CN101580953A Electroless copper plating solution composition and preparation method thereof |
11/18/2009 | CN101580952A Non-cyanide zinc-deposited solution and non-cyanide plating method of aluminum wheel boss using non-cyanide zinc-deposited solution |
11/18/2009 | CN101580951A Method for improving corrosion resistance of chromeplated product |
11/18/2009 | CN100560807C Method for manufacturing large area evenly distributed cuprum octahedron nanometer particle |
11/12/2009 | WO2009135572A2 Modified copper-tin electrolyte and process for the deposition of bronze layers |
11/12/2009 | WO2009135505A1 Pd and pd-ni electrolyte baths |
11/12/2009 | WO2009109171A3 Method for producing a multi-crystalline chromium layer as a substrate layer for the assembly of solar cells on a metal carrier |
11/12/2009 | WO2009019147A3 Deposition from ionic liquids |
11/11/2009 | EP2116634A1 Modified copper-tin electrolyte and method of depositing bronze layers |
11/11/2009 | CN101575720A Nickel-free ferrous tin-cobalt alloy plating solution and process for utilizing plating solution for electroplating |
11/11/2009 | CN101575719A Process for performing chromium plating with superconducting material |
11/11/2009 | CN101575694A Process for diffusing ruthenium on surface of molybdenum wafer with ultra-large diameter |
11/05/2009 | WO2009132861A2 Aqueous, acid bath and method for the electrolytic deposition of copper |
11/05/2009 | US20090272650 Apparatus and Method for Recovering Valuable Substance From Lithium Secondary Battery |
11/05/2009 | US20090272466 Ultrahigh-Purity Copper and Process for Producing the Same, and Bonding Wire Comprising Ultrahigh-Purity Copper |
11/04/2009 | EP2113587A1 Aqueous acidic bath and method for electroplating copper |
10/29/2009 | WO2009130450A1 Surface coatings |
10/29/2009 | US20090269642 Ion conducting polymer membranes |
10/29/2009 | US20090266599 Circuit board with high thermal conductivity and method for manufacturing the same |
10/28/2009 | EP2111484A1 Polyamine brightening agent |
10/28/2009 | CN101565840A Two-dimensional noble metal nanometer material and preparation method thereof |
10/28/2009 | CN101565839A Cyanogen to cyanogen-free alkali environment-friendly galvanizing brightener |
10/28/2009 | CN100554530C Rare earth magnet preparation method and plating bath |
10/28/2009 | CN100554528C Surface treatment method for electrolytic copper foil coating excellent in chemical resistance and cohesive force |
10/28/2009 | CN100554527C Electrolytic copper foil with low roughness surface and process for producing the same |
10/28/2009 | CN100554518C Ru-Ni-Al composite coating and method for making same |
10/27/2009 | US7608687 Releasable linkage and compositions containing same |
10/27/2009 | US7608356 Ion conducting polymer membranes |
10/21/2009 | EP2111087A2 Electroplating solution, method for fabricating multilayer printed wiring board using the solution, and multilayer printed wiring board |
10/21/2009 | CN201329683Y Nanometer-metal cutting tool for machining |
10/21/2009 | CN101563484A Process for providing aluminium cookware with a copper coating |
10/21/2009 | CN101563483A Liquid crystal templated deposition method |
10/21/2009 | CN101560678A Method for preparing solution of indium tetrafluo |
10/21/2009 | CN101560677A Method for preparing solution of tin methane sulfonate |
10/21/2009 | CN101560676A Method for electroforming hard gold product |
10/21/2009 | CN101560662A Method for performing neutral electronickelling following magnesium alloy chemical nickeling |
10/20/2009 | US7604727 Electroplating method for a semiconductor device |
10/20/2009 | US7604726 Platinum aluminide coating and method thereof |
10/20/2009 | CA2407157C Satin-finished nickel or nickel alloy coating |
10/15/2009 | WO2009089376A3 Highly electrically conductive surfaces for electrochemical applications |
10/14/2009 | EP2108717A1 Method of substrate surface treatment |
10/14/2009 | EP2108716A2 Method for Electroplating a plastic substrate |
10/14/2009 | CN201326025Y Hard chromium coat, substrate plated with hard chromium coat and friction system |
10/14/2009 | CN101556846A Technique for producing nickelplated mischmetal annealed copper wire |
10/14/2009 | CN101555611A Method for electroplating nickel on surface of magnesium alloy |
10/14/2009 | CN101555609A An environment-protective composition brightener for transformation between alkali non-cyanide galvanization and alkali cyanide galvanization |
10/14/2009 | CN101555608A Method for preparing nano materials by direct electrodeposit in ionic liquid microemulsion |
10/14/2009 | CN100549447C Sliding element |
10/08/2009 | WO2009124180A2 In situ plating and soldering of materials covered with a surface film |
10/08/2009 | WO2009121443A1 Structured chrome solid particle layer and method for the production thereof |
10/08/2009 | US20090250352 Methods for electroplating copper |
10/07/2009 | CN201321500Y Partial thick film oxidation device of large-area titanium plate surface |
10/07/2009 | CN101550805A Abrasion resistant drilling tool plated with diamond layer and manufacturing technology thereof |
10/07/2009 | CN101550577A Electroplating method of zinc-nickel alloy nano multilayer film |
10/07/2009 | CN101550576A Zinc-nickel alloy nano multilayer film |
10/07/2009 | CN101550573A Zinc-nickel alloy electrolyte |
10/07/2009 | CN101550572A Method for producing metal tungsten or tantalum platform graphite tube with permanent matrix modifier |
10/07/2009 | CN101550571A Electroplating solution containing gold for partly electroplating |
10/07/2009 | CN101550570A Non-cyanide electro cooper plating bath of EDTA system and use method thereof |
10/07/2009 | CN101550569A Non-cyanide alkaline copper plating bath, preparation and use method thereof |
10/07/2009 | CN101550568A Method for plating nano nickel layer on metal workpiece |
10/07/2009 | CN100547694C Zinc lanthanide sulfonic acid electrolytes |
10/07/2009 | CN100547120C Method for producing electroplating button of mobile phone |
10/07/2009 | CN100546916C Method for preparing non-crystalline nano composite material of nano titania of nickel, phosphor, chrome |
10/06/2009 | US7597787 Methods and apparatuses for electrochemical deposition |
10/01/2009 | US20090242418 Coating method and electrolyzing apparatus used therefor |
10/01/2009 | US20090242414 Electronchemical deposition of tantalum and/or copper in ionic liquids |
10/01/2009 | US20090242413 Electroplating Head and Method for Operating the Same |
10/01/2009 | US20090242236 Method of forming conductive tracks |
10/01/2009 | DE102005016819B4 Elektrolyt, Verfahren zur Abscheidung von Zinn-Wismut-Legierungsschichten und Verwendung des Elektrolyten Electrolyte, methods for deposition of tin-bismuth alloy layers, and use of the electrolyte |
09/30/2009 | CN101545127A Process for producing electronically-encapsulated metal cover plate |
09/30/2009 | CN101545125A Bright corrosion resisting zinc-iron alloy plating process |
09/30/2009 | CN101545124A Method for preparing bismuth nano wire array thermoelectric materials |
09/30/2009 | CN101545123A Method for non-cyanide copper electroplating of steel parts |
09/30/2009 | CN100545306C Copper plating solution and method for copper plating |
09/24/2009 | WO2009116432A1 Electrolytic solution for producing electrolytic copper foil |
09/24/2009 | WO2009116426A1 Electronic component and method for manufacturing the same |
09/24/2009 | WO2009028182A4 Chrome-plated part and manufacturing method of the same |
09/24/2009 | US20090236232 Electrolytic plating solution, electrolytic plating method, and method for manufacturing semiconductor device |
09/23/2009 | EP2103717A1 Pyrophosphate-based bath for depositing tin alloy layers |