Patents
Patents for B24D 13 - Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor (4,710)
02/2002
02/06/2002EP1177860A1 Grinding tool
02/06/2002EP1177071A1 Grinding disc with backup pad
02/06/2002CN1078835C Buffing method and buffing apparatus
01/2002
01/31/2002WO2001074533A3 Methods for performing wafer preparation operations on vertically oriented semiconductor wafers
01/31/2002WO2001046006A3 Method for protecting underwater surfaces against pollution due to fouling, and brush and coating agent used therewith
01/31/2002US20020011168 Lithographic printing plate support and method of manufacturing the same
01/31/2002DE10104963C1 Grinding tool has supporting plate with outer flat annular disc with hooks for shape-locking adhesive fixing, annular stop along inner edge of annular disc with bearer latching protrusion
01/30/2002EP1175961A2 Method and apparatus for machining workpiece surfaces
01/24/2002WO2002006010A1 Polishing device
01/24/2002WO2002006009A1 Cleaning tool, method for making same
01/24/2002US20020009957 Coin cleaning apparatus
01/24/2002CA2385013A1 Polishing device
01/23/2002EP1173309A1 Abrasive flap disc
01/23/2002CN2472874Y Sun flower shape wheel for polishing
01/22/2002US6340325 Polishing pad grooving method and apparatus
01/17/2002US20020006770 Removable/disposable platen top
01/10/2002WO2002002279A2 Grooved polishing pads and methods of use
01/10/2002WO2002002278A1 Method of making a surface treating article and such a surface treating article
01/10/2002WO2002002274A2 Base-pad for a polishing pad
01/10/2002WO2002002269A1 Polishing pad grooving method and apparatus
01/10/2002US20020004365 Polishing pad for semiconductor and optical parts, and method for manufacturing the same
01/10/2002US20020004357 Self-leveling pads and methods relating thereto
01/10/2002CA2413803A1 Polishing pad grooving method and apparatus
01/09/2002CN1330581A 抛光垫及抛光装置 Polishing pad and polishing equipment
01/08/2002US6337281 Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like
01/08/2002US6336847 Method and apparatus for honing a chip saw
01/03/2002WO2002000391A1 Burr removal apparatus
01/03/2002US20020002026 Finishing element with finishing aids
01/02/2002CN1328921A Printing plate support for lithographic printing and producing method thereof
12/2001
12/27/2001US20010055939 Polishing pad with a partial adhesive coating
12/26/2001CN1076652C Tool for mechanically treating surface
12/26/2001CN1076651C Method for deburring itmes, particularly itmes of metal, and use of same
12/21/2001WO2001098027A1 A multi-zone grinding and/or polishing sheet
12/20/2001WO2001096062A1 Polishing pad with built-in optical sensor
12/20/2001US20010053658 Window portion with an adjusted rate of wear
12/20/2001US20010052391 Such as flap brushes, cleaning brushes, bonded wheels, bristle brushes; adhesive is expanded into and around a portion of each surface treating segment and hardened to provide a strong core/segment bond free of voids
12/18/2001US6331137 Polishing pad having open area which varies with distance from initial pad surface
12/18/2001US6331135 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives
12/13/2001WO2001036160A3 Consumable rotating disc for finishing material surfaces, comprising a base body consisting of an injection-moulded material, in particular plastic
12/13/2001WO1999062671A9 Apparatus for polishing silicon wafers
12/13/2001US20010050268 Polishing pad of a polyurethane of propane diol
12/13/2001EP1144161A3 Consumable rotating disc for finishing material surfaces, comprising a base body consisting of an injection-moulded material, in particular plastic
12/12/2001EP1162081A2 Lithographic printing plate support and method of manufacturing the same
12/12/2001EP1161322A1 Improved polishing pads and methods relating thereto
12/12/2001EP0912292B1 Method for manufacturing abrasive articles
12/11/2001US6328634 Finishing semiconductor wafer; provide pad, scruc semicomponent wafer with pad, evaluate surace of semiconductor
12/06/2001WO2001092620A1 Method of making nonwoven fabric for buffing applications
12/06/2001WO2001091972A1 Grooved polishing pads for chemical mechanical planarization
12/06/2001WO2001091971A1 Polishing pads for chemical mechanical planarization
12/06/2001WO2001091606A1 Universal cleaning and polishing pad
12/06/2001US20010049254 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates
12/06/2001CA2413780A1 Universal cleaning and polishing pad
12/04/2001US6325703 Polishing pads and methods relating thereto
12/04/2001US6325702 Method and apparatus for increasing chemical-mechanical-polishing selectivity
11/2001
11/29/2001US20010046834 Pad surface texture formed by solid phase droplets
11/28/2001CN1324287A Fan-like grinding wheel
11/27/2001US6322435 Rotary polishing discs and arbors therefor
11/27/2001US6321431 Process and device for removing oxide skin from metal strips
11/22/2001US20010044271 Fixed abrasive polishing pad
11/22/2001US20010044261 Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same
11/22/2001US20010044257 Methods for predicting polishing parameters of polishing pads, and methods and machines for planarizing microelectronic substrate assemblies in mechanical or chemical-mechanical planarization
11/22/2001US20010044006 Nonwoven buffing or polishing material having increased strength and dimensional stability
11/21/2001EP1154877A2 A polishing machine and method
11/20/2001CA2238718C Backing plates for abrasive disks
11/15/2001US20010041528 Abrasive brush
11/15/2001US20010041502 Work polishing method
11/14/2001EP1152865A1 Polishing pad and process for forming same
11/13/2001US6315645 Patterned polishing pad for use in chemical mechanical polishing of semiconductor wafers
11/08/2001US20010039175 Polishing pad surface on hollow posts
11/08/2001US20010039174 Rotary polishing discs and arbors therefor
11/08/2001US20010039163 Methods for predicting polishing parameters of polishing pads, and methods and machines for planarizing microelectronic substrate assemblies in mechanical or chemical-mechanical planarization
11/07/2001EP1150803A1 Method for making an abrasive article and abrasive articles thereof
11/07/2001EP0975460B1 Method for attaching a fastener to a surface treating article, and such an article having a fastener
11/06/2001US6312485 Method of manufacturing a foam buffing pad of string-like members
11/06/2001US6312325 Sanding disks
11/06/2001US6312323 Abrading tools and method of making
11/06/2001US6312321 Polishing apparatus
11/01/2001US20010036805 Forming a transparent window in a polishing pad for a chemical mehcanical polishing apparatus
11/01/2001US20010036798 Methods for chemical-mechanical polishing of semiconductor wafers
10/2001
10/31/2001EP0822768B1 Abrasive brush and filaments
10/31/2001CN1073912C Improved polishing pads and methods for their use
10/30/2001US6309292 Rotary tool for surface treatment
10/30/2001US6309291 Brush cutter
10/25/2001WO2001078946A1 Method for attaching a fastener to a surface treating member, and such an article having a fastener
10/23/2001US6306023 Grinding tool, specially for hand-held oscillating devices
10/23/2001US6306021 Polishing pad, polishing method, and polishing machine for mirror-polishing semiconductor wafers
10/18/2001WO2001076824A1 Sanding strip
10/18/2001US20010031610 Polishing pad with a transparent portion
10/17/2001EP1144161A2 Consumable rotating disc for finishing material surfaces, comprising a base body consisting of an injection-moulded material, in particular plastic
10/17/2001CN1072998C Polishing machine with improved polishing pad structure
10/16/2001US6302771 CMP pad conditioner arrangement and method therefor
10/11/2001WO2001074533A2 Methods for performing wafer preparation operations on vertically oriented semiconductor wafers
10/10/2001EP1142673A2 Grinding flap and Grinding disc having a plurality of such flaps
10/10/2001CN1316940A Polishing pad for semiconductor substrate
10/10/2001CN1316939A Polishing pad for semiconductor substrate
10/09/2001US6299519 Apparatus and method for removing a polishing pad from a platen
10/09/2001US6299518 Rotary abrasion device
10/09/2001US6298518 Heat dissipating buffing pad
10/04/2001WO2001072469A1 Surface finishing pad
10/04/2001EP1138440A2 Grinding tool and method of manufacturing the same
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