Patents for C09K 13 - Etching, surface-brightening or pickling compositions (3,392)
06/2000
06/28/2000EP1014433A1 Dry etching gas
06/14/2000EP1009203A2 Methods for manufacture of electronic devices
06/02/2000WO2000031786A1 Etching solution, etched article and method for etched article
06/02/2000WO2000031785A1 Etching solution, etched article and method for etched article
05/2000
05/31/2000EP1003615A1 Method for passivation of a metallization layer
05/30/2000US6068787 Chemical mechanical polishing; mixture of catalyst and stabilizer
05/25/2000WO2000029646A1 Process for metallizing a plastic surface
05/25/2000CA2350422A1 Process for metallizing a plastic surface
05/18/2000WO2000028586A2 Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad
05/18/2000WO2000028585A1 Tungsten chemical-mechanical polishing process using a fixed abrasive polishing pad and a tungsten layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad
05/16/2000US6064081 Silicon-germanium-carbon compositions and processes thereof
05/10/2000CN1252398A Clearing bismuth-base metal oxide
05/04/2000WO2000024842A1 A chemical mechanical polishing slurry system having an activator solution
04/2000
04/18/2000US6051419 Genes which influence pichia proteolytic activity, and uses therefor
04/04/2000US6044851 Removal residues
03/2000
03/30/2000WO2000017281A1 Polishing liquid for polishing components, preferably wafers, especially for chemically-mechanically polishing components of this type
03/30/2000DE19842709A1 Polierflüssigkeit zum Polieren von Bauelementen, vorzugsweise Wafern, insbesondere zum Chemisch-Mechanischen Polieren derartiger Bauelemente Polishing liquid for polishing devices, preferably wafers, in particular for mechanical chemical polishing of such devices
03/29/2000EP0989597A1 A composition and method for selectively etching a silicon nitride film
03/23/2000DE19926599A1 Aqueous alkaline solution, especially for anisotropic etching of semiconductor materials e.g. silicon, contains a group five element or compound addition to achieve low surface roughness
03/21/2000US6039891 Polishing composition of urea, alumina, ammonium persulfate and succinic acid
03/15/2000CN1247486A Method for passivation of metallization layer
03/14/2000US6037265 Etching the conductive layer in a high density plasma comprising a halogen gas and carbon monoxide to produce a supports
03/02/2000WO2000011107A1 Ito etching composition
02/2000
02/22/2000US6027997 An electroconductive layer, e.g. tungsten, deposited in a plug opening is chemomechanical polished using slurry comprising abrasive and copper sulfate or copper perchlorate to form plug
02/08/2000US6022837 Method for rinsing a polished memory hard disk
01/2000
01/26/2000CN1242729A Composition and slurry useful for metal CMP
01/19/2000CN1241457A Method for cleaning PZT thin film
01/13/2000WO2000002238A1 Post etch cleaning composition and process for dual damascene system
01/05/2000EP0968979A1 Etching of Bi-based metal oxides ceramics
12/1999
12/30/1999DE19928570A1 Semiconductor device, especially a multilayer circuit structure, production process
12/15/1999CN1238812A Multi-oxidizer slurry for chemical mechanical polishing
12/08/1999EP0962964A1 Detergent for processes for producing semiconductor devices or producing liquid crystal devices
12/08/1999EP0698072B1 Process for metal cleaning
11/1999
11/30/1999US5993686 Fluoride additive containing chemical mechanical polishing slurry and method for use of same
11/24/1999CN1236482A Detergent for process for producing semiconductor device or producing liquid crystal device
11/23/1999US5990060 Cleaning liquid and cleaning method
11/23/1999US5989449 Composition and method for stripping tin and tin-lead from copper surfaces
11/18/1999DE19860780A1 Semiconductor device used in the manufacture of integrated circuits
11/03/1999EP0799495A4 Silicon-germanium-carbon compositions and processes thereof
11/02/1999US5976988 Etching material and etching method
11/02/1999US5976396 Method for etching
10/1999
10/26/1999US5972124 Method for cleaning a surface of a dielectric material
10/12/1999US5965779 Fluorooxetane compound and process for its preparation
10/05/1999US5961877 3.5-15.8 mole percent of hf; 0.2-9.7 mole percent of hno3; 34.8-82.6 mole percent of acetic acid; 12.3-46.5 mole percent of h2o; and wherein the molecular ratio of hno.sub.3 to hf is less than about 0.78.
09/1999
09/16/1999WO1999046353A1 Methods and apparatus for cleaning semiconductor substrates after polishing of copper film
09/16/1999CA2309583A1 Methods and apparatus for cleaning semiconductor substrates after polishing of copper film
09/01/1999CN1227279A Etching composition and use thereof
08/1999
08/31/1999US5944909 Heating an aqueous solution of nitric or hydrochloric acid and wetting agent
08/24/1999CA2059488C Method for cleaning or extracting hydrocarbon based substances
08/18/1999CN1225938A Gas for removing deposit and removal method using same
08/17/1999US5939336 Aqueous solutions of ammonium fluoride in propylene glycol and their use in the removal of etch residues from silicon substrates
08/17/1999CA2110297C Methods of fabricating dual anode, flat panel electrophoretic displays
08/12/1999WO1999040235A1 Method for etching
08/03/1999US5932024 Decoating titanium and other metallized glass surfaces
07/1999
07/27/1999US5928529 Composition and method for stripping tin and tin-lead from copper surfaces
07/21/1999CN1044264C Baths and method for chemically polishing stainless steel surfaces
07/13/1999US5922135 Method of removing residual wax from silicon wafer polishing plate
07/01/1999WO1999033094A1 Selective silicon oxide etchant formulation including fluoride salt, chelating agent and glycol solvent
06/1999
06/23/1999EP0924282A1 Gas for removing a deposit and its use
06/15/1999US5911907 Nitric acid, ferric nitrate, stabilizer consisting of a 4-amino-1,2,4-triazole, a 3-amino-5-methylisoxazole, a sulfanilamide, and a sulfamide, such which inhibits exothermic conditions, emission of toxic nox gas, and copper attack.
06/09/1999CN1218986A Etching method for poly crystalline silicon
06/08/1999US5909742 Metal cleaning method
05/1999
05/26/1999EP0918081A1 Etching composition and use
05/25/1999US5906708 Vapor depositing an etching-stop dielectric layer
05/12/1999EP0691676B1 Wet-etching composition for semiconductors excellent in wettability
05/05/1999CN1216059A Composition for cleaning and etching electronic display and substrate
04/1999
04/28/1999CN1215222A Etchant and method using same to making semiconductor device
04/27/1999US5897377 Semiconductor device manufacturing method with use of gas including acyl-group-containing compound
04/06/1999USRE36185 Citrate buffer, hydrogen peroxide
04/01/1999WO1999015287A1 Brightening systems for copper-base alloys
03/1999
03/16/1999US5882425 Semiconductor wafers with post etching residues removed by applying ammonium fluoride with carbon dioxide
03/16/1999CA2027402C Pretreating composition containing s-triazine compound
02/1999
02/11/1999WO1999007010A1 Detergent for processes for producing semiconductor devices or producing liquid crystal devices
02/10/1999EP0896042A1 A polishing composition including an inhibitor of tungsten etching
02/09/1999US5868855 Surface processing method and surface processing device for silicon substrates
02/04/1999WO1999005706A1 A polishing composition including an inhibitor of tungsten etching
01/1999
01/27/1999EP0892840A1 A composition for cleaning and etching electronic display and substrate
01/20/1999EP0733091A4 Wheel cleaning composition containing acid fluoride salts
01/05/1999US5855811 Cleaning composition containing tetraalkylammonium salt and use thereof in semiconductor fabrication
12/1998
12/30/1998EP0887323A1 Selective etching of silicate
12/30/1998CN1203205A Selective etching of silicate
12/23/1998CN1202892A Process for preparing bis-alkoxy-triazinyl-amino-containing stilbene disulphonic acids or their derivatives
12/01/1998US5843322 Process for etching N, P, N+ and P+ type slugs and wafers
12/01/1998US5842815 Chemical treatment of treading surfaces
11/1998
11/03/1998US5831053 Polypeptide
10/1998
10/20/1998US5824601 Hydrogen fluoride, sacrificial oxide
10/07/1998EP0640120B1 Etching compositions
09/1998
09/16/1998EP0863884A2 Process for preparing bis-alkoxy-triazinyl-amino-containing stilbene disulphonic acids or their derivatives
09/08/1998US5803956 Hydrofluoric acid and a hydrocarbon nonionic surfactant;etching, cleaning semiconductors
09/01/1998US5800577 Polishing composition for chemical mechanical polishing
08/1998
08/19/1998EP0858984A1 Method for improving the adherence on mineral surfaces which contain silicon
08/12/1998EP0857706A1 Compositions for the treatment of mineral surfaces containing silicon
07/1998
07/30/1998WO1998032546A1 Method for passivation of a metallization layer
07/23/1998WO1998031768A1 A composition for cleaning and etching electronic display and substrate
07/21/1998US5783495 Treating with hydrofluoric acid and alkylammonium hydroxide
07/16/1998WO1998030667A1 Semiconductor wafer cleaning composition and method with aqueous ammonium fluoride and amine
07/16/1998WO1998030652A1 Acid deoxidizing/etching composition and process suitable for vertical aluminum surfaces
07/16/1998CA2248568A1 Acid deoxidizing/etching composition and process suitable for vertical aluminum surfaces
07/15/1998EP0852615A1 Chemical mechanical polishing composition and process
07/08/1998CN1187021A Method for removing membrance coated on bulb for use of cathode ray tube
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